Abstract: A method for fabricating a light emitting element includes preparing a substrate, and forming a first semiconductor material layer, a light emitting material layer, a second semiconductor material layer and an electrode material layer on the substrate, forming semiconductor rods spaced apart from each other by etching the first semiconductor material layer, the light emitting material layer, the second semiconductor material layer and the electrode material layer in a direction perpendicular to an upper surface of the substrate, forming an insulating layer surrounding sides of the semiconductor rods through a sol-gel process by immersing the substrate, including the semiconductor rods, in a solution containing a precursor material, and forming light emitting elements by separating the semiconductor rods, including the insulating layer, from the substrate, and the light emitting elements have an external quantum efficiency of 20.2±0.6%.

Abstract: A method of manufacturing a light-emitting element, and a light-emitting element array substrate and a display device including the same are provided. A method of manufacturing a light-emitting element includes: forming a base substrate including a plurality of protrusions and a rod area which is a remaining area except for the plurality of protrusions; forming a buffer layer on the base substrate; forming a semiconductor structure including a first semiconductor material layer, a light-emitting material layer, and a second semiconductor material layer on the buffer layer; forming a plurality of mask patterns overlapping the rod area on the semiconductor structure; forming element rods by removing the semiconductor structure overlapping the plurality of protrusions using the plurality of mask patterns; forming an insulating film around an outer surface of each of the element rods. and separating the element rods from the buffer layer.

Abstract: A method of measuring damage of an organic layer of a thin film encapsulation includes: preparing a thin film encapsulation structure in which an inorganic layer is stacked on an organic layer, in which a light-emitting material is mixed; irradiating light to the thin film encapsulation structure so that light is emitted from the light-emitting material, the intensity of light emitted from the light emitting material decreasing over time; detecting a light emission lifetime of the light emitted from the light emitting material; and determining a degree of damage to the organic layer based on the light emission lifetime. Accordingly, a degree of the damage to the organic layer due to plasma may be easily detected, and the damage to the organic layer may be minimized based on the detected degree of the damage by improving plasma process conditions for an operation of forming an inorganic layer.

Abstract: A method of measuring damage of an organic layer of a thin film encapsulation includes: preparing a thin film encapsulation structure in which an inorganic layer is stacked on an organic layer, in which a light-emitting material is mixed; irradiating light to the thin film encapsulation structure so that light is emitted from the light-emitting material, the intensity of light emitted from the light emitting material decreasing over time; detecting a light emission lifetime of the light emitted from the light emitting material; and determining a degree of damage to the organic layer based on the light emission lifetime. Accordingly, a degree of the damage to the organic layer due to plasma may be easily detected, and the damage to the organic layer may be minimized based on the detected degree of the damage by improving plasma process conditions for an operation of forming an inorganic layer.

Abstract: An apparatus for detecting a crystallizing stain includes a support unit, a crystallized substrate disposed on the support unit, a light source which irradiates polarized light in a predetermined wavelength range to a portion of the crystallized substrate, and a detector which detects the crystallizing stain in the portion of the crystallized substrate, to which the polarized light is irradiated.