Abstract: An alternate venting path can be employed in a sensor device for pressure equalization. A sensor component of the device can comprise a diaphragm component and/or backplate component disposed over an acoustic port of the device. The diaphragm component can be formed with no holes to prevent liquid or particles from entering a back cavity of the device, or gap between the diaphragm component and backplate component. A venting port can be formed in the device to create an alternate venting path to the back cavity for pressure equalization for the diaphragm component. A venting component, comprising a filter, membrane, and/or hydrophobic coating, can be associated with the venting port to inhibit liquid and particles from entering the back cavity via the venting port, without degrading performance of the device. The venting component can be designed to achieve a desired low frequency corner of the sensor frequency response.

Abstract: An alternate venting path can be employed in a sensor device for pressure equalization. A sensor component of the device can comprise a diaphragm component and/or backplate component disposed over an acoustic port of the device. The diaphragm component can be formed with no holes to prevent liquid or particles from entering a back cavity of the device, or gap between the diaphragm component and backplate component. A venting port can be formed in the device to create an alternate venting path to the back cavity for pressure equalization for the diaphragm component. A venting component, comprising a filter, membrane, and/or hydrophobic coating, can be associated with the venting port to inhibit liquid and particles from entering the back cavity via the venting port, without degrading performance of the device. The venting component can be designed to achieve a desired low frequency corner of the sensor frequency response.

Abstract: Various embodiments provide for an integrated temperature sensor and microphone package where the temperature sensor is located in, over, or near an acoustic port associated with the microphone. This placement of the temperature sensor near the acoustic port enables the temperature sensor to more accurately determine the ambient air temperature and reduces heat island interference cause by heat associated with the integrated circuit. In an embodiment, the temperature sensor can be a thermocouple formed over a substrate, with the temperature sensing portion of the thermocouple formed over the acoustic port. In another embodiment, the temperature sensor can be formed on an application specific integrated circuit that extends into or over the acoustic port. In another embodiment, a thermally conductive channel in a substrate can be placed near the acoustic port to enable the temperature sensor to determine the ambient temperature via the channel.

Abstract: An alternate venting path can be employed in a sensor device for pressure equalization. A sensor component of the device can comprise a diaphragm component and/or backplate component disposed over an acoustic port of the device. The diaphragm component can be formed with no holes to prevent liquid or particles from entering a back cavity of the device, or gap between the diaphragm component and backplate component. A venting port can be formed in the device to create an alternate venting path to the back cavity for pressure equalization for the diaphragm component. A venting component, comprising a filter, membrane, and/or hydrophobic coating, can be associated with the venting port to inhibit liquid and particles from entering the back cavity via the venting port, without degrading performance of the device. The venting component can be designed to achieve a desired low frequency corner of the sensor frequency response.

Abstract: Microelectromechanical systems (MEMS) sensors and related bias voltage techniques are described. Exemplary MEMS sensors, such as exemplary MEMS acoustic sensors or microphones described herein can employ one or more bias voltage generators and single-ended or differential amplifier arrangements. Various embodiments are described that can effectively increase the bias voltage available to the sensor element without resorting to high breakdown voltage semiconductor processes. In addition, control of the one or more bias voltage generators in various operating modes is described, based on consideration of a number of factors.

Abstract: The present invention relates to systems and methods for operating a microphone mesh network. In one embodiment, a method includes connecting, via a device comprising a processor, to one or more active microphones in an area via a network; instructing, via the device, one or more selected microphones of the one or more active microphones to capture audio from an acoustic source; and receiving, via the device, the audio from the one or more selected microphones as input to one or more applications.

Abstract: A packaged microphone has a lid structure with an inner surface having a concavity, and a microphone die secured within the concavity. The packaged microphone also has a substrate coupled with the lid structure to form a package having an interior volume containing the microphone die. The substrate is electrically connected with the microphone die. In addition, the packaged microphone also has aperture formed through the package, and a seal proximate to the microphone die. The seal acoustically seals the microphone and the aperture to form a front volume and a back volume within the interior volume. The aperture is in acoustic communication with the front volume.

Abstract: Various embodiments provide for an integrated temperature sensor and microphone package where the temperature sensor is located in, over, or near an acoustic port associated with the microphone. This placement of the temperature sensor near the acoustic port enables the temperature sensor to more accurately determine the ambient air temperature and reduces heat island interference cause by heat associated with the integrated circuit. In an embodiment, the temperature sensor can be a thermocouple formed over a substrate, with the temperature sensing portion of the thermocouple formed over the acoustic port. In another embodiment, the temperature sensor can be formed on an application specific integrated circuit that extends into or over the acoustic port. In another embodiment, a thermally conductive channel in a substrate can be placed near the acoustic port to enable the temperature sensor to determine the ambient temperature via the channel.

Abstract: Improving noise rejection of a micro-electro-mechanical system (MEMS) microphone by utilizing a membrane sandwiched between oppositely biased backplates is presented herein. The MEMS microphone can comprise a diaphragm that converts an acoustic pressure into an electrical signal; a first backplate capacitively coupled to a first side of the diaphragm—the first backplate biased at a first direct current (DC) voltage; a second backplate capacitively coupled to a second side of the diaphragm—the second backplate biased at a second DC voltage; and an electronic amplifier that buffers the electrical signal to generate a buffered output signal representing the acoustic pressure.

Abstract: Various embodiments provide for an integrated temperature sensor and microphone package where the temperature sensor is located in, over, or near an acoustic port associated with the microphone. This placement of the temperature sensor near the acoustic port enables the temperature sensor to more accurately determine the ambient air temperature and reduces heat island interference cause by heat associated with the integrated circuit. In an embodiment, the temperature sensor can be a thermocouple formed over a substrate, with the temperature sensing portion of the thermocouple formed over the acoustic port. In another embodiment, the temperature sensor can be formed on an application specific integrated circuit that extends into or over the acoustic port. In another embodiment, a thermally conductive channel in a substrate can be placed near the acoustic port to enable the temperature sensor to determine the ambient temperature via the channel.

Abstract: Microelectromechanical systems (MEMS) sensors and related bias voltage techniques are described. Exemplary MEMS sensors, such as exemplary MEMS acoustic sensors or microphones described herein can employ one or more bias voltage generators and single-ended or differential amplifier arrangements. Various embodiments are described that can effectively increase the bias voltage available to the sensor element without resorting to high breakdown voltage semiconductor processes. In addition, control of the one or more bias voltage generators in various operating modes is described, based on consideration of a number of factors.

Abstract: Microelectromechanical systems (MEMS) sensors and related bias voltage techniques are described. Exemplary MEMS sensors, such as exemplary MEMS acoustic sensors or microphones described herein can employ one or more bias voltage generators and single-ended or differential amplifier arrangements. Various embodiments are described that can effectively increase the bias voltage available to the sensor element without resorting to high breakdown voltage semiconductor processes. In addition, control of the one or more bias voltage generators in various operating modes is described, based on consideration of a number of factors.

Abstract: Improving noise rejection of a micro-electro-mechanical system (MEMS) microphone by utilizing a membrane sandwiched between oppositely biased backplates is presented herein. The MEMS microphone can comprise a diaphragm that converts an acoustic pressure into an electrical signal; a first backplate capacitively coupled to a first side of the diaphragm—the first backplate biased at a first direct current (DC) voltage; a second backplate capacitively coupled to a second side of the diaphragm—the second backplate biased at a second DC voltage; and an electronic amplifier that buffers the electrical signal to generate a buffered output signal representing the acoustic pressure.

Abstract: Microelectromechanical systems (MEMS) sensors and related bias voltage techniques are described. Exemplary MEMS sensors, such as exemplary MEMS acoustic sensors or microphones described herein can employ one or more bias voltage generators and single-ended or differential amplifier arrangements. Various embodiments are described that can effectively increase the bias voltage available to the sensor element without resorting to high breakdown voltage semiconductor processes. In addition, control of the one or more bias voltage generators in various operating modes is described, based on consideration of a number of factors.

Abstract: A packaged microphone has a lid structure with an inner surface having a concavity, and a microphone die secured within the concavity. The packaged microphone also has a substrate coupled with the lid structure to form a package having an interior volume containing the microphone die. The substrate is electrically connected with the microphone die. In addition, the packaged microphone also has aperture formed through the package, and a seal proximate to the microphone die. The seal acoustically seals the microphone and the aperture to form a front volume and a back volume within the interior volume. The aperture is in acoustic communication with the front volume.

Abstract: A microphone system has an output and at least a first transducer with a first dynamic range, a second transducer with a second dynamic range different than the first dynamic range, and coupling system to selectively couple the output of one of the first transducer or the second transducer to the system output, depending on the magnitude of the input sound signal, to produce a system with a dynamic range greater than the dynamic range of either individual transducer. A method of operating a microphone system includes detecting whether a transducer output crosses a threshold, and if so then selectively coupling another transducer's output to the system output. The threshold may change as a function of which transducer is coupled to the system output. The system and methods may also combine the outputs of more than one transducer in a weighted sum during transition from one transducer output to another, as a function of time or as a function of the amplitude of the incident audio signal.

Abstract: Various embodiments provide for an integrated temperature sensor and microphone package where the temperature sensor is located in, over, or near an acoustic port associated with the microphone. This placement of the temperature sensor near the acoustic port enables the temperature sensor to more accurately determine the ambient air temperature and reduces heat island interference cause by heat associated with the integrated circuit. In an embodiment, the temperature sensor can be a thermocouple formed over a substrate, with the temperature sensing portion of the thermocouple formed over the acoustic port. In another embodiment, the temperature sensor can be formed on an application specific integrated circuit that extends into or over the acoustic port. In another embodiment, a thermally conductive channel in a substrate can be placed near the acoustic port to enable the temperature sensor to determine the ambient temperature via the channel.

Abstract: A packaged microphone has a lid structure with an inner surface having a concavity, and a microphone die secured within the concavity. The packaged microphone also has a substrate coupled with the lid structure to form a package having an interior volume containing the microphone die. The substrate is electrically connected with the microphone die. In addition, the packaged microphone also has aperture formed through the package, and a seal proximate to the microphone die. The seal acoustically seals the microphone and the aperture to form a front volume and a back volume within the interior volume. The aperture is in acoustic communication with the front volume.

Abstract: A microphone system has an output and at least a first transducer with a first dynamic range, a second transducer with a second dynamic range different than the first dynamic range, and coupling system to selectively couple the output of one of the first transducer or the second transducer to the system output, depending on the magnitude of the input sound signal, to produce a system with a dynamic range greater than the dynamic range of either individual transducer. A method of operating a microphone system includes detecting whether a transducer output crosses a threshold, and if so then selectively coupling another transducer's output to the system output. The threshold may change as a function of which transducer is coupled to the system output. The system and methods may also combine the outputs of more than one transducer in a weighted sum during transition from one transducer output to another, as a function of time or as a function of the amplitude of the incident audio signal.

Abstract: A packaged microphone has a lid structure with an inner surface having a concavity, and a microphone die secured within the concavity. The packaged microphone also has a substrate coupled with the lid structure to form a package having an interior volume containing the microphone die. The substrate is electrically connected with the microphone die. In addition, the packaged microphone also has aperture formed through the package, and a seal proximate to the microphone die. The seal acoustically seals the microphone and the aperture to form a front volume and a back volume within the interior volume. The aperture is in acoustic communication with the front volume.