Patents by Inventor Ki T. Ryu

Ki T. Ryu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6661083
    Abstract: A lead frame for a surface mount semiconductor chip package includes a die attach paddle and leads, the die attach paddle having down bond attachment sites on an upper surface of the paddle near a peripheral margin of the paddle, and having a central die attach region on an upper surface of the paddle, wherein a portion of the upper surface of the paddle is recessed. In some embodiments the recessed portion of the upper surface of the paddle includes the die attach region, and in other embodiments the recessed portion of the upper surface of the paddle includes a groove. Also, a lead frame surface mount chip package including such a lead frame.
    Type: Grant
    Filed: February 22, 2002
    Date of Patent: December 9, 2003
    Assignee: ChipPAC, Inc
    Inventors: Sang D. Lee, Flynn Carson, Ki T. Ryu, Koo H. Lee
  • Publication number: 20020163015
    Abstract: A lead frame for a surface mount semiconductor chip package includes a die attach paddle and leads, the die attach paddle having down bond attachment sites on an upper surface of the paddle near a peripheral margin of the paddle, and having a central die attach region on an upper surface of the paddle, wherein a portion of the upper surface of the paddle is recessed. In some embodiments the recessed portion of the upper surface of the paddle includes the die attach region, and in other embodiments the recessed portion of the upper surface of the paddle includes a groove. Also, a lead frame surface mount chip package including such a lead frame.
    Type: Application
    Filed: February 22, 2002
    Publication date: November 7, 2002
    Applicant: ChipPAC, Inc.
    Inventors: Sang D. Lee, Flynn Carson, Ki T. Ryu, Koo H. Lee