Patents by Inventor Kian Siang Ng
Kian Siang Ng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11018269Abstract: The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate. Thereon, a photostructurable opaque coating is produced which includes apertures. Then, trenches are produced which extend through the clear encapsulation and establish side walls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material. The wafer-size substrate can be attached to a rigid carrier wafer during most process steps.Type: GrantFiled: February 21, 2017Date of Patent: May 25, 2021Assignee: ams Sensor Singapore Pte. Ltd.Inventors: Qichuan Yu, Hartmut Rudmann, Ji Wang, Kian Siang Ng, Simon Gubser, James Eilertsen, Sundar Raman Gnana Sambandam
-
Patent number: 10886420Abstract: The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate. Thereon, a photostructurable spectral filter layer is produced which defines apertures. Then, trenches are produced which extend through the clear encapsulation and establish sidewalls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches and producing aperture stops. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material. The wafer-size substrate can be attached to a rigid carrier wafer during most process steps.Type: GrantFiled: April 5, 2017Date of Patent: January 5, 2021Assignee: ams Sensors Singapore Pte. Ltd.Inventors: Qichuan Yu, Hartmut Rudmann, Ji Wang, Kian Siang Ng, Simon Gubser, James Eilertsen, Sundar Raman Gnana Sambandam
-
Patent number: 10566467Abstract: The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate, thereon, a photostructurable opaque coating is produced which includes apertures. Then, trenches are produced which extend through the clear encapsulation and establish side walls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material.Type: GrantFiled: November 15, 2016Date of Patent: February 18, 2020Assignee: ams Sensors Singapore Pte. Ltd.Inventors: Qichuan Yu, Hartmut Rudmann, Ji Wang, Kian Siang Ng, Simon Gubser, James Eilertsen, Sundar Raman Ghana Sambandam
-
Publication number: 20190123213Abstract: The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate. Thereon, a photostructurable spectral filter layer is produced which defines apertures. Then, trenches are produced which extend through the clear encapsulation and establish sidewalls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches and producing aperture stops. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material. The wafer-size substrate can be attached to a rigid carrier wafer during most process steps.Type: ApplicationFiled: April 5, 2017Publication date: April 25, 2019Inventors: Qichuan Yu, Hartmut Rudmann, Ji Wang, Kian Siang Ng, Simon Gubser, James Eilertsen, Sundar Raman Gnana Sambandam
-
Publication number: 20190097066Abstract: The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate, thereon, a photostructurable opaque coating is produced which includes apertures. Then, trenches are produced which extend through the clear encapsulation and establish side walls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material.Type: ApplicationFiled: November 15, 2016Publication date: March 28, 2019Inventors: Qichuan Yu, Hartmut Rudmann, Ji Wang, Kian Siang NG, Simon Gubser, James Eilertsen, Sundar Raman Ghana Sambandam
-
Publication number: 20190051762Abstract: The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate. Thereon, a photostructurable opaque coating is produced which includes apertures. Then, trenches are produced which extend through the clear encapsulation and establish side walls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material. The wafer-size substrate can be attached to a rigid carrier wafer during most process steps.Type: ApplicationFiled: February 21, 2017Publication date: February 14, 2019Applicant: Heptagon Micro Optics Pte. Ltd.Inventors: Qichuan Yu, Hartmut Rudmann, Ji Wang, Kian Siang NG, Simon Gubser, James Eilertsen, Sundar Raman Gnana Sambandam
-
Patent number: 10190908Abstract: Disclosed are optical devices and methods of manufacturing optical devices. An optical device can include a substrate; an optical emitter chip affixed to the front surface of the substrate; and an optical sensor chip affixed to the front surface of the substrate. The optical sensor chip can include a main sensor and a reference sensor. The optical device can include an opaque dam separating the main optical sensor and the reference sensor. The optical device can include a first transparent encapsulation block encapsulating the optical emitter chip and the reference optical sensor and a second transparent encapsulation block encapsulating the main optical sensor. The optical device can include an opaque encapsulation material encapsulating the first transparent encapsulation block and the second transparent encapsulation block with a first opening above the main optical sensor and a second opening above the optical emitter chip.Type: GrantFiled: May 18, 2018Date of Patent: January 29, 2019Assignee: Heptagon Micro Optics Pte. Ltd.Inventors: Qichuan Yu, Hartmut Rudmann, Ji Wang, Kian Siang Ng, Simon Gubser, Sonja Hanselmann
-
Publication number: 20180266877Abstract: Disclosed are optical devices and methods of manufacturing optical devices. An optical device can include a substrate; an optical emitter chip affixed to the front surface of the substrate; and an optical sensor chip affixed to the front surface of the substrate. The optical sensor chip can include a main sensor and a reference sensor. The optical device can include an opaque dam separating the main optical sensor and the reference sensor. The optical device can include a first transparent encapsulation block encapsulating the optical emitter chip and the reference optical sensor and a second transparent encapsulation block encapsulating the main optical sensor. The optical device can include an opaque encapsulation material encapsulating the first transparent encapsulation block and the second transparent encapsulation block with a first opening above the main optical sensor and a second opening above the optical emitter chip.Type: ApplicationFiled: May 18, 2018Publication date: September 20, 2018Inventors: Qichuan Yu, Hartmut Rudmann, Ji Wang, Kian Siang Ng, Simon Gubser, Sonja Hanselmann
-
Patent number: 9976894Abstract: Disclosed are optical devices and methods of manufacturing optical devices. An optical device can include a substrate; an optical emitter chip affixed to the front surface of the substrate; and an optical sensor chip affixed to the front surface of the substrate. The optical sensor chip can include a main sensor and a reference sensor. The optical device can include an opaque dam separating the main optical sensor and the reference sensor. The optical device can include a first transparent encapsulation block encapsulating the optical emitter chip and the reference optical sensor and a second transparent encapsulation block encapsulating the main optical sensor. The optical device can include an opaque encapsulation material encapsulating the first transparent encapsulation block and the second transparent encapsulation block with a first opening above the main optical sensor and a second opening above the optical emitter chip.Type: GrantFiled: November 16, 2016Date of Patent: May 22, 2018Assignee: Heptagon Micro Optics Pte. Ltd.Inventors: Qichuan Yu, Hartmut Rudmann, Ji Wang, Kian Siang Ng, Simon Gubser, Sonja Hanselmann
-
Publication number: 20170141241Abstract: Disclosed are optical devices and methods of manufacturing optical devices. An optical device can include a substrate; an optical emitter chip affixed to the front surface of the substrate; and an optical sensor chip affixed to the front surface of the substrate. The optical sensor chip can include a main sensor and a reference sensor. The optical device can include an opaque dam separating the main optical sensor and the reference sensor. The optical device can include a first transparent encapsulation block encapsulating the optical emitter chip and the reference optical sensor and a second transparent encapsulation block encapsulating the main optical sensor. The optical device can include an opaque encapsulation material encapsulating the first transparent encapsulation block and the second transparent encapsulation block with a first opening above the main optical sensor and a second opening above the optical emitter chip.Type: ApplicationFiled: November 16, 2016Publication date: May 18, 2017Inventors: Qichuan Yu, Hartmut Rudmann, Ji Wang, Kian Siang Ng, Simon Gubser, Sonja Hanselmann