Abstract: A semiconductor wafer test system for controlling the supply of power to a semiconductor wafer test apparatus is provided. The semiconductor wafer test system includes a test operating server and the semiconductor wafer test apparatus. The test operating server manages a wafer test schedule and allocates lots to a prober, which loads wafers into the semiconductor wafer test apparatus, in accordance with the wafer test schedule. The test operating server sends a mode switch request to the semiconductor wafer test apparatus in accordance with the wafer test schedule, and the semiconductor wafer test apparatus is switched to a waiting mode in response to receipt of a request to switch to the waiting mode from the test operating server, and is switched to a ready mode in response to receipt of a request to switch to the ready mode from the test operating server.

Abstract: The present invention provides an epoxy resin composition comprising an epoxy resin, a curing agent, a coupling agent, a curing accelerator, and an adhesion promotor, the adhesion promotor comprising an imidazole-based compound having an average particle size of 0.1-5 ?m, and a semiconductor device comprising the same. The epoxy resin composition of the present invention has high adhesion to a different kind of material, such as copper, nickel, or silver, and thus, may satisfy a high level of reliability required for a semiconductor for a car, such as MSL or TCT.