Patents by Inventor Ki Yuen

Ki Yuen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250083411
    Abstract: Embodiments of a vehicle interior component and methods of forming the same are disclosed. The vehicle interior component includes a frame with a support surface and having an opening formed in the support surface. A glass substrate is provided that includes a first major surface, a second major surface facing the support surface, and a minor surface between the first and second major surfaces and defining a thickness of the glass substrate. An adhesive at least partially fills the opening and adheres the glass substrate to the frame. The adhesive in the opening acts to secure the glass substrate and adhesive to the frame.
    Type: Application
    Filed: November 26, 2024
    Publication date: March 13, 2025
    Inventors: Arlin Lee Weikel, Po Ki Yuen
  • Patent number: 12187022
    Abstract: Embodiments of a vehicle interior component and methods of forming the same are disclosed. The vehicle interior component includes a frame with a support surface and having an opening formed in the support surface. A glass substrate is provided that includes a first major surface, a second major surface facing the support surface, and a minor surface between the first and second major surfaces and defining a thickness of the glass substrate. An adhesive at least partially fills the opening and adheres the glass substrate to the frame. The adhesive in the opening acts to secure the glass substrate and adhesive to the frame.
    Type: Grant
    Filed: July 24, 2019
    Date of Patent: January 7, 2025
    Assignee: CORNING INCORPORATED
    Inventors: Arlin Lee Weikel, Po Ki Yuen
  • Patent number: 12103397
    Abstract: Embodiments of a vehicle interior system are disclosed. In one or more embodiments, the system includes a base with a curved surface, a cold-formed glass substrate with a thickness of 1.5 mm or less and a first radius of curvature of 500 mm or greater, and an adhesive between the curved surface and the glass substrate. Methods for forming such systems are also disclosed. The systems and methods include components and/or design modifications or methods for reducing stress in the adhesive.
    Type: Grant
    Filed: June 8, 2023
    Date of Patent: October 1, 2024
    Assignee: CORNING INCORPORATED
    Inventors: Atul Kumar, Jinfa Mou, Yawei Sun, Po Ki Yuen
  • Publication number: 20230311661
    Abstract: Embodiments of a vehicle interior system are disclosed. In one or more embodiments, the system includes a base with a curved surface, a cold-formed glass substrate with a thickness of 1.5 mm or less and a first radius of curvature of 500 mm or greater, and an adhesive between the curved surface and the glass substrate. Methods for forming such systems are also disclosed. The systems and methods include components and/or design modifications or methods for reducing stress in the adhesive.
    Type: Application
    Filed: June 8, 2023
    Publication date: October 5, 2023
    Inventors: Atul Kumar, Jinfa Mou, Yawei Sun, Po Ki Yuen
  • Patent number: 11745588
    Abstract: Embodiments of a vehicle interior system are disclosed. In one or more embodiments, the system includes a base with a curved surface, a cold-formed glass substrate with a thickness of 1.5 mm or less and a first radius of curvature of 500 mm or greater, and an adhesive between the curved surface and the glass substrate. Methods for forming such systems are also disclosed. The systems and methods include components and/or design modifications or methods for reducing stress in the adhesive.
    Type: Grant
    Filed: October 10, 2018
    Date of Patent: September 5, 2023
    Assignee: Corning Incorporated
    Inventors: Atul Kumar, Jinfa Mou, Yawei Sun, Po Ki Yuen
  • Publication number: 20220234447
    Abstract: A vehicle interior system having a first frame having a first end and a second end and a second frame having a third end and a fourth end. The third end of the second frame is arranged proximal to the second end of the first frame, and the first frame and the second frame define a bending axis between the second end and the third end. A continuous cover material is bonded to the first and second frame and across the bending axis. The vehicle interior system also includes a first display device positioned in a first aperture of the first frame. The system has a first configuration in which the first frame is planar with the second frame and a second configuration in which the first frame is not planar with the second frame. The system is configured to reversibly transition between the first and second configurations.
    Type: Application
    Filed: May 12, 2020
    Publication date: July 28, 2022
    Inventors: Jeffrey Michael Benjamin, Wesley J Buth, Scott Steven Cronk, Atul Kumar, Khaled Layouni, Jason Scott Stewart, Po Ki Yuen
  • Patent number: 11211520
    Abstract: Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for increasing the efficiency of fluidic assembly.
    Type: Grant
    Filed: February 5, 2019
    Date of Patent: December 28, 2021
    Assignee: eLux Inc.
    Inventor: Po Ki Yuen
  • Publication number: 20210362601
    Abstract: Embodiments of a vehicle interior system are disclosed. In one or more embodiments, the system includes a base with a curved surface, a cold-formed glass substrate with a thickness of 1.5 mm or less and a first radius of curvature of 500 mm or greater, and an adhesive between the curved surface and the glass substrate. Methods for forming such systems are also disclosed. The systems and methods include components and/or design modifications or methods for reducing stress in the adhesive.
    Type: Application
    Filed: October 10, 2018
    Publication date: November 25, 2021
    Applicant: CORNING INCORPORATED
    Inventors: Atul Kumar, Jinfa Mou, Yawei Sun, Po Ki Yuen
  • Publication number: 20210323270
    Abstract: Embodiments of a vehicle interior component and methods of forming the same are disclosed. The vehicle interior component includes a frame with a support surface and having an opening formed in the support surface. A glass substrate is provided that includes a first major surface, a second major surface facing the support surface, and a minor surface between the first and second major surfaces and defining a thickness of the glass substrate. An adhesive at least partially fills the opening and adheres the glass substrate to the frame. The adhesive in the opening acts to secure the glass substrate and adhesive to the frame.
    Type: Application
    Filed: July 24, 2019
    Publication date: October 21, 2021
    Inventors: Arlin Lee Weikel, Po Ki Yuen
  • Patent number: 11136542
    Abstract: A perfusion bioreactor and a method for using the perfusion bioreactor for performing a continuous cell culture are disclosed. The perfusion bioreactor includes an outer vessel having a housing with a gas permeable membrane, an opening and a cavity; an inner vessel within the cavity; and a lid to cover the opening. A porous membrane within the cavity divides the cavity into inner and outer compartments. A fresh media port extends through the outer vessel or the at least one lid to receive a fresh media tube that has an end located in the inner compartment. A spent media port extends through the outer vessel or the at least one lid to receive a spent media tube that has an end located in the outer compartment. A mixer is within the inner compartment, and the porous membrane is attached to an opening within the inner vessel.
    Type: Grant
    Filed: February 13, 2017
    Date of Patent: October 5, 2021
    Assignee: Corning Incorporated
    Inventors: Sumitava De, Yulong Hong, Nikolaos Pantelis Kladias, Shawn Michael O'Malley, Aravind Raghavan Rammohan, Po Ki Yuen
  • Publication number: 20210031493
    Abstract: Various examples of the present disclosure provide a cold-formed glass assembly. The assembly includes a curved glass substrate and a curved structural frame. A coefficient of thermal expansion between the curved glass substrate and the curved structural frame are different. An adhesive can be disposed between the curved glass substrate and the curved structural frame. The assembly can further include an elastomeric layer, a matrix material or both in contact with the adhesive and disposed between the curved glass substrate and the curved structural frame.
    Type: Application
    Filed: August 3, 2020
    Publication date: February 4, 2021
    Inventors: Jeffrey M Benjamin, Ward Tyson Knickerbocker, Jinfa Mou, Kevin Andrew Vasilakos, Po Ki Yuen
  • Publication number: 20200059021
    Abstract: In one embodiment, an eye of needle (EON) press-fit pin includes a base, a tip, and a compliant portion extending longitudinally between the base and the tip and comprising a pair of resilient deformable arms joined at opposite ends and defining an opening therebetween. The arms each include an outer surface for at least partial engagement with walls of an electrical via upon insertion therein. The outer surface of each of the arms includes a central segment having a flat longitudinal surface and converges from the central segment towards the base and the tip. The arms each further include an inner surface defining the opening and forming an elongated portion at each end of the opening for stress relief.
    Type: Application
    Filed: August 20, 2018
    Publication date: February 20, 2020
    Applicant: CISCO TECHNOLOGY, INC.
    Inventors: Qirong Lin, George Edward Curtis, Ki-Yuen Chau, Quan Lu, Xiaogang Li
  • Patent number: 10547128
    Abstract: In one embodiment, an eye of needle (EON) press-fit pin includes a base, a tip, and a compliant portion extending longitudinally between the base and the tip and comprising a pair of resilient deformable arms joined at opposite ends and defining an opening therebetween. The arms each include an outer surface for at least partial engagement with walls of an electrical via upon insertion therein. The outer surface of each of the arms includes a central segment having a flat longitudinal surface and converges from the central segment towards the base and the tip. The arms each further include an inner surface defining the opening and forming an elongated portion at each end of the opening for stress relief.
    Type: Grant
    Filed: August 20, 2018
    Date of Patent: January 28, 2020
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Qirong Lin, George Edward Curtis, Ki-Yuen Chau, Quan Lu, Xiaogang Li
  • Patent number: 10522280
    Abstract: The subject disclosure relates to improved integrated connector module (ICM) designs for Ethernet applications. Some aspects provide an improved integrated connector module transformer (ICMt), including a wafer configured to hold a plurality of toroid elements, wherein the wafer is comprised of two or more mechanically coupled wafer portions. The ICMt can include one or more Electro Magnetic Interference (EMI) fingers that are configured to contact a ground pad of a printed circuit board (PCB) in order to provide a low-inductance connection between the ICMt and the ground pad of the PCB.
    Type: Grant
    Filed: January 17, 2017
    Date of Patent: December 31, 2019
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: William F. Edwards, George Edward Curtis, Ki Yuen Chau, Sandeep Arvindkumar Patel, Keith Frank Tharp, Robin Carol Johnson, Yu Liu, Billie Alton Hudson
  • Patent number: 10446312
    Abstract: In one implementation, an apparatus is configured to aid in the manufacturing or assembling of electronic surface mount packages. The apparatus includes a common mode choke base configured to support a common mode choke. The apparatus includes terminal contacts coupled to the common mode choke base. The terminal contacts are aligned with wires connected to the common mode choke. The apparatus includes a support member including a wire supporting portion aligned with the wires connected to the common mode choke and a central portion configured to support the common mode choke base.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: October 15, 2019
    Assignee: Cisco Technology, Inc.
    Inventors: William Frank Edwards, Ki-Yuen Chau, Keith Frank Tharp, George Curtis, Kayen Lin
  • Publication number: 20190172968
    Abstract: Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for increasing the efficiency of fluidic assembly.
    Type: Application
    Filed: February 5, 2019
    Publication date: June 6, 2019
    Inventor: Po Ki Yuen
  • Patent number: 10243097
    Abstract: Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for increasing the efficiency of fluidic assembly.
    Type: Grant
    Filed: September 9, 2016
    Date of Patent: March 26, 2019
    Assignee: eLux Inc.
    Inventor: Po Ki Yuen
  • Publication number: 20190048305
    Abstract: The present disclosure generally relates to the bioprocess field and, in particular, to a perfusion bioreactor and a method for using the perfusion bioreactor for performing a continuous cell culture.
    Type: Application
    Filed: February 13, 2017
    Publication date: February 14, 2019
    Applicant: Corning Incorporated
    Inventors: Sumitava De, Yulong Hong, Nikolaos Pantelis Kladias, Shawn Michael O'Malley, Aravind Raghaven Rammohan, Po Ki Yuen
  • Publication number: 20180096774
    Abstract: In one implementation, an apparatus is configured to aid in the manufacturing or assembling of electronic surface mount packages. The apparatus includes a common mode choke base configured to support a common mode choke. The apparatus includes terminal contacts coupled to the common mode choke base. The terminal contacts are aligned with wires connected to the common mode choke. The apparatus includes a support member including a wire supporting portion aligned with the wires connected to the common mode choke and a central portion configured to support the common mode choke base.
    Type: Application
    Filed: November 17, 2017
    Publication date: April 5, 2018
    Inventors: William Frank Edwards, Ki-Yuen Chau, Keith Frank Tharp, George Curtis, Kayen Lin
  • Publication number: 20180076068
    Abstract: Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for increasing the efficiency of fluidic assembly.
    Type: Application
    Filed: September 9, 2016
    Publication date: March 15, 2018
    Inventor: Po Ki Yuen