Patents by Inventor Ki W. Lee

Ki W. Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240143141
    Abstract: The present disclosure generally relates to underwater user interfaces.
    Type: Application
    Filed: January 5, 2024
    Publication date: May 2, 2024
    Inventors: Benjamin W. BYLENOK, Alan AN, Richard J. BLANCO, Andrew CHEN, Maxime CHEVRETON, Kyle B. CRUZ, Walton FONG, Ki Myung LEE, Sung Chang LEE, Cheng-I LIN, Kenneth H. MAHAN, Anya PRASITTHIPAYONG, Alyssa RAMDYAL, Eric SHI, Xuefeng WANG, Wei Guang WU
  • Patent number: 5550860
    Abstract: A synchronizer and phase aligning method that provide signal smoothing and filtering functions as well as slip-cycle compensation, and allow for multichannel digital phase alignment, bus deskewing, integration of multiple transceivers within a single semiconductor chip, etc. A delay line produces a plurality of delayed input replicas of an input signal. A clock phase adjuster produces a sampling clock signal from a reference clock signal. The sampling clock signal may be phase adjusted to be offset from the input signal. After certain smoothing and filtering functions, selection logic detects a phase relationship between the sampling clock signal and the input replicas and identifies a closely synchronized signal for output. Using this identified replica signal, slip-cycle compensation and retiming logic outputs a compensated data output signal synchronized with the reference clock signal. Also, an integrated multiple transceiver produced using the phase alignment technique is presented.
    Type: Grant
    Filed: April 11, 1995
    Date of Patent: August 27, 1996
    Assignee: International Business Machines Corporation
    Inventors: Christos J. Georgiou, Thor A. Larsen, Ki W. Lee
  • Patent number: 5533072
    Abstract: A synchronizer and phase aligning method that provide signal smoothing and filtering functions as well as slip-cycle compensation, and allow for multichannel digital phase alignment, bus deskewing, integration of multiple transceivers within a single semiconductor chip, etc. A delay line produces a plurality of delayed input replicas of an input signal. A clock phase adjuster produces a sampling clock signal from a reference clock signal. The sampling clock signal may be phase adjusted to be offset from the input signal. After certain smoothing and filtering functions, selection logic detects a phase relationship between the sampling clock signal and the input replicas and identifies a closely synchronized signal for output. Using this identified replica signal, slip-cycle compensation and retiming logic outputs a compensated data output signal synchronized with the reference clock signal. Also, an integrated multiple transceiver produced using the phase alignment technique is presented.
    Type: Grant
    Filed: November 12, 1993
    Date of Patent: July 2, 1996
    Assignee: International Business Machines Corporation
    Inventors: Christos J. Georgiou, Thor A. Larsen, Ki W. Lee
  • Patent number: 5523421
    Abstract: Disclosed herein is novel kojic acid derivatives represented by the following formula (I): ##STR1## wherein, R.sub.1 is a hydrogen atom or hydroxyl group; and R.sub.2 is a hydroxyl group, having a strong activity of inhibiting tyrosinase, which is involved in a melanin formation.The compounds of the present invention shows a stronger tyrosinase-inhibiting and radical scavenging activities, and has a low side effects to the human skin.
    Type: Grant
    Filed: November 14, 1994
    Date of Patent: June 4, 1996
    Assignee: Pacific Corporation
    Inventors: Chang M. Yang, Jong Y. Hong, Ki W. Lee, Byeong G. Lee, Dong I. Chang
  • Patent number: 5486624
    Abstract: Kojic acid derivatives of the following formula (I) ##STR1## where R is a hydrogen atom or methyl group, as radical scavengers and strong inhibitors of tyrosinase, an enzyme involved in a melanin formation.
    Type: Grant
    Filed: January 19, 1995
    Date of Patent: January 23, 1996
    Assignee: Pacific Corporation
    Inventors: Chang M. Yang, Jong Y. Hong, Ki W. Lee, Byeong G. Lee, Dong I. Chang
  • Patent number: 4934190
    Abstract: A silicon-based sensor includes a substrate, a sensor element, and a protective diaphragm mounting and covering the sensor element. The diaphragm is a silicon layer which, in a preferred embodiment, includes an etch-stop dopant. The etch-stop layer is sealed to the substrate so that the layer covers and mounts the sensor element to the substrate. The sensor is fabricated by forming a trough area in a surface of a silicon block (e.g., a silicon chip or wafer), treating the trough area with an etch-stop dopant (e.g., boron), depositing a sensor element onto the doped trough area, sealing at least the periphery of the doped trough area to a surface of a substrate (e.g., glass) so as to encapsulate the sensor element, and then etching away undoped regions of the silicon block so that the doped trough area remains as a protective diaphragm sealed to the substrate and covering the sensor element. It is also possible to form a bonding pad on untreated (e.g.
    Type: Grant
    Filed: February 16, 1989
    Date of Patent: June 19, 1990
    Assignee: Siemens-Bendix Automotive Electronics L.P.
    Inventor: Ki W. Lee
  • Patent number: 4888988
    Abstract: A mass airflow sensor is fabricated on a semiconductor substrate and which includes (1) a dielectric diaphragm, (2) p-etch-stopped silicon rim, (3) thin-film heating and temperature sensing elements, and (4) tapered chip edges. The dielectric diaphragm is formed with thin silicon oxide and silicon nitride in a sandwich structure and provides excellent thermal insulation for the sensing and heating elements of the sensor. The diaphragm dimensions, including thickness, are accurately controlled through the use of the heavily-p-doped silicon rim to help ensure uniform and reproducible sensor performance.
    Type: Grant
    Filed: December 23, 1987
    Date of Patent: December 26, 1989
    Assignee: Siemens-Bendix Automotive Electronics L.P.
    Inventors: Ki W. Lee, Il-Hyun Choi
  • Patent number: 4884443
    Abstract: A mass airflow sensor is disclosed which uses a small, thin dielectric diaphragm providing good thermal isolation for thin-film heating and temperature sensing elements, resulting in high flow sensitivity and low current operation of the heating element. The dielectric diaphragm is bounded by a p-etch-stopped silicon rim. The mass airflow sensor includes a primary sensor circuit which maintains a heated primary temperature sensing element and an ambient air temperature sensing element at a constant temperature difference. A slave sensor circuit, which includes a plurality temperature sensing elements, monitors heat loss due to airflow at a particular location on the diaphragm and generates an output signal indicative of airflow which is independent of ambient air temperature.
    Type: Grant
    Filed: December 23, 1987
    Date of Patent: December 5, 1989
    Assignee: Siemens-Bendix Automotive Electronics L. P.
    Inventors: Ki W. Lee, Charles R. Cook Jr.
  • Patent number: 4870745
    Abstract: A silicon-based sensor includes a substrate, a sensor element, and a protective diaphragm mounting and covering the sensor element. The diaphragm is a silicon layer which, in a preferred embodiment, includes an etch-stop dopant. The etch-stop layer is sealed to the substrate so that the layer covers and mounts the sensor element to the substrate. The sensor is fabricated by forming a trough area in a surface of a silicon block (e.g., a silicon chip or wafer), treating the trough area with an etch-stop dopant (e.g., boron), depositing a sensor element onto the doped trough area, sealing at least the periphery of the doped trough area to a surface of a substrate (e.g., glass) so as to encapsulate the sensor element, and then etching away undoped regions of the silicon block so that the doped trough area remains as a protective diaphragm sealed to the substrate and covering the sensor element. It is also possible to form a bonding pad on untreated (e.g.
    Type: Grant
    Filed: December 23, 1987
    Date of Patent: October 3, 1989
    Assignee: Siemens-Bendix Automotive Electronics L.P.
    Inventor: Ki W. Lee
  • Patent number: D306499
    Type: Grant
    Filed: January 4, 1988
    Date of Patent: March 6, 1990
    Assignee: Davidcraft Corporation
    Inventor: Ki W. Lee