Abstract: A multi-chip package is disclosed that has a construction capable of preventing and/or reducing electrical shorts caused by shifts in bond wires. The multi-chip package includes a die attach formed between connection points of a bond wire. The die attach is made of a non-conductive material and can be constructed so as to support or encompass a portion of the bond wire. By contacting the bond wire, the die attach restricts the motion of the bond wire by acting as a physical barrier to the bond wire's movement and/or as a source of friction. In this manner, undesired position shifts of the bond wires can be prevented, reducing device failures and allowing for improved manufacturing allowances.

Abstract: A multi-chip package is disclosed that has a construction capable of preventing and/or reducing electrical shorts caused by shifts in bond wires. The multi-chip package includes a die attach formed between connection points of a bond wire. The die attach is made of a non-conductive material and can be constructed so as to support or encompass a portion of the bond wire. By contacting the bond wire, the die attach restricts the motion of the bond wire by acting as a physical barrier to the bond wire's movement and/or as a source of friction. In this manner, undesired position shifts of the bond wires can be prevented, reducing device failures and allowing for improved manufacturing allowances.

Abstract: Methods and systems of applying a plurality of pieces of die attach film to a plurality of singulated dice are provided. The method can involve making intervals between rows and columns of a plurality of pieces of die attach film. The interval can be made by expanding an underlaid expandable film on which the plurality of pieces of die attach film are placed or by removing portions of the die attach film between rows and columns of the plurality of pieces of die attach film. The method can further involve placing a plurality of singulated dice back side down on the plurality of pieces of die attach film.