Abstract: A printed circuit board for a high-speed semiconductor package uses bonding wires as a shield structure, e.g., to shield an open portion of signal transmission lines, and thereby reduce the likelihood of coupling noises, e.g., between signal transmission lines.

Abstract: A semiconductor package utilizing an existing substrate regardless of the change of the semiconductor chip design, and manufacturing method thereof are provided. The semiconductor package including an added wire bonding unit for connecting a redundant bond finger to an added bond finger, or an added wire bonding unit for connecting a redundant bond finger connected to a first printed circuit pattern to a redundant solder ball pad connected to a second printed circuit pattern.

Abstract: A linear channel select filter for an Intermediate Frequency selector of a satellite broadcasting tuner, linearly changes a desired frequency by adjusting an output current, and includes: a transconductance (GM) current cell controller for determining a control voltage according to a select signal, generating the output current according to an differential input voltage, linearly controlling the output current according to the control voltage, and providing a linearly variable resistance according to the linearly controlled output current, and a capacitor circuit coupled to the GM cell controller to provide a capacitance to generate a cutoff frequency voltage according to the output current and the variable resistance. An occupying area and a size of the filter are reduced.

Abstract: A printed circuit board for a high-speed semiconductor package uses bonding wires as a shield structure, e.g., to shield an open portion of signal transmission lines, and thereby reduce the likelihood of coupling noises, e.g., between signal transmission lines.

Abstract: In one embodiment, a circuit substrate strip includes molding blocks composed of a plurality of circuit substrate unit areas. An integrated circuit chip is attached onto each circuit substrate unit area and connected electrically thereto and a heat slug is attached thereon. Resin sealant is applied on the molding blocks by group molding and the cover of the heat slug is exposed out of the upper surface of the resin sealant. At each corner of the circuit substrate unit area, a supporter base is formed. Supporters extending downwards from the four corners of the cover are connected onto a supporter base. After formation of solder balls, the circuit substrate unit areas are separated into individual semiconductor packages by cutting the circuit substrate strip.

Abstract: A linear channel select filter having a simple structure is used for an IF selector of a satellite broadcasting tuner, linearly changes a desired frequency by adjusting an output current, and includes a GM current cell unit determining a control voltage according to a select signal, generating an output current according to an differential input voltage, linearly controlling the output current according to the control voltage, and providing a linearly variable resistance according to the linearly controlled output current, and a capacitor circuit coupled to the GM cell unit to provide a capacitance to generate a cutoff frequency voltage according to the output current and the variable resistance. An occupying area and a size of the filter is reduced.

Abstract: A semiconductor package utilizing an existing substrate regardless of the change of the semiconductor chip design, and manufacturing method thereof are provided. The semiconductor package including an added wire bonding unit for connecting a redundant bond finger to an added bond finger, or an added wire bonding unit for connecting a redundant bond finger connected to a first printed circuit pattern to a redundant solder ball pad connected to a second printed circuit pattern.

Abstract: A three dimensional stack package device that can realize vertical electrical interconnection of the stacked individual package devices without a cost increase or additional complicated processing steps.

Abstract: A stacked semiconductor multi-package including a plurality of individual semiconductor chip packages stacked over one another. The individual packages have a substrate provided with a plurality of bonding pads, electrode pads electrically connected to the bonding pads through wires, and chips attached to upper and lower surfaces of the substrate. A paddles lead frame is provided onto which the individual packages are attached to upper and lower surfaces thereof, and variants thereof. For these packages, since individual packages are mounted on upper and lower surfaces of a single printed circuit board or lead frame, the mounting density can be significantly increased and their production can be simplified.