Patents by Inventor Kianush Naeli

Kianush Naeli has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-wafer pair anodic bonding apparatus and method
    Patent number: 9287126
    Abstract: An electric field concurrently anodically bonds together wafers of each of a plurality of independent wafer pairs.
    Type: Grant
    Filed: April 29, 2013
    Date of Patent: March 15, 2016
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Kianush Naeli, Stephen R. Farrar
  • MULTI-WAFER PAIR ANODIC BONDING APPARATUS AND METHOD
    Publication number: 20140322892
    Abstract: An electric field concurrently anodically bonds together wafers of each of a plurality of independent wafer pairs.
    Type: Application
    Filed: April 29, 2013
    Publication date: October 30, 2014
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Kianush Naeli, Stephen R. Farrar