Abstract: Proposed is a method of forming a plasma-resistant coating film. The method includes (a) forming a lower coating layer on a target object by depositing a first rare-earth metal compound powder through a physical vapor deposition (PVD) process, (b) transferring a second rare-earth metal compound powder, and (c) forming an upper coating layer by spraying the transferred second rare-earth metal compound powder onto the lower coating layer, thereby obtaining a plasma-resistant coating film with fewer structural defects and enhanced physical properties.