Patents by Inventor Kie Yeung Ahn

Kie Yeung Ahn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5660921
    Abstract: A multilevel electronic package comprising at least two levels, each level including a poly(aryl ether benzimidazole), a polymide and copper. A process of preparing this package is disclosed. Several novel poly(aryl ether benzimidazoles) useful in preparing this package are also set forth.
    Type: Grant
    Filed: May 23, 1995
    Date of Patent: August 26, 1997
    Assignee: IBM Corporation
    Inventors: Kie Yeung Ahn, James Lupton Hedrick, Jr., Jeffrey William Labadie, Kang-Wook Lee, Robert James Twieg, Alfred Viehbeck, George Frederick Walker
  • Patent number: 3996095
    Abstract: A first thin film of appropriate texture, lattice constant, and crystal structure, such as body centered cubic vanadium or chromium with (110) texture is deposited upon a rigid or flexible substrate forming a plurality of polycrystals. A ferrite such as magnetite (Fe.sub.3 O.sub.4) is sputtered from a target onto the first thin film forming a mixture of .gamma.Fe.sub.2 O.sub.3 and Fe.sub.3 O.sub.4 substantially completely without formation of Fe or other oxides of iron, providing good magnetic characteristics and resistance to corrosion. The substrate temperature can be maintained as low as 200.degree.C for both steps when sputtering or evaporation is employed.
    Type: Grant
    Filed: April 16, 1975
    Date of Patent: December 7, 1976
    Assignee: International Business Machines Corporation
    Inventors: Kie Yeung Ahn, Christopher Henry Bajorek, Robert Rosenberg, King-Ning Tu