Abstract: A prosthetic hearing implant kit is disclosed. The prosthetic hearing implant kit comprises internal components configured to be implanted in a recipient and comprises an internal coil; external components configured to be worn by the recipient and comprises an external coil adapted to be inductively coupled with said internal coil; and an alert system having a second external coil and adapted to receive an external alarm and to transmit signals to said implanted components via said external coil for providing the recipient with a corresponding alarm indication.

Abstract: A prosthetic hearing implant kit is disclosed. The prosthetic hearing implant kit comprises internal components configured to be implanted in a recipient and comprises an internal coil; external components configured to be worn by the recipient and comprises an external coil adapted to be inductively coupled with said internal coil; and an alert system having a second external coil and adapted to receive an external alarm and to transmit signals to said implanted components via said external coil for providing the recipient with a corresponding alarm indication.

Abstract: A prosthetic hearing implant kit is disclosed. The prosthetic hearing implant kit comprises internal components configured to be implanted in a recipient and comprises an internal coil; external components configured to be worn by the recipient and comprises an external coil adapted to be inductively coupled with said internal coil; and an alert system having a second external coil and adapted to receive an external alarm and to transmit signals to said implanted components via said external coil for providing the recipient with a corresponding alarm indication.

Abstract: A method of depositing encapsulant on a line of wire bonds to a die is described, the die having a back surface in contact with the support structure and an active surface opposing the back surface, the active surface having electrical contact pads and functional elements spaced from the contact pads. The method involves the steps of providing a die mounted to the support structure, positioning a barrier between the contact pads and the functional elements, the barrier being proximate to, but spaced from the active surface, depositing a bead of encapsulant onto the electrical contact pads while the barrier remains stationary such that the barrier prevents the encapsulant from contacting the functional elements, removing the barrier when the bead of encapsulant has been deposited. The fluidic resistance generated by the gap between the barrier and the active surface means that the amount of encapsulant that flows into the gap and onto the active surface is almost constant.

Abstract: An apparatus for forming an asymmetrical encapsulant bead on a series of wire bonds electrically connecting a micro-electronic device to a series of conductors. The micro-electronic device has a planar active surface with functional elements. The apparatus includes: a tiltable table for supporting the micro-electronic device, the table being configured for tilting the planar active surface at a predetermined angle relative to the horizontal; and a jetter positioned above the tiltable structure for jetting drops of encapsulant material onto the series of wire bonds.

Abstract: An electronic component assembly is provided having an integrated circuit supported on a first mounting area such that a first surface of the integrated circuit contacts the first mounting area, electrical conductors supported on a second mounting area, and a series of wire bonds extending from contact pads on a second surface of the integrated circuit, opposite the first surface, to the electrical conductors. The first and second mounting areas are stepped relative to one another and the wire bonds are covered in a bead of encapsulant. The bead of encapsulant has a profiled surface that is flat and inclined relative to the second surface.

Abstract: An electronic component that has a support structure with a plurality of electrical conductors, a series of wire bonds, each of the wire bonds extending from one of the electrical conductors respectively, each of the wire bonds having an end section contacting the electrical conductor and an intermediate section contiguous with the end section, a bead of dam encapsulant encapsulating the electrical conductors and the end section of each of the wire bonds, and a bead of fill encapsulant contacting the bead of dam encapsulant and encapsulating the intermediate portion of each of the wire bonds. The dam encapsulant has a higher modulus of elasticity than the fill encapsulant.

Abstract: An electronic component assembly that has a supporting structure, an integrated circuit die with a plurality of contacts pads, a printed circuit board with a plurality of conductors, the integrated circuit die and the PCB being mounted to the supporting structure by a die attach film such that they are adjacent and spaced from each other and, wire bonds electrically connecting the contact pads to the conductors. An intermediate portion of each of the wire bonds is adhered to the die attach film to lower the profile of the wire bond arcs.

Abstract: A method for profiling a bead of encapsulant extending along an edge of a die mounted to a supporting structure, by depositing a bead of encapsulant onto wire bonds along the edge of the die, positioning a profiling surface over the die at a predetermined spacing from the die, moving the profiling surface across the bead before the bead of encapsulant has cured to reshape the bead profile and, curing the bead of encapsulant. The invention has found that the encapsulant can be effectively shaped by a profiling surface without stripping the encapsulant from the wire bonds. The normally convex-shaped upper surface of the encapsulant bead can be pushed to one side of the bead with the profiling surface. With a lower encapsulant bead, the active surface can be brought into closer proximity with another surface without making contact. For example, the nozzle array on a printhead IC can be 300 microns to 400 microns from the paper path.

Abstract: A method of forming an asymmetrical encapsulant bead on a series of wire bonds electrically connecting a micro-electronic device to a series of conductors, the micro-electronic device having a planar active surface. The method has the steps of positioning the die and the wire bonds beneath an encapsulant jetter that jets drops of encapsulant on to the wire bonds, the drops of encapsulant following a vertical trajectory, tilting the die such that the active surface is inclined to the horizontal and, jetting the drops of encapsulant to form a bead of encapsulant material covering the series of wire bonds, the bead having a cross sectional profile that is asymmetrical about an axis parallel to a normal to the active surface.

Abstract: A method of profiling a wire bond between a contact pad on a die, and a conductor on a supporting structure, by electrically connecting the contact pad on the die to the conductor on the supporting structure with a wire bond, the wire bond extending in an arc from the contact pad to the conductor, pushing on the wire bond to collapse the arc and plastically deform the wire bond, and then releasing the wire bonds such that the plastic deformation maintains the wire bond in a flatter profile shape. The strength of the wire bond is known to be relatively small; of the order of 3 to 5 grams force. However, the Applicant's work has found that the wire bond structure is robust enough to withstand a certain degree of work hardening from plastic deformation. The arc of the wire bond can be deformed into a flatter profile without compromising the electrical connection with the PCB.

Abstract: A wirebonder for electrically connecting an integrated circuit die with conductors on a printed circuit board. The wirebonder has a bonding tool for attaching wire bonds from the integrated circuit die to the conductors of the printed circuit board and a wire engaging structure for deforming the wire bonds such that they have a flatter profile shape.

Abstract: A method of jetting drops of encapsulant from an encapsulant jetter, the drops including primary drops and satellite drops that are much smaller than the primary drops. The method has the steps of providing a series of wire bonds electrically connecting a micro-electronic device to a series of conductors, jetting the drops of encapsulant from the jetter and, inducing a gas flow with a velocity sufficient to draw the satellite drops in a predetermined direction away from the series of wire bonds while having negligible effect on the primary drops.

Abstract: A method of reducing wire bond loop heights in wire bonds electrically connecting an integrated circuit die with a contact pad to a printed circuit board with a conductor, by mounting the integrated circuit die such that the contact pad is spaced from the conductor, positioning an adhesive surface between the contact pad and the conductor on the printed circuit board, attaching wire to one of the contact pad or the conductor, drawing the wire towards the other of the contact pad or the conductor, allowing the wire to contact the adhesive surface, and, attaching the wire to the other of the contact pad of the conductor to form a wire bond adhered to the adhesive surface and a point intermediate its ends.

Abstract: A microprocessor device that has a support structure with a chip mounting area and a conductor mounting area. An inkjet printhead IC is supported on the chip mounting area. The inkjet printhead IC has a back surface in contact with the chip mounting area and an active surface opposing the back surface. The active surface has electrical contact pads and an array of ink ejection nozzles. The active surface has electrical contact pads for its circuitry and functional elements. A plurality of electrical conductors are, at least partially, supported on the conductor mounting area and a series of wire bonds extending from the electrical contact pads to the plurality of electrical conductors supported on the conductor mounting area wherein, the chip mounting area is raised relative to the conductor mounting area.

Abstract: An electronic component assembly that has a supporting structure, an integrated circuit die with a plurality of contacts pads, a printed circuit board with a plurality of conductors, the integrated circuit die and the PCB being mounted to the supporting structure by a die attach film such that they are adjacent and spaced from each other and, wire bonds electrically connecting the contact pads to the conductors. An intermediate portion of each of the wire bonds is adhered to the die attach film to lower the profile of the wire bond arcs.

Abstract: A method of profiling a series of wire bonds between a line of contact pads on a die, and a corresponding set of conductors on a supporting structure. The method involves electrically connecting each of the contact pads on the die to a corresponding conductor on the supporting structure with a respective wire bond, each of the wire bonds extending in an arc from the contact pad to the conductor and, pushing on each of the wire bonds individually to collapse the arc and plastically deform the wire bond such that the plastic deformation maintains the wire bond in a flatter profile shape. The support structure has a chip mounting area for supporting the die. The die has a back surface in contact with the chip mounting area and an active surface opposing the back surface, the active surface having the contact pads, and the chip mounting area being raised relative to the remainder of the support structure such that the contact pads are raised relative to the conductors.

Abstract: A method encapsulating wire bonds that extend between a die and conductors on a supporting substrate, by contacting an edge of a profiling blade with the encapsulant material to form a bead of the encapsulant on the edge, positioning the edge such that the bead contacts the die and, moving the profiling blade relative to the die to cover the wire bonds with the encapsulant. Wiping the encapsulant over the wire bonds with a profiling blade provides control of the encapsulant front as well as the height of the encapsulant relative to the die. The movement of the profiling surface relative to the die can closely controlled to shape the encapsulant to a desired form. Using the example of a printhead die, the encapsulant can be shaped to present an inclined face rising from the nozzle surface to a high point over the wire bonds. This can be used by the printhead maintenance facilities to maintain contact pressure on the wiping mechanism.

Abstract: An electronic device that has an integrated circuit die with a plurality of contacts pads, a printed circuit board with a plurality of conductors corresponding to each of the contact pads respectively, wire bonds electrically connecting each of the contact pads to the corresponding conductors and, an adhesive surface positioned between the contacts pads and the corresponding conductors. The wire bonds are secured to the adhesive surface to hold them in a low profile configuration.

Abstract: A method of profiling a series of wire bonds between a line of contact pads on a die, and a corresponding set of conductors on a supporting structure. The method involves electrically connecting each of the contact pads on the die to a corresponding conductor on the supporting structure with a respective wire bond, each of the wire bonds extending in an arc from the contact pad to the conductor and, pushing on each of the wire bonds individually to collapse the arc and plastically deform the wire bond such that the plastic deformation maintains the wire bond in a flatter profile shape. The support structure has a chip mounting area for supporting the die. The die has a back surface in contact with the chip mounting area and an active surface opposing the back surface, the active surface having the contact pads, and the chip mounting area being raised relative to the remainder of the support structure such that the contact pads are raised relative to the conductors.