Patents by Inventor Ki Soo Nam

Ki Soo Nam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240135255
    Abstract: Disclosed herein is an apparatus for processing a predictive spatiotemporal query based on synthetic data. The apparatus includes a query-processing unit for analyzing a predictive spatiotemporal query of a user and returning a processing result, a machine-learning unit for training a machine-learning model in response to a request from the query-processing unit and generating synthetic spatiotemporal data based on the machine-learning model, and a data storage unit for storing raw spatiotemporal data and the generated synthetic spatiotemporal data, and the raw spatiotemporal data may be stored in the form of a table including an identifier column and a position column.
    Type: Application
    Filed: October 19, 2023
    Publication date: April 25, 2024
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Tae-Whi LEE, Sung-Soo KIM, Choon-Seo PARK, Ki-Hyuk NAM, Taek-Yong NAM
  • Patent number: 11947104
    Abstract: A spiral phase plate, according to one embodiment, for generating a Laguerre Gaussian beam by reflecting an incident beam emitted from a light source, may comprise: a first quadrant area in which the step height increase rate per unit angle decreases progressively in one direction from the point with the lowest step height to the point with the highest step height; and a second quadrant area in which the step height increase rate per unit angle increases progressively in the one direction.
    Type: Grant
    Filed: September 9, 2020
    Date of Patent: April 2, 2024
    Assignees: KOREA BASIC SCIENCE INSTITUTE, INSTITUTE FOR BASIC SCIENCE, GWANGJU INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: I Jong Kim, Ji Yong Bae, Hong Seung Kim, Geon Hee Kim, Ki Soo Chang, Cheonha Jeon, Il Woo Choi, Chang Hee Nam
  • Patent number: 11201199
    Abstract: A chip on film package includes: a base substrate having an output pad region; a plurality of output pads disposed in the output pad region of the base substrate, wherein the output pads are arranged in a zigzag configuration on the base substrate; a plurality of output pad wirings connected to the output pads, respectively; and a protection layer disposed on the output pad wirings. The protection layer is disposed on the output pad wirings disposed between two adjacent output pads, arranged in a first direction.
    Type: Grant
    Filed: April 16, 2019
    Date of Patent: December 14, 2021
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Ki-Soo Nam, Gi Young Kang
  • Patent number: 11042065
    Abstract: A display device includes a display panel, a plurality of connection films covering an edge of the display panel, and a plurality of spacer members disposed on the display panel. Each of the spacer members includes first and second long sides extending in a first direction, and an outer line connecting the first and second long sides to each other. The outer line includes a plurality of lines extending in different directions. A first outer line of a first spacer member of the plurality of spacer members is adjacent to a second outer line of a second spacer member of the plurality of spacer members. A shape of the first outer line corresponds to a shape of the second outer line. A gap between the first outer line and the second outer line is aligned with at least one of the plurality of connection films.
    Type: Grant
    Filed: June 6, 2018
    Date of Patent: June 22, 2021
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Yongsu Jin, Ki-Soo Nam, Giyoung Kang, Jisang Seo
  • Patent number: 10925155
    Abstract: A printed circuit board includes: a first flexible base member; a first metal line disposed on the first flexible base member; a first plating line disposed on the first metal line and including a first connecting portion, a first interconnection portion extending from the first connecting portion, and a first bending portion extending from the first interconnection portion; a first protective layer covering the first interconnection portion and exposing the first connecting portion and the first bending portion; a connection part disposed on the first bending portion and connected to the first bending portion; a second protective layer extending from a side surface of the connection part; a second plating line disposed on the second protective layer; a second metal line disposed on the second plating line; and a second flexible base member disposed on the second metal line.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: February 16, 2021
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Munsik Choi, Ki-Soo Nam, Hanyul Yu
  • Publication number: 20200319393
    Abstract: An optical member including a light guide plate including an upper surface, a lower surface facing the upper surface, a first side surface disposed between the upper surface and the lower surface, a first inclined surface disposed between the upper surface and the first side surface, and a second inclined surface disposed between the lower surface and the first side surface, and a first reflective member including a first side portion covering the first side surface, a first folded portion extending from the first side portion to one side thereof and covering the first inclined surface, and a second folded portion extending from the first side portion to the other side thereof and covering the second inclined surface, in which the first reflective member includes a reflective layer having at least one curved surface.
    Type: Application
    Filed: February 6, 2020
    Publication date: October 8, 2020
    Inventors: Mun Sik CHOI, Gi Young Kang, Han Bum Kwon, Ki Soo Nam
  • Publication number: 20190319082
    Abstract: A chip on film package includes: a base substrate having an output pad region; a plurality of output pads disposed in the output pad region of the base substrate, wherein the output pads are arranged in a zigzag configuration on the base substrate; a plurality of output pad wirings connected to the output pads, respectively; and a protection layer disposed on the output pad wirings. The protection layer is disposed on the output pad wirings disposed between two adjacent output pads, arranged in a first direction.
    Type: Application
    Filed: April 16, 2019
    Publication date: October 17, 2019
    Inventors: Ki-Soo NAM, Gi Young KANG
  • Publication number: 20190101780
    Abstract: A display device includes a display panel, a plurality of connection films covering an edge of the display panel, and a plurality of spacer members disposed on the display panel. Each of the spacer members includes first and second long sides extending in a first direction, and an outer line connecting the first and second long sides to each other. The outer line includes a plurality of lines extending in different directions. A first outer line of a first spacer member of the plurality of spacer members is adjacent to a second outer line of a second spacer member of the plurality of spacer members. A shape of the first outer line corresponds to a shape of the second outer line. A gap between the first outer line and the second outer line is aligned with at least one of the plurality of connection films.
    Type: Application
    Filed: June 6, 2018
    Publication date: April 4, 2019
    Inventors: Yongsu Jin, Ki-soo Nam, Giyoung Kang, Jisang Seo
  • Patent number: 6100103
    Abstract: The present invention has been made in view of the above mentioned problem, and the present invention provides a highly integrated multicolor light emitting device which emits multiple colors in a chip by integrating light emitting devices of different colors, and in accordance with an aspect of the present invention, there is disclosed a light emitting device including: a plurality of light emitting elements formed on a substrate each of which comprises a plurality of semiconductor layers, wherein each of the plurality of light emitting elements radiates a light of different wavelength from one another.
    Type: Grant
    Filed: September 21, 1998
    Date of Patent: August 8, 2000
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Kyu Hwan Shim, Mun Cheol Baek, Hae Kwon Lee, Ki Soo Nam