Patents by Inventor Ki-Sub LIM

Ki-Sub LIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Probing method, probe card for performing the method, and probing apparatus including the probe card
    Patent number: 9599663
    Abstract: A probe method includes setting an allowable temperature range, the allowable temperature range including a test temperature and ensuring contact between a pad of a circuit substrate and a needle of a probe card, providing the probe card with a temperature within the allowable temperature range, contacting the needle of the probe card to the pad of the circuit substrate, and supplying a test current to the pad through the needle to test the circuit substrate.
    Type: Grant
    Filed: November 21, 2013
    Date of Patent: March 21, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang-Boo Kang, Ki-Sub Lim
  • PROBING METHOD, PROBE CARD FOR PERFORMING THE METHOD, AND PROBING APPARATUS INCLUDING THE PROBE CARD
    Publication number: 20140253154
    Abstract: A probe method includes setting an allowable temperature range, the allowable temperature range including a test temperature and ensuring contact between a pad of a circuit substrate and a needle of a probe card, providing the probe card with a temperature within the allowable temperature range, contacting the needle of the probe card to the pad of the circuit substrate, and supplying a test current to the pad through the needle to test the circuit substrate.
    Type: Application
    Filed: November 21, 2013
    Publication date: September 11, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang-Boo KANG, Ki-Sub LIM