Patents by Inventor Kian Lee

Kian Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10672608
    Abstract: A method of fabricating a device on a carrier substrate, and a device on a carrier substrate. The method comprises providing a first substrate; forming one or more device layers on the first substrate; bonding a second substrate to the device layers on a side thereof opposite to the first substrate; and removing the first substrate.
    Type: Grant
    Filed: January 20, 2017
    Date of Patent: June 2, 2020
    Assignees: Massachusetts Institute of Technology, National University of Singapore, Nanyang Technological University
    Inventors: Kwang Hong Lee, Li Zhang, Soo Jin Chua, Eng Kian Kenneth Lee, Eugene A. Fitzgerald, Chuan Seng Tan
  • Patent number: 10510560
    Abstract: A method of encapsulating a substrate is disclosed, in which the substrate has at least the following layers: a CMOS device layer, a layer of first semiconductor material different to silicon, and a layer of second semiconductor material, the layer of first semiconductor material arranged intermediate the CMOS device layer and the layer of second semiconductor material. The method comprises: (i) circumferentially removing a portion of the substrate at the edges; and (ii) depositing a dielectric material on the substrate to replace the portion removed at step (i) for encapsulating at least the CMOS device layer and the layer of first semiconductor material. A related substrate is also disclosed.
    Type: Grant
    Filed: August 31, 2016
    Date of Patent: December 17, 2019
    Assignees: Nanyang Technological University, Massachusetts Institute of Technology
    Inventors: Kwang Hong Lee, Eng Kian Kenneth Lee, Chuan Seng Tan, Eugene A. Fitzgerald, Viet Cuong Nguyen
  • Publication number: 20190366695
    Abstract: A multilayer cast film includes a cling layer, a release layer, and at least one core layer disposed between and contacting the cling layer and the release layer. The cling layer includes an ultra low density polyethylene (ULDPE), a propylene interpolymer, or blends thereof. The release layer includes a first linear low density polyethylene (first LLDPE) having a density of from 0.915 to 0.938 g/cc and a melt index of from 0.5 g/10 min to 10 g/10 min. Each of the core layers includes a second linear low density polyethylene (second LLDPE) having a density of from 0.905 to 0.930 g/cc and a melt index of from 0.5 g/10 min to 10 g/10 min. The multilayer cast film includes from 3 wt % to 7 wt %, based on a total amount of polymers present in the multilayer cast film, of the low density polyethylene (LDPE).
    Type: Application
    Filed: January 19, 2018
    Publication date: December 5, 2019
    Applicants: Dow Global Technologies LLC, Dow Chemical (Malaysia) Sdn. Bhd., PT Dow Indonesia
    Inventors: Edward L. Lee, Eng Kian Ma, Rajen M. Patel, Peter Yap, Hwee Lun Goh, Adit Pradhana Jayusman Setyogroho
  • Publication number: 20080025030
    Abstract: Embodiments of the present invention include a light emitting diode package comprising a ceramic cavity comprising a substrate for mounting a light emitting diode and substantially vertical sidewalls for reducing light leakage. The ceramic LED package further includes a metallic coating on a portion of the ceramic substrate for reflecting light in a predetermined direction.
    Type: Application
    Filed: March 29, 2004
    Publication date: January 31, 2008
    Inventors: Kong Lee, Kee Ng, Meng Lee, Kian Lee, Janet Chua
  • Publication number: 20070096133
    Abstract: An LED is formed using terminal leads that are rolled instead of die-set formed. Using this process, the terminal leads can end in several terminals thereby allowing higher heat dissipation. The LED can be produced using an LED chip that has light coming only from the top or with light coming from the sides as well. In one embodiment, the side emitting LED can have reflectors constructed within the device to reflect light to the top.
    Type: Application
    Filed: November 2, 2005
    Publication date: May 3, 2007
    Inventors: Kian Lee, Meng Lee, Janet Chua, Yew Kuan
  • Publication number: 20070034887
    Abstract: A New Phosphor-converted LED Device (“NPCLD”) is disclosed. The NPCLD may include a lens over a phosphor body, in which the lens and the phosphor body each have a substantially convex upper surface. The NPCLD may alternatively include first and second lenses, the first lens having a substantially flat interface with a phosphor body.
    Type: Application
    Filed: August 12, 2005
    Publication date: February 15, 2007
    Inventors: Siew Pang, Meng Lee, Kian Lee, Su Oon, Hong Yeoh
  • Publication number: 20070030675
    Abstract: A flash module has a first light-emitting diode (“LED”) optically coupled to a first lens having a first viewing angle, and a second LED optically coupled to a second lens having a second viewing angle. The second viewing angle is greater than the first viewing angle. A first control signal line coupled to the first LED allows selectively activating the first LED. A second control signal line coupled to the second LED activates the second LED.
    Type: Application
    Filed: August 8, 2005
    Publication date: February 8, 2007
    Inventors: Su Oon, Kian Lee, Meng Lee, Siew Pang, Hong Yeoh
  • Publication number: 20060257130
    Abstract: A photographic light system, imaging device and method for providing different types of photographic light uses a single multifunctional light module to produce the different types of photographic light. The multifunctional light module includes a number of semiconductor light source devices, such as light emitting diodes (LED), which are controlled by a light module controller. The multifunctional light module can be used to produce an autofocus auxiliary light, a red-eye reducing light and a flash of light.
    Type: Application
    Filed: May 10, 2005
    Publication date: November 16, 2006
    Inventors: Kian Lee, Janet Chua, Chi Yuen Wong
  • Publication number: 20060240595
    Abstract: A method and apparatus for increasing the integrated circuit density in a flip chip semiconductor device assembly including an interposer substrate facilitating use with various semiconductor die conductive bump arrangements. The interposer substrate includes a plurality of recesses formed in at least one of a first surface and a second surface thereof, wherein the recesses are arranged in a plurality of recess patterns. The interposer substrate also provides enhanced accessibility for test probes for electrical testing of the resulting flip chip semiconductor device assembly.
    Type: Application
    Filed: June 22, 2006
    Publication date: October 26, 2006
    Inventors: Teck Lee, Wuu Tay, Kian Lee
  • Patent number: 7117217
    Abstract: A method and apparatus for implementation in a database management system transforms high-dimensional data points to a single-dimensional space so that single-dimensional values can be used as representative index keys for high-dimensional data points and a single-dimensional index structure can be employed to index the transformed values. Upon achieving transformed values, known single-dimensional indexing structures can be employed. To achieve transformation from high-dimensions to a single-dimension, attribute values of a data item, each representing a different dimension, are mapped into a range and an integer value is assigned to each dimension. Either the minimum or maximum dimension value for the multi-dimensional data item is selected, and the minimum or maximum dimensional value is added to the integer value.
    Type: Grant
    Filed: April 27, 2001
    Date of Patent: October 3, 2006
    Assignee: National University of Singapore
    Inventors: Beng Chin Ooi, Kian Lee Tan, Stephen Bressan, Cui Yu
  • Publication number: 20060206654
    Abstract: A virtual universal serial bus (USB) flash memory storage device with a peripheral component interconnect (PCI) Express including a microcontroller connected separately to a flash memory and PCI Express connecting interface, and the microcontroller has a flash memory interface, a PCI Express interface and a virtual USB module and the virtual USB module includes a USB host and a USB device. If a host gives a USB instruction for saving or reading to the storage device through the PCI Express, the instruction will be sent to and executed by the virtual USB module and the required data processing for saving or reading will be completed through the flash memory interface and flash memory. The data in the storage device can be transmitted with a PCI Express standard transmission rate, and the host considers the storage device as a USB device instead of a pure PCI Express device.
    Type: Application
    Filed: March 14, 2005
    Publication date: September 14, 2006
    Applicant: PHISON ELECTRONICS CORP.
    Inventors: Kian Lee, Wee-Kuan Gan
  • Publication number: 20060176692
    Abstract: A studio light having first and second light output regimes, and adjustable color temperature. The color temperatures of the first and second light output regimes may be different. The light module includes one or more emitters of light of at least two different colors. An external signal causes the light module to switch from a first light output regime to a second, higher intensity light output regime, and back to the first light output regime.
    Type: Application
    Filed: February 10, 2005
    Publication date: August 10, 2006
    Inventors: Kian Lee, Janet Chua, Yue Lau, Teoh Seah, Joon Lee
  • Publication number: 20060139914
    Abstract: A light source and a method for operating the same are disclosed. The light source includes a light emitter and a controller. The light emitter generates light in response to a control signal coupled thereto. The light emitter is characterized by an age related to the amount of light that has been cumulatively generated by the light emitter, the generated light for a given control signal changing with the age. The controller measures the age of the light emitter and generates the control signal based on the desired light intensity and the measured age of the light emitter. In one embodiment, the controller stores an age value for the light emitter, and the controller determines the control signal in response to an input signal specifying a desired light intensity from the light emitter, the controller updating the age value each time the control signal is determined.
    Type: Application
    Filed: December 23, 2004
    Publication date: June 29, 2006
    Inventors: Sundar Yoganandan, Thye Mok, Kian Lee, Norfidathul Karim, Su Oon, Siew Pang, Kheng Tan, Fakhrul Afif, Wen Ou, Yew Kuan
  • Publication number: 20060086946
    Abstract: In one embodiment, light emitted by a plurality of solid-state light emitters is mixed by mounting the plurality of solid-state light emitters on a transparent to translucent substrate so that they primarily emit light away from the substrate. The light emitters are then covered with a transparent to translucent encapsulant; and the encapsulant is coated with a reflective material that reflects light emitted by the light emitters toward the substrate. Related apparatus is also disclosed.
    Type: Application
    Filed: October 22, 2004
    Publication date: April 27, 2006
    Inventors: Elizabeth Fung, Thye Mok, Hong Yeoh, Yew Kuan, Fakhrul Afif, Norfidathul Karim, Kian Lee, Hui Koay
  • Publication number: 20060023448
    Abstract: Illumination apparatus includes a support structure, at least one light emitting element, and a heat sink thermally coupled to the light emitting element. The light emitting element and heat sink are moveable in relation to the support structure. An actuator system moves the at least one light emitting element and the heat sink with respect to the support structure.
    Type: Application
    Filed: July 30, 2004
    Publication date: February 2, 2006
    Inventors: Thye Mok, Sundar Yoganandan, Kian Lee, Kheng Tan, Siew Pang, Yew Kuan, Norfidathul Abdul Karim, Su Oon, Fakhrul Afif, Wen Ou
  • Publication number: 20050287702
    Abstract: A method for designing a carrier substrate includes configuring at least one die-attach location and one or more terminals that protrude from a surface of the carrier substrate so as to prevent adhesive material from contaminating connection surfaces thereof. The method may also include configuring the carrier substrate to include one or more recessed areas that laterally surround at least a portion of the die-attach location to receive excess adhesive.
    Type: Application
    Filed: August 29, 2005
    Publication date: December 29, 2005
    Inventors: Cher Victor Tan, Choon Lee, Kian Lee, Guek Lim, Wuu Tay, Teck Poh, Cheng Poh
  • Publication number: 20050237739
    Abstract: A system and method for reverse mounted light array. In one method embodiment, the present invention couples a reverse mounted light-generating source with a substrate. Additionally, the present invention couples an electrical portion of the reverse mounted light generating source with a conductive trace coupled to the reverse side of the substrate, wherein the coupling of the conductive trace with the substrate and the reverse mounted light generating source forms a reverse mounted light array.
    Type: Application
    Filed: April 27, 2004
    Publication date: October 27, 2005
    Inventors: Kian Lee, Janet Chua, Yew Kuan, Heng Cheng, Kee Ng, Wen Ou
  • Publication number: 20050213334
    Abstract: Embodiments of the present invention include a light emitting diode package comprising a ceramic cavity comprising a substrate for mounting a light emitting diode and substantially vertical sidewalls for reducing light leakage. The ceramic LED package further includes a metallic coating on a portion of the ceramic substrate for reflecting light in a predetermined direction.
    Type: Application
    Filed: March 29, 2004
    Publication date: September 29, 2005
    Inventors: Kong Lee, Kee Ng, Meng Lee, Kian Lee, Janet Chua
  • Publication number: 20050134723
    Abstract: A light module associated with the camera provides flash light having a spectral content that is adjustable according to one or more drive signals. The light module includes one or more emitters of light of at least two different colors that are individually accessible to the one or more drive signals. The flash light is a mixture of the light from the one or more emitters.
    Type: Application
    Filed: December 18, 2003
    Publication date: June 23, 2005
    Inventors: Kian Lee, Janet Yin Chua, Yue Lau, Teoh Seah, Joon Lee
  • Publication number: 20050029676
    Abstract: A solder mask for use on a carrier substrate includes a device-securing region positionable over at least a portion of a die-support location of the carrier substrate. Dams of the solder mask are positionable laterally adjacent to at least portions of the peripheries of corresponding terminals of the carrier substrate. A carrier substrate includes at least one die-attach location and one or more terminals that protrude from a surface of the carrier substrate so as to prevent adhesive material from contaminating connection surfaces thereof. The solder may be positioned or formed on the carrier substrate. The carrier substrate and solder mask may each include one or more recessed areas that laterally surround at least portions of their die-attach location and device-securing region, respectively, to receive excess adhesive.
    Type: Application
    Filed: September 7, 2004
    Publication date: February 10, 2005
    Inventors: Cher Tan, Choon Lee, Kian Lee, Guek Lim, Wuu Tay, Teck Poh, Cheng Pour