Abstract: A method for manufacturing an optoelectronic assembly includes attaching an optical die, a first lens, a second lens, and an optical fiber to a sub-mount. The sub-mount includes a plurality of passive alignment features which aid in the passive alignment of the optical die, the first lens, and the optical fiber for attachment. The second lens is actively aligned between the first lens and the optical fiber, based on a coupling efficiency with which an optical signal emitted by the optical die is coupled into the optical fiber through the first and second lenses. The active alignment of the second lens includes calibration of at least one of a position and a degree of tilt of the second lens.

Abstract: Disclosed is a strain relief interface for connecting a packaged optical device and an optical fibre. The optical fibre passes through a snout bore extending from a side wall of the package. The interface comprises two moulded jackets. The first moulded jacket surrounds, and is affixed to, a sheathed section of optical fibre from which a fibre jacket has been removed. A first end of the first moulded jacket is affixed to a fibre jacket that encases an adjacent section of optical fibre. A second end of the first moulded jacket is affixed to the snout bore and to a ferrule located within the snout bore. The second moulded jacket surrounds, and is affixed to, the first moulded jacket, a portion of the fibre jacket and the snout bore. Also disclosed is a method for fabricating a strain relief interface.

Abstract: There is provided a casing for packaging a preassembled optical fibre-coupled optoelectronic device assembly. The casing comprises a can having an integrated snout pipe section and an opening extending from the top wall of the can to the snout pipe section for receiving an optical fibre such that the optical fibre can be fitted through the opening into the snout pipe section and so pass through the snout pipe section to the exterior of the casing with the optoelectronic device housed within the can. The opening may be sealed with a removable wall section. Alternatively, when the opening is sufficiently narrow, with solder alone.

Abstract: A method and a carrier frame for coating the facets of semiconductor devices, in which a plurality of bars are stacked so as to form a wafer such that the facets to be coated are exposed. The exposed facets may then be simultaneously coated in a wafer fabrication/deposition reactor to realise the associated time and cost benefits. The carrier comprises a suitable means for containing a plurality of bars and resiliently biased holding means for holding the bars in the stacked position.

Abstract: A method for fabricating features of different depth in a semiconductor substrate by differential etching. Each of the features is first defined by a temporary mask and a metal layer is deposited and processed to provide a negative image of the original mask, the metal layer then acting as a protective layer during etching of the semiconductor substrate to fabricate the desired feature. The technique also allows the possibility that portions of two features of different depth may connect by opening into one another.

Abstract: Disclosed is a method for forming a first optical device and a vertical stand-off on adjacent regions of a substrate. The method comprises the steps of: depositing subsequent layers of optical materials on the substrate and defining features of the optical device by masking and etching regions of at least one layer; defining the transverse extent of the stand-off by protectively masking a separate region of the or each layer that is etched; modifying the relative thickness of an upper section of the stand-off and the first optical device so that a second optical device subsequently supported by the stand-off is in close optical alignment with the first optical device; and etching a trench through one or more layers of material between the vertical stand-off and the first optical device.

Abstract: Disclosed is a strain relief interface for connecting a packaged optical device and an optical fibre. The optical fibre passes through a snout bore extending from a side wall of the package. The interface comprises two moulded jackets. The first moulded jacket surrounds, and is affixed to, a sheathed section of optical fibre from which a fibre jacket has been removed. A first end of the first moulded jacket is affixed to a fibre jacket that encases an adjacent section of optical fibre. A second end of the first moulded jacket is affixed to the snout bore and to a ferrule located within the snout bore. The second moulded jacket surrounds, and is affixed to, the first moulded jacket, a portion of the fibre jacket and the snout bore.

Abstract: In the present invention, an assembly comprises one or more semiconductor optoelectronic devices sandwiched between two substrates with thermal circuitry so to provide a route by which heat can be transported from both the n-side and p-side of the semiconductor device to a cooling element. The arrangement proposed is robust, benefiting from the stability and flexibility of component integration provide by simultaneous n and p-side down configuration. The arrangement also allows a large thermal gradient to be achieved with respect to the active region of an optoelectronic device from both the n-side and p-side, resulting in fast and efficient heat spreading.