Abstract: A copolymerized polyamide resin includes a polymer of a monomer mixture comprising a dicarboxylic acid component comprising adipic acid and a dicarboxylic acid represented by Formula 1, wherein each R1 is independently a C1 to C5 alkyl group and a is an integer from 0 to 4, and a diamine component comprising m-xylene diamine and a diamine represented by Formula 2, wherein A is a single bond or a C1 to C10 hydrocarbon group, R2 and R3 are each independently a C1 to C5 alkyl group, and b and c are each independently an integer from 0 to 4, wherein the copolymerized polyamide resin has a difference between a melting temperature (Tm) and a crystallization temperature (Tc) of about 50° C. or more. The copolymerized polyamide resin may have excellent heat resistance and reduced or no gel generation and yellowing phenomenon in a molding process.

Abstract: A copolymerized polyamide resin includes a polymer of a monomer mixture comprising a dicarboxylic acid component comprising adipic acid and a dicarboxylic acid represented by Formula 1, wherein each R1 is independently a C1 to C5 alkyl group and a is an integer from 0 to 4, and a diamine component comprising m-xylene diamine and a diamine represented by Formula 2, wherein A is a single bond or a C1 to C10 hydrocarbon group, R2 and R3 are each independently a C1 to C5 alkyl group, and b and c are each independently an integer from 0 to 4, wherein the copolymerized polyamide resin has a difference between a melting temperature (Tm) and a crystallization temperature (Tc) of about 50° C. or more. The copolymerized polyamide resin may have excellent heat resistance and reduced or no gel generation and yellowing phenomenon in a molding process.

Abstract: A continuous solid-state polymerization device according to the present invention comprises: a feeder for injecting a prepolymer continuously; a transverse reactor connected to the feeder via a first connector to receive the prepolymer from the feeder and to perform solid-state polymerization, the reactor itself rotating; and a chamber connected to the transverse reactor via a second connector to receive a polymer, which has been discharged from the transverse reactor, and solid-state polymerization of which has been completed, and to discharge the polymer, wherein the transverse reactor has a demolding coating film formed on the inner wall thereof, and the feeder, the transverse reactor and the chamber are in a vacuum state. The continuous solid-state polymerization device can prevent formation of an interval, in which the prepolymer stagnates, and can perform solid-state polymerization continuously in a vacuum state without using inert gas.

Abstract: A polyamide ester resin includes: a repeat unit derived from a dicarboxylic acid; a repeat unit derived from a diamine; and a repeat unit represented by the following Formula 1, wherein the polyamide ester resin has a melting temperature (Tm) of about 280° C. or more. The polyamide ester resin can exhibit excellent properties in terms of moisture absorption resistance, heat resistance, discoloration resistance, fluidity and the like by using a cyclic ester. wherein R1 is a C3 to C12 linear, branched or cyclic alkylene group.

Abstract: A crystalline polyamide ester resin is prepared by copolymerizing (A) a dicarboxylic acid component, (B) a diamine component, and (C) a cyclic aliphatic diol component, and has a structure in which a dicarboxylic acid moiety derived from the dicarboxylic acid component (A), a diamine moiety derived from the diamine component (B) and a cyclic aliphatic diol moiety derived from the cyclic aliphatic diol component (C) are repeated. A molar ratio ((B):(C)) of the diamine component (B) to the cyclic aliphatic diol component (C) is about 80 to about 99:about 1 to about 20. The crystalline polyamide ester resin has a melting point (Tm) ranging from about 280° C. to about 320° C. and a crystallization temperature (Tc) ranging from about 260° C. to about 290° C. The crystalline polyamide ester resin can have excellent heat resistance, discoloration resistance and moldability.

Abstract: The polyamide resin of the present invention is a polyamide resin containing an amine group and a carboxyl group, wherein the amine group concentration is about 200 to 300 ?eq/g and two to six times as high as the carboxyl group concentration. The polyamide resin has excellent long-thermal stability.

Abstract: A continuous solid-state polymerization device according to the present invention comprises: a feeder for injecting a prepolymer continuously; a transverse reactor connected to the feeder via a first connector to receive the prepolymer from the feeder and to perform solid-state polymerization, the reactor itself rotating; and a chamber connected to the transverse reactor via a second connector to receive a polymer, which has been discharged from the transverse reactor, and solid-state polymerization of which has been completed, and to discharge the polymer, wherein the transverse reactor has a demolding coating film formed on the inner wall thereof, and the feeder, the transverse reactor and the chamber are in a vacuum state. The continuous solid-state polymerization device can prevent formation of an interval, in which the prepolymer stagnates, and can perform solid-state polymerization continuously in a vacuum state without using inert gas.

Abstract: A polyamide ester resin is a polymer of: a dicarboxylic acid; a diamine; and a linear aliphatic diol, wherein, based on a total amount of the diamine and the linear aliphatic diol, the diamine is present in an amount of about 75 mol % to about 99 mol % and the linear aliphatic diol is present in an amount of about 1 mol % to about 25 mol %, and wherein the polyamide ester resin has a melting point (Tm) from about 280° C. to about 320° C. and a crystallization temperature (Tc) from about 260° C. to about 290° C. The polyamide ester resin can exhibit excellent heat resistance, discoloration resistance, and moldability.

Abstract: A polyamide resin is a polymer of an adipic acid-containing dicarboxylic acid component and an m-xylenediamine-containing diamine component, wherein the polymer includes about 100 ppm or less of phosphorus and about 100 ppm or less of sodium (Na), and has a gel content of about 0.5% or less as measured on a specimen prepared by melting about 10 g of the polymer at about 260° C., maintaining the molten polymer for about 30 minutes, and then cooling the molten polymer to room temperature. The polyamide resin can exhibit excellent heat resistance and can reduce or prevent gel generation upon polymerization or molding.

Abstract: A copolymerized polyamide resin includes a polymer of a monomer mixture comprising a dicarboxylic acid component comprising adipic acid and a dicarboxylic acid represented by Formula 1, wherein each R1 is independently a C1 to C5 alkyl group and a is an integer from 0 to 4, and a diamine component comprising m-xylene diamine and a diamine represented by Formula 2, wherein A is a single bond or a C1 to C10 hydrocarbon group, R2 and R3 are each independently a C1 to C5 alkyl group, and b and c are each independently an integer from 0 to 4, wherein the copolymerized polyamide resin has a difference between a melting temperature (Tm) and a crystallization temperature (Tc) of about 50° C. or more. The copolymerized polyamide resin may have excellent heat resistance and reduced or no gel generation and yellowing phenomenon in a molding process.

Abstract: A polyamide ester resin includes: a repeat unit derived from a dicarboxylic acid; a repeat unit derived from a diamine; and a repeat unit represented by the following Formula 1, wherein the polyamide ester resin has a melting temperature (Tm) of about 280° C. or more. The polyamide ester resin can exhibit excellent properties in terms of moisture absorption resistance, heat resistance, discoloration resistance, fluidity and the like by using a cyclic ester. wherein R1 is a C3 to C12 linear, branched or cyclic alkylene group.

Abstract: A copolymerized polyamide resin includes a polymer of a monomer mixture comprising a dicarboxylic acid component and a diamine component including about 4 mol % to about 20 mol % of an alicyclic diamine represented by the Formula 1, wherein the polyamide resin has a melting temperature (Tm) from about 280 to about 330° C. and a crystallization temperature (Tc) from about 250 to about 300° C.: wherein, R1 and R2 are the same or different and are each independently a C1 to C5 alkyl group or a C6 to C10 aryl group, X is a C1 to C10 hydrocarbon group, and m and n are the same or different and are each independently an integer from 0 to 4. The copolymerized polyamide resin can exhibit excellent properties, such as crystallinity, heat resistance, processability and discoloration resistance, and an excellent balance therebetween.

Abstract: The polyamide resin of the present invention is a polyamide resin containing an amine group and a carboxyl group, wherein the amine group concentration is about 200 to 300 ?eq/g and two to six times as high as the carboxyl group concentration. The polyamide resin has excellent long-thermal stability.

Abstract: Disclosed herein is a method of preparing prepolymer particles. The method includes injecting a prepolymer in a solution state by bottom-up type injection to form prepolymer particles by removing a solvent from the prepolymer in a solution state. The method can prepare prepolymer particles, which can be used in solid-state polymerization, using a bottom-up type flash process.

Abstract: A polyamide ester resin is a polymer of: a dicarboxylic acid; a diamine; and a linear aliphatic diol, wherein, based on a total amount of the diamine and the linear aliphatic diol, the diamine is present in an amount of about 75 mol % to about 99 mol % and the linear aliphatic diol is present in an amount of about 1 mol % to about 25 mol %, and wherein the polyamide ester resin has a melting point (Tm) from about 280° C. to about 320° C. and a crystallization temperature (Tc) from about 260° C. to about 290° C. The polyamide ester resin can exhibit excellent heat resistance, discoloration resistance, and moldability.

Abstract: The present invention relates to: a polyamide resin which is a copolymer of a mixture comprising (a1) one or more aliphatic diamine monomers selected from C4 to C10 aliphatic diamines, and (a2) one or more aliphatic diamine monomers selected from C11 to C18 aliphatic diamines, and a mixture comprising (b1) one or more aromatic dicarboxylic acid monomers selected from aromatic dicarboxylic acids, and (b2) one or more aliphatic dicarboxylic acid monomers selected from C4 to C14 aliphatic dicarboxylic acids, and has an amine and acid end group number greater than about 0 ?eq/g to about 150 ?eq/g; a preparation method thereof; and an article comprising the same.

Abstract: A crystalline polyamide ester resin is prepared by copolymerizing (A) a dicarboxylic acid component, (B) a diamine component, and (C) a cyclic aliphatic diol component, and has a structure in which a dicarboxylic acid moiety derived from the dicarboxylic acid component (A), a diamine moiety derived from the diamine component (B) and a cyclic aliphatic diol moiety derived from the cyclic aliphatic diol component (C) are repeated. A molar ratio ((B):(C)) of the diamine component (B) to the cyclic aliphatic diol component (C) is about 80 to about 99:about 1 to about 20. The crystalline polyamide ester resin has a melting point (Tm) ranging from about 280° C. to about 320° C. and a crystallization temperature (Tc) ranging from about 260° C. to about 290° C. The crystalline polyamide ester resin can have excellent heat resistance, discoloration resistance and moldability.

Abstract: A polyamide resin produced by polymerization of an aliphatic diamine monomer mixture (A) and polyester resin (B) is disclosed. The aliphatic diamine monomer mixture (A) includes an aliphatic diamine monomer (a1) having 2 to 6 carbon atoms, and an aliphatic diamine monomer (a2) having 6 to 12 carbon atoms, with the proviso that (a1) and (a2) are different and have a different number of carbon atoms. A method to produce the polyamide resin is also disclosed. The polyamide resin can have excellent heat resistance, low hygroscopic property and good color.