Patents by Inventor Kian Seng Ho

Kian Seng Ho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for detecting topographical features of microelectronic substrates
    Patent number: 7213447
    Abstract: An apparatus and method for detecting characteristics of a microelectronic substrate. The microelectronic substrate can have a first surface with first topographical features, such as roughness elements, and a second surface facing opposite from the first surface and having second topographical features, such as protruding conductive structures. In one embodiment, the apparatus can include a support member configured to carry the microelectronic substrate with a first portion of the first surface exposed and a second portion of the second surface exposed. The apparatus can further include a topographical feature detector positioned proximate to support member and aligned with the first portion of the first surface of the microelectronic substrate to detect characteristics, such as a roughness, of the first surface while the microelectronic substrate is carried by the support member.
    Type: Grant
    Filed: June 20, 2005
    Date of Patent: May 8, 2007
    Assignee: Micron Technology, Inc.
    Inventors: Chee Peng Neo, Cher Khng Victor Tan, Kian Seng Ho, Hock Chuan Tan
  • Method and apparatus for detecting topographical features of microelectronic substrates
    Patent number: 6923045
    Abstract: An apparatus and method for detecting characteristics of a microelectronic substrate. The microelectronic substrate can have a first surface with first topographical features, such as roughness elements, and a second surface facing opposite from the first surface and having second topographical features, such as protruding conductive structures. In one embodiment, the apparatus can include a support member configured to carry the microelectronic substrate with a first portion of the first surface exposed and a second portion of the second surface exposed. The apparatus can further include a topographical feature detector positioned proximate to support member and aligned with the first portion of the first surface of the microelectronic substrate to detect characteristics, such as a roughness, of the first surface while the microelectronic substrate is carried by the support member.
    Type: Grant
    Filed: July 15, 2004
    Date of Patent: August 2, 2005
    Assignee: Micron Technology, Inc.
    Inventors: Chee Peng Neo, Cher Khng Victor Tan, Kian Seng Ho, Hock Chuan Tan
  • Method and apparatus for detecting topographical features of microelectronic substrates
    Publication number: 20040253748
    Abstract: An apparatus and method for detecting characteristics of a microelectronic substrate. The microelectronic substrate can have a first surface with first topographical features, such as roughness elements, and a second surface facing opposite from the first surface and having second topographical features, such as protruding conductive structures. In one embodiment, the apparatus can include a support member configured to carry the microelectronic substrate with a first portion of the first surface exposed and a second portion of the second surface exposed. The apparatus can further include a topographical feature detector positioned proximate to support member and aligned with the first portion of the first surface of the microelectronic substrate to detect characteristics, such as a roughness, of the first surface while the microelectronic substrate is carried by the support member.
    Type: Application
    Filed: July 15, 2004
    Publication date: December 16, 2004
    Inventors: Chee Peng Neo, Cher Khng Victor Tan, Kian Seng Ho, Hock Chuan Tan
  • Method and apparatus for detecting topographical features of microelectronic substrates
    Patent number: 6779386
    Abstract: An apparatus and method for detecting characteristics of a microelectronic substrate. The microelectronic substrate can have a first surface with first topographical features, such as roughness elements, and a second surface facing opposite from the first surface and having second topographical features, such as protruding conductive structures. In one embodiment, the apparatus can include a support member configured to carry the microelectronic substrate with a first portion of the first surface exposed and a second portion of the second surface exposed. The apparatus can further include a topographical feature detector positioned proximate to support member and aligned with the first portion of the first surface of the microelectronic substrate to detect characteristics, such as a roughness, of the first surface while the microelectronic substrate is carried by the support member.
    Type: Grant
    Filed: August 30, 2001
    Date of Patent: August 24, 2004
    Assignee: Micron Technology Inc.
    Inventors: Chee Peng Neo, Cher Khng Victor Tan, Kian Seng Ho, Hock Chuan Tan
  • Method and apparatus for detecting topographical features of microelectronic substrates
    Publication number: 20030041656
    Abstract: An apparatus and method for detecting characteristics of a microelectronic substrate. The microelectronic substrate can have a first surface with first topographical features, such as roughness elements, and a second surface facing opposite from the first surface and having second topographical features, such as protruding conductive structures. In one embodiment, the apparatus can include a support member configured to carry the microelectronic substrate with a first portion of the first surface exposed and a second portion of the second surface exposed. The apparatus can further include a topographical feature detector positioned proximate to support member and aligned with the first portion of the first surface of the microelectronic substrate to detect characteristics, such as a roughness, of the first surface while the microelectronic substrate is carried by the support member.
    Type: Application
    Filed: August 30, 2001
    Publication date: March 6, 2003
    Inventors: Chee Peng Neo, Cher Khng Victor Tan, Kian Seng Ho, Hock Chuan Tan