Abstract: Provided is a substrate processing apparatus. The substrate processing apparatus includes a chamber in which a process with respect to a substrate is performed, a susceptor which is installed in the chamber and on which the substrate is placed, a plurality of lift pins passing through the susceptor to support the substrate, and a plurality of protection plugs protruding from a bottom surface of the susceptor to surround a portion of each of the lift pins protruding from the bottom surface of the susceptor.

Abstract: Disclosed an apparatus and a method for simultaneously providing a voice service and a data service in an electronic device. The electronic device includes: an antenna for transmitting or receiving one or more signals of a first signal corresponding to a first communication network and a second signal corresponding to a second communication network; a first communication control module for processing the first signal; a second communication control module for processing the second signal; and a divider for distributing the one or more signals received through the antenna to the first communication control module and the second communication control module.

Abstract: Disclosed an apparatus and a method for simultaneously providing a voice service and a data service in an electronic device. The electronic device includes: an antenna for transmitting or receiving one or more signals of a first signal corresponding to a first communication network and a second signal corresponding to a second communication network; a first communication control module for processing the first signal; a second communication control module for processing the second signal; and a divider for distributing the one or more signals received through the antenna to the first communication control module and the second communication control module.

Abstract: Disclosed an apparatus and a method for simutaneously providing a voice service and a data service in an electronic device. The electronic device includes: an antenna for transmitting or receiving one or more signals of a first signal corresponding to a first communication network and a second signal corresponding to a second communication network; a first communication control module for processing the first signal; a second communication control module for processing the second signal; and a divider for distributing the one or more signals received through the antenna to the first communication control module and the second communication control module.

Abstract: A capacitor of a semiconductor device is provided which includes a semiconductor substrate and insulating interlayer formed on the semiconductor substrate. The insulating interlayer has a contact hole which exposes a portion of the semiconductor substrate. A plug fills in the contact hole and the plug comes into contact with the semiconductor substrate. A contact layer is formed on the insulating interlayer. The contact layer comes into contact with the plug. First and second barrier layers are formed on the surface and sides of the contact layer, and a lower electrode is formed on the first barrier layer. A dielectric layer formed on the second barrier layer and lower electrode, and an upper electrode is formed on the dielectric layer.

Abstract: A method of fabricating a capacitor in semiconductor devices includes forming an insulating interlayer on a semiconductor substrate; forming a contact hole in the insulating interlayer to expose a portion of the semiconductor substrate; forming a plug in the contact hole to be in contact with the semiconductor substrate; forming an adhesive layer, a first barrier layer and a first lower electrode on the insulating interlayer successively; selectively removing portions of the adhesive layer, the first barrier layer and the first lower electrode to define exposed sides of the adhesive layer, the first barrier layer and the first lower electrode; forming a second barrier layer at sides of the adhesive layer; forming a second lower electrode at the sides of the first and second barrier layers; forming a dielectric layer on the first lower electrode and second lower electrode; and forming an upper electrode on the dielectric layer.

Abstract: The present invention relates to a capacitor for semiconductor devices which prevents the resistance between a lower electrode and a plug therein from increasing due to oxidation. The present invention includes a semiconductor substrate, an insulating interlayer (having an elevated region) on the semiconductor substrate wherein a contact hole is formed in the elevated region of the insulating interlayer, a plug filling up the contact hole so as to be in contact with the semiconductor substrate, an adhesive layer on the insulating interlayer and in contacted with the plug, a first barrier layer on a top surface of the adhesive layer and a second barrier layer at sides of the elevated region of the adhesive layer, a first lower electrode on the first barrier layer, a second lower electrode at sides of the first and second barrier layers and the insulating interlayer, a dielectric layer on the first and second lower electrodes, and an upper electrode on the dielectric layer.

Abstract: The present invention relates to a capacitor for semiconductor devices which prevents the resistance between a lower electrode and a plug therein from increasing due to oxidation. The present invention includes a semiconductor substrate, an insulating interlayer (having an elevated region) on the semiconductor substrate wherein a contact hole is formed in the elevated region of the insulating interlayer, a plug filling up the contact hole so as to be in contact with the semiconductor substrate, an adhesive layer on the insulating interlayer and in contacted with the plug, a first barrier layer on a top surface of the adhesive layer and a second barrier layer at sides of the elevated region of the adhesive layer, a first lower electrode on the first barrier layer, a second lower electrode at sides of the first and second barrier layers and the insulating interlayer, a dielectric layer on the first and second lower electrodes, and an upper electrode on the dielectric layer.

Abstract: A capacitor of a semiconductor device is provided which includes a semiconductor substrate and insulating interlayer formed on the semiconductor substrate. The insulating interlayer has a contact hole which exposes a portion of the semiconductor substrate. A plug fills in the contact hole and the plug comes into contact with the semiconductor substrate. A contact layer is formed on the insulating interlayer. The contact layer comes into contact with the plug. First and second barrier layers are formed on the surface and sides of the contact layer, and a lower electrode is formed on the first barrier layer. A dielectric layer formed on the second barrier layer and lower electrode, and an upper electrode is formed on the dielectric layer.

Abstract: A capacitor of a semiconductor device is provided which includes a semiconductor substrate, an insulating interlayer formed on the semiconductor substrate, the insulating interlayer having a contact hole which exposes a predetermined portion of the semiconductor substrate, a plug filled in the contact hole, the plug coming into contact with the semiconductor substrate, a contact layer formed on the insulating interlayer, the contact layer coming into contact with the plug, first and second barrier layers formed on the surface and sides of the contact layer, a lower electrode formed on the first barrier layer, a dielectric layer formed on the second barrier layer and lower electrode, and a upper electrode formed on the dielectric layer.

Abstract: Method for fabricating a nonvolatile ferroelectric memory, is disclosed, which can prolong a life time of the memory, including the steps of forming an insulating film on a semiconductor substrate, forming a bottom electrode on the insulating film, forming a ferroelectric film on the bottom electrode, wherein the ferroelectric film is formed of a material containing zirconium oxide as a base composition, the material having an antiferroelectric phase which can not be induced to a ferroelectric phase by an electric field, and the induced ferroelectric phase exhibiting a hysteresis in polarization-electric field characteristic and unable to be induced to an antiferroelectric phase by an electric field, and forming a top electrode on the ferroelectric film.

Abstract: An apparatus for forming a ultra-thin film of a semiconductor device includes: a reactive chamber consisting of an upper container and a lower container junctioned by an O-ring; a suscepter installed inside the reactive chamber for supporting a target substrate on which a ultra-thin film is to be formed; at least two gas supply pipes for respectively supplying at least two material gases into the reactive chamber to form a ultra-thin film on the substrate; gas supply controllers respectively installed at the gas supply pipes to repeatedly supply the material gases into the chamber; a gas outlet for discharging the gas from the chamber; remote plasma generators installed outside the reactive chamber and connected to the gas supply pipes for activating the material gases supplied through the gas supply pipes; and a temperature controller for controlling the temperature inside the chamber in a heat exchange method, the temperature controller being installed to surround the chamber.