Abstract: Disclosed are a wafer etching system and a wafer etching process using same that enable thin wafers to be smoothly manufactured and transferred. The present invention includes: a wafer grinding device for mechanically etching wafers; an aligner for aligning etched wafers from the wafer grinding unit; a dry etching device for etching the wafers once more that are aligned by the aligner; a wafer transfer device for transferring the wafers between the aligner and the dry etching device; and a tape mounter for performing taping on the wafers that have completed etching from the dry etching device.

Abstract: A method of cutting a tempered glass substrate, which is capable of cut a tempered glass substrate without mechanical breaking process and cooling process , is disclosed. The method of cutting a tempered glass substrate, includes, forming an initial crack at a cut-starting point of the tempered glass substrate; forming a heated line at the tempered glass substrate by irradiating laser beam from a point different from the cut-starting point with the initial crack to the cut-starting point with the initial crack through optical heater; and automatically propagating the intimal crack along the heated line to cut the tempered glass substrate.

Abstract: A glass plate cutting machine using a laser beam is provided to solve problems, such as uneven glass section and slanting cutting. By using the glass plate cutting machine of the current invention, the glass plate is irradiated with a first carbon dioxide laser beam of 0.05-2 joule/mm2 on a long oval shaped area of 20-200 mm2 according to an expected cutting line thereof, and immediately cooled with water, to generate a scribe line, which is then further irradiated with a second carbon dioxide laser beam of 0.1-0.5 joule/mm? on the area of 20-200 mm2 thus obtaining a superior glass section.

Abstract: A glass plate cutting machine using a laser beam is provided to solve problems, such as uneven glass section and slanting cutting. By using the glass plate cutting machine of the current invention, the glass plate is irradiated with a first carbon dioxide laser beam of 0.05-2 joule/mm2 on a long oval shaped area of 20-200 mm2 according to an expected cutting line thereof, and immediately cooled with water, to generate a scribe line, which is then further irradiated with a second carbon dioxide laser beam of 0.1-0.5 joule/mm? on the area of 20-200 mm2 thus obtaining a superior glass section.