Patents by Inventor Kian Soo LIM

Kian Soo LIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Reliable semiconductor packages
    Patent number: 11177301
    Abstract: A method for forming a semiconductor package is disclosed. The method includes providing a package substrate having top and bottom major package substrate surfaces, the top major package surface including a die attach region. A die having first and second major die surfaces is attached onto the die attach region. The second major die surface is attached to the die attach region. The first major die surface includes an die active region and a cover adhesive region surrounding the die active region. The method also includes applying a cover adhesive to the cover adhesive region on the first major die surface. A protective cover with first and second major cover surfaces and side surfaces is attached to the die using the cover adhesive. The second major cover surface contacts the cover adhesive. The protective cover covers the die active region. The protective cover includes a discontinuity on at least one of the side surfaces.
    Type: Grant
    Filed: November 18, 2019
    Date of Patent: November 16, 2021
    Assignee: UTAC Headquarters Pte. Ltd.
    Inventors: Hua Hong Tan, Chee Kay Chow, Thian Hwee Tan, Wedanni Linsangan Micla, Enrique Jr Sarile, Mario Arwin Fabian, Dennis Tresnado, Antonino Ii Milanes, Ming Koon Ang, Kian Soo Lim, Mauro Jr. Dionisio, Teddy Joaquin Carreon
  • RELIABLE SEMICONDUCTOR PACKAGES
    Publication number: 20200161351
    Abstract: A method for forming a semiconductor package is disclosed. The method includes providing a package substrate having top and bottom major package substrate surfaces, the top major package surface including a die attach region. A die having first and second major die surfaces is attached onto the die attach region. The second major die surface is attached to the die attach region. The first major die surface includes an die active region and a cover adhesive region surrounding the die active region. The method also includes applying a cover adhesive to the cover adhesive region on the first major die surface. A protective cover with first and second major cover surfaces and side surfaces is attached to the die using the cover adhesive. The second major cover surface contacts the cover adhesive. The protective cover covers the die active region. The protective cover includes a discontinuity on at least one of the side surfaces.
    Type: Application
    Filed: November 18, 2019
    Publication date: May 21, 2020
    Inventors: Hua Hong TAN, Chee Kay CHOW, Thian Hwee TAN, Wedanni Linsangan MICLA, Enrique Jr SARILE, Mario Arwin FABIAN, Dennis TRESNADO, Antonino II MILANES, Ming Koon ANG, Kian Soo LIM, Mauro Jr. DIONISIO, Teddy Joaquin CARREON