Patents by Inventor Kieran Harney

Kieran Harney has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10911850
    Abstract: Various embodiments provide for an integrated temperature sensor and microphone package where the temperature sensor is located in, over, or near an acoustic port associated with the microphone. This placement of the temperature sensor near the acoustic port enables the temperature sensor to more accurately determine the ambient air temperature and reduces heat island interference cause by heat associated with the integrated circuit. In an embodiment, the temperature sensor can be a thermocouple formed over a substrate, with the temperature sensing portion of the thermocouple formed over the acoustic port. In another embodiment, the temperature sensor can be formed on an application specific integrated circuit that extends into or over the acoustic port. In another embodiment, a thermally conductive channel in a substrate can be placed near the acoustic port to enable the temperature sensor to determine the ambient temperature via the channel.
    Type: Grant
    Filed: October 19, 2018
    Date of Patent: February 2, 2021
    Assignee: INVENSENSE, INC.
    Inventors: Anthony D. Minervini, Kieran Harney, Aleksey S. Khenkin, Baris Cagdaser
  • Publication number: 20200056934
    Abstract: An alternate venting path can be employed in a sensor device for pressure equalization. A sensor component of the device can comprise a diaphragm component and/or backplate component disposed over an acoustic port of the device. The diaphragm component can be formed with no holes to prevent liquid or particles from entering a back cavity of the device, or gap between the diaphragm component and backplate component. A venting port can be formed in the device to create an alternate venting path to the back cavity for pressure equalization for the diaphragm component. A venting component, comprising a filter, membrane, and/or hydrophobic coating, can be associated with the venting port to inhibit liquid and particles from entering the back cavity via the venting port, without degrading performance of the device. The venting component can be designed to achieve a desired low frequency corner of the sensor frequency response.
    Type: Application
    Filed: August 16, 2019
    Publication date: February 20, 2020
    Inventors: Jeremy Parker, Kieran Harney
  • Patent number: 10349170
    Abstract: Microelectromechanical systems (MEMS) sensors and related bias voltage techniques are described. Exemplary MEMS sensors, such as exemplary MEMS acoustic sensors or microphones described herein can employ one or more bias voltage generators and single-ended or differential amplifier arrangements. Various embodiments are described that can effectively increase the bias voltage available to the sensor element without resorting to high breakdown voltage semiconductor processes. In addition, control of the one or more bias voltage generators in various operating modes is described, based on consideration of a number of factors.
    Type: Grant
    Filed: July 9, 2018
    Date of Patent: July 9, 2019
    Assignee: INVENSENSE, INC.
    Inventors: Kieran Harney, Adrianus Maria Lafort, Brian Moss, Dion Ivo De Roo
  • Publication number: 20190166424
    Abstract: The present invention relates to systems and methods for operating a microphone mesh network. In one embodiment, a method includes connecting, via a device comprising a processor, to one or more active microphones in an area via a network; instructing, via the device, one or more selected microphones of the one or more active microphones to capture audio from an acoustic source; and receiving, via the device, the audio from the one or more selected microphones as input to one or more applications.
    Type: Application
    Filed: May 25, 2018
    Publication date: May 30, 2019
    Inventors: Kieran Harney, Mark Kusch, Jeremy Parker
  • Patent number: 10257609
    Abstract: A packaged microphone has a lid structure with an inner surface having a concavity, and a microphone die secured within the concavity. The packaged microphone also has a substrate coupled with the lid structure to form a package having an interior volume containing the microphone die. The substrate is electrically connected with the microphone die. In addition, the packaged microphone also has aperture formed through the package, and a seal proximate to the microphone die. The seal acoustically seals the microphone and the aperture to form a front volume and a back volume within the interior volume. The aperture is in acoustic communication with the front volume.
    Type: Grant
    Filed: April 19, 2016
    Date of Patent: April 9, 2019
    Assignee: INVENSENSE, INC.
    Inventors: David Bolognia, Kieran Harney
  • Publication number: 20190052944
    Abstract: Various embodiments provide for an integrated temperature sensor and microphone package where the temperature sensor is located in, over, or near an acoustic port associated with the microphone. This placement of the temperature sensor near the acoustic port enables the temperature sensor to more accurately determine the ambient air temperature and reduces heat island interference cause by heat associated with the integrated circuit. In an embodiment, the temperature sensor can be a thermocouple formed over a substrate, with the temperature sensing portion of the thermocouple formed over the acoustic port. In another embodiment, the temperature sensor can be formed on an application specific integrated circuit that extends into or over the acoustic port. In another embodiment, a thermally conductive channel in a substrate can be placed near the acoustic port to enable the temperature sensor to determine the ambient temperature via the channel.
    Type: Application
    Filed: October 19, 2018
    Publication date: February 14, 2019
    Inventors: Anthony D. Minervini, Kieran Harney, Aleksey S. Khenkin, Baris Cagdaser
  • Patent number: 10206047
    Abstract: Improving noise rejection of a micro-electro-mechanical system (MEMS) microphone by utilizing a membrane sandwiched between oppositely biased backplates is presented herein. The MEMS microphone can comprise a diaphragm that converts an acoustic pressure into an electrical signal; a first backplate capacitively coupled to a first side of the diaphragm—the first backplate biased at a first direct current (DC) voltage; a second backplate capacitively coupled to a second side of the diaphragm—the second backplate biased at a second DC voltage; and an electronic amplifier that buffers the electrical signal to generate a buffered output signal representing the acoustic pressure.
    Type: Grant
    Filed: April 28, 2016
    Date of Patent: February 12, 2019
    Assignee: INVENSENSE, INC.
    Inventors: Kieran Harney, Adrianus Maria Lafort, Brian Moss, Dion Ivo De Roo
  • Patent number: 10142718
    Abstract: Various embodiments provide for an integrated temperature sensor and microphone package where the temperature sensor is located in, over, or near an acoustic port associated with the microphone. This placement of the temperature sensor near the acoustic port enables the temperature sensor to more accurately determine the ambient air temperature and reduces heat island interference cause by heat associated with the integrated circuit. In an embodiment, the temperature sensor can be a thermocouple formed over a substrate, with the temperature sensing portion of the thermocouple formed over the acoustic port. In another embodiment, the temperature sensor can be formed on an application specific integrated circuit that extends into or over the acoustic port. In another embodiment, a thermally conductive channel in a substrate can be placed near the acoustic port to enable the temperature sensor to determine the ambient temperature via the channel.
    Type: Grant
    Filed: September 16, 2015
    Date of Patent: November 27, 2018
    Assignee: Invensense, Inc.
    Inventors: Anthony D. Minervini, Kieran Harney, Aleksey S. Khenkin, Baris Cagdaser
  • Publication number: 20180332390
    Abstract: Microelectromechanical systems (MEMS) sensors and related bias voltage techniques are described. Exemplary MEMS sensors, such as exemplary MEMS acoustic sensors or microphones described herein can employ one or more bias voltage generators and single-ended or differential amplifier arrangements. Various embodiments are described that can effectively increase the bias voltage available to the sensor element without resorting to high breakdown voltage semiconductor processes. In addition, control of the one or more bias voltage generators in various operating modes is described, based on consideration of a number of factors.
    Type: Application
    Filed: July 9, 2018
    Publication date: November 15, 2018
    Inventors: Kieran Harney, Adrianus Maria Lafort, Brian Moss, Dion Ivo De Roo
  • Patent number: 10045121
    Abstract: Microelectromechanical systems (MEMS) sensors and related bias voltage techniques are described. Exemplary MEMS sensors, such as exemplary MEMS acoustic sensors or microphones described herein can employ one or more bias voltage generators and single-ended or differential amplifier arrangements. Various embodiments are described that can effectively increase the bias voltage available to the sensor element without resorting to high breakdown voltage semiconductor processes. In addition, control of the one or more bias voltage generators in various operating modes is described, based on consideration of a number of factors.
    Type: Grant
    Filed: April 29, 2016
    Date of Patent: August 7, 2018
    Assignee: Invensense, Inc.
    Inventors: Kieran Harney, Adrianus Maria Lafort, Brian Moss, Dion Ivo De Roo
  • Publication number: 20170318395
    Abstract: Improving noise rejection of a micro-electro-mechanical system (MEMS) microphone by utilizing a membrane sandwiched between oppositely biased backplates is presented herein. The MEMS microphone can comprise a diaphragm that converts an acoustic pressure into an electrical signal; a first backplate capacitively coupled to a first side of the diaphragm—the first backplate biased at a first direct current (DC) voltage; a second backplate capacitively coupled to a second side of the diaphragm—the second backplate biased at a second DC voltage; and an electronic amplifier that buffers the electrical signal to generate a buffered output signal representing the acoustic pressure.
    Type: Application
    Filed: April 28, 2016
    Publication date: November 2, 2017
    Inventors: Kieran Harney, Adrianus Maria Lafort, Brian Moss, Dion Ivo De Roo
  • Publication number: 20170318385
    Abstract: Microelectromechanical systems (MEMS) sensors and related bias voltage techniques are described. Exemplary MEMS sensors, such as exemplary MEMS acoustic sensors or microphones described herein can employ one or more bias voltage generators and single-ended or differential amplifier arrangements. Various embodiments are described that can effectively increase the bias voltage available to the sensor element without resorting to high breakdown voltage semiconductor processes. In addition, control of the one or more bias voltage generators in various operating modes is described, based on consideration of a number of factors.
    Type: Application
    Filed: April 29, 2016
    Publication date: November 2, 2017
    Inventors: Kieran Harney, Adrianus Maria Lafort, Brian Moss, Dion Ivo De Roo
  • Publication number: 20160234592
    Abstract: A packaged microphone has a lid structure with an inner surface having a concavity, and a microphone die secured within the concavity. The packaged microphone also has a substrate coupled with the lid structure to form a package having an interior volume containing the microphone die. The substrate is electrically connected with the microphone die. In addition, the packaged microphone also has aperture formed through the package, and a seal proximate to the microphone die. The seal acoustically seals the microphone and the aperture to form a front volume and a back volume within the interior volume. The aperture is in acoustic communication with the front volume.
    Type: Application
    Filed: April 19, 2016
    Publication date: August 11, 2016
    Inventors: David Bolognia, Kieran Harney
  • Patent number: 9407996
    Abstract: A microphone system has an output and at least a first transducer with a first dynamic range, a second transducer with a second dynamic range different than the first dynamic range, and coupling system to selectively couple the output of one of the first transducer or the second transducer to the system output, depending on the magnitude of the input sound signal, to produce a system with a dynamic range greater than the dynamic range of either individual transducer. A method of operating a microphone system includes detecting whether a transducer output crosses a threshold, and if so then selectively coupling another transducer's output to the system output. The threshold may change as a function of which transducer is coupled to the system output. The system and methods may also combine the outputs of more than one transducer in a weighted sum during transition from one transducer output to another, as a function of time or as a function of the amplitude of the incident audio signal.
    Type: Grant
    Filed: March 12, 2015
    Date of Patent: August 2, 2016
    Assignee: INVENSENSE, INC.
    Inventors: Olli Haila, Kieran Harney, Gary W. Elko, Robert Adams
  • Publication number: 20160165330
    Abstract: Various embodiments provide for an integrated temperature sensor and microphone package where the temperature sensor is located in, over, or near an acoustic port associated with the microphone. This placement of the temperature sensor near the acoustic port enables the temperature sensor to more accurately determine the ambient air temperature and reduces heat island interference cause by heat associated with the integrated circuit. In an embodiment, the temperature sensor can be a thermocouple formed over a substrate, with the temperature sensing portion of the thermocouple formed over the acoustic port. In another embodiment, the temperature sensor can be formed on an application specific integrated circuit that extends into or over the acoustic port. In another embodiment, a thermally conductive channel in a substrate can be placed near the acoustic port to enable the temperature sensor to determine the ambient temperature via the channel.
    Type: Application
    Filed: September 16, 2015
    Publication date: June 9, 2016
    Inventors: Anthony D. Minervini, Kieran Harney, Aleksey S. Khenkin, Baris Cagdaser
  • Patent number: 9332332
    Abstract: A packaged microphone has a lid structure with an inner surface having a concavity, and a microphone die secured within the concavity. The packaged microphone also has a substrate coupled with the lid structure to form a package having an interior volume containing the microphone die. The substrate is electrically connected with the microphone die. In addition, the packaged microphone also has aperture formed through the package, and a seal proximate to the microphone die. The seal acoustically seals the microphone and the aperture to form a front volume and a back volume within the interior volume. The aperture is in acoustic communication with the front volume.
    Type: Grant
    Filed: January 9, 2015
    Date of Patent: May 3, 2016
    Assignee: INVENSENSE, INC.
    Inventors: David Bolognia, Kieran Harney
  • Publication number: 20150189445
    Abstract: A microphone system has an output and at least a first transducer with a first dynamic range, a second transducer with a second dynamic range different than the first dynamic range, and coupling system to selectively couple the output of one of the first transducer or the second transducer to the system output, depending on the magnitude of the input sound signal, to produce a system with a dynamic range greater than the dynamic range of either individual transducer. A method of operating a microphone system includes detecting whether a transducer output crosses a threshold, and if so then selectively coupling another transducer's output to the system output. The threshold may change as a function of which transducer is coupled to the system output. The system and methods may also combine the outputs of more than one transducer in a weighted sum during transition from one transducer output to another, as a function of time or as a function of the amplitude of the incident audio signal.
    Type: Application
    Filed: March 12, 2015
    Publication date: July 2, 2015
    Inventors: Olli Haila, Kieran Harney, Gary W. Elko, Robert Adams
  • Publication number: 20150125007
    Abstract: A packaged microphone has a lid structure with an inner surface having a concavity, and a microphone die secured within the concavity. The packaged microphone also has a substrate coupled with the lid structure to form a package having an interior volume containing the microphone die. The substrate is electrically connected with the microphone die. In addition, the packaged microphone also has aperture formed through the package, and a seal proximate to the microphone die. The seal acoustically seals the microphone and the aperture to form a front volume and a back volume within the interior volume. The aperture is in acoustic communication with the front volume.
    Type: Application
    Filed: January 9, 2015
    Publication date: May 7, 2015
    Inventors: David Bolognia, Kieran Harney
  • Patent number: 9008323
    Abstract: A microphone system has an output and at least a first transducer with a first dynamic range, a second transducer with a second dynamic range different than the first dynamic range, and coupling system to selectively couple the output of one of the first transducer or the second transducer to the system output, depending on the magnitude of the input sound signal, to produce a system with a dynamic range greater than the dynamic range of either individual transducer. A method of operating a microphone system includes detecting whether a transducer output crosses a threshold, and if so then selectively coupling another transducer's output to the system output. Some embodiments combine the outputs of more than one transducer in a weighted sum during transition from one transducer output to another, as a function of time or as a function of the amplitude of the incident audio signal.
    Type: Grant
    Filed: June 22, 2012
    Date of Patent: April 14, 2015
    Assignee: Invensense, Inc.
    Inventors: Olli Haila, Kieran Harney, Gary W. Elko, Robert Adams
  • Publication number: 20120321100
    Abstract: A microphone system has an output and at least a first transducer with a first dynamic range, a second transducer with a second dynamic range different than the first dynamic range, and coupling system to selectively couple the output of one of the first transducer or the second transducer to the system output, depending on the magnitude of the input sound signal, to produce a system with a dynamic range greater than the dynamic range of either individual transducer. A method of operating a microphone system includes detecting whether a transducer output crosses a threshold, and if so then selectively coupling another transducer's output to the system output. Some embodiments combine the outputs of more than one transducer in a weighted sum during transition from one transducer output to another, as a function of time or as a function of the amplitude of the incident audio signal.
    Type: Application
    Filed: June 22, 2012
    Publication date: December 20, 2012
    Applicant: ANALOG DEVICES, INC.
    Inventors: Olli Haila, Kieran Harney, Gary W. Elko, Robert Adams