Abstract: Disclosed herein is a hydrogel that eradicates biofilm bacteria from wounds and accelerates diabetic wound healing. Also disclosed herein are methods of manufacture and use of said hydrogel.

Abstract: An antimicrobial polymer or hydrogel is provided. The antimicrobial polymer or hydrogel comprises a branched polyethylenimine (PEI) grafted with poly(ethylene glycol) methacrylate (PEGMA) of formula (I) or a branched polyethylenimine (PEI) grafted with poly(ethylene glycol) methacrylate (PEGMA) and decane of formula (II), wherein: m is an integer ranging from 1 to 20; n is an integer ranging from 1 to 20; in formula (I), the grafting ratio of PEI-PEGMA ranges from 1:1 to 1:20; and in formula (II), the grafting ratio of PEI-decane-PEGMA ranges from 1:1:1 to 1:20:20.

Abstract: A method for transmitting data from a first communication device to a second communication device, comprising generating a message, wherein the message comprises data to be sent to the second communication device, a source address and a destination address, associating a first address of the first communication device as the source address for the message, associating a first address of the second communication device as the destination address for the message, determining a second address of the first communication device, determining a second address of the second communication device, replacing the first address of the first communication device with the second address of the first communication device as the source address for the message, replacing the first address of the second communication device with the second address of the second communication device as the destination address for the message, and sending the message.

Abstract: A method of fabricating an inductor using bonding techniques in the manufacture of integrated circuits is described. Bonding pads are provided over a semiconductor substrate. Input/output connections are made to at least two of the bonding pads. A plurality of wire bond loops are made between each two of the bonding pads wherein the plurality of wire bond loops forms the inductor.

Abstract: A method of manufacturing a 3-D spiral stacked inductor is provided having a substrate with a plurality of turns in a plurality of levels wherein the number of levels increases from an inner turn to the outer turn of the inductor. First and second connecting portions are respectively connected to an inner turn and an outermost turn, and a dielectric material contains the first and second connecting portions and the plurality of turns over the substrate.