Patents by Inventor Kien Vinh Hua

Kien Vinh Hua has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6824896
    Abstract: A magnetic media structure 200 deposited on glass substrates without a NiP layer having oriented media (ORMRT>1), high coercivity and high SMNR is presented. This media will significantly reduce the cost of making high quality media on glass substrates by eliminating the cost associated with additional steps of depositing a NiP layer and texturing that layer. First glass substrates are mechanically textured to have a surface roughness of about 1 Å to about 12 Å. The first layer of the magnetic structure contains Cr and Ti with a Ti content of 27 to 63 atomic percentage. The second layer contains Co and Ti with a Ti content of 43 to 55 atomic percentage. The third layer is a Cr-alloy layer wherein the alloy is an element chosen from W, Mo, V, Si, Ti, Mn, Ru, B, Nb, Ta, Zr, and Pt. The fourth layer is Co58Cr37Pt5 and the fifth layer is Co61Cr15Pt12B12. Finally, the protective overcoat is typically a hard material that contains hydrogenated carbon.
    Type: Grant
    Filed: December 31, 2002
    Date of Patent: November 30, 2004
    Assignee: Seagate Technology LLC
    Inventors: Li-Lien Lee, Samuel Dacke Harkness, Kien Vinh Hua, Eric Steck Freeman
  • Publication number: 20030134153
    Abstract: A magnetic media structure 200 deposited on glass substrates without a NiP layer having oriented media (ORMRT>1), high coercivity and high SMNR is presented. This media will significantly reduce the cost of making high quality media on glass substrates by eliminating the cost associated with additional steps of depositing a NiP layer and texturing that layer. First glass substrates are mechanically textured to have a surface roughness of about 1 Å to about 12 Å. The first layer of the magnetic structure contains Cr and Ti with a Ti content of 27 to 63 atomic percentage. The second layer contains Co and Ti with a Ti content of 43 to 55 atomic percentage. The third layer is a Cr-alloy layer wherein the alloy is an element chosen from W, Mo, V, Si, Ti, Mn, Ru, B, Nb, Ta, Zr, and Pt. The fourth layer is Co58Cr37Pt5 and the fifth layer is Co61Cr15Pt12B12. Finally, the protective overcoat is typically a hard material that contains hydrogenated carbon.
    Type: Application
    Filed: December 31, 2002
    Publication date: July 17, 2003
    Inventors: Li-Lien Lee, Samuel Dacke Harkness, Kien Vinh Hua, Eric Steck Freeman