Patents by Inventor Kieran P. Harney
Kieran P. Harney has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10399850Abstract: A packaged integrated device includes a package substrate having a first surface and a second surface opposite the first surface, and the package substrate has a hole therethrough. The integrated device package also includes a first lid mounted on the first surface of the package substrate to define a first cavity, and a second lid mounted on the second surface of the package substrate to define a second cavity. A microelectromechanical systems (MEMS) die can be mounted on the first surface of the package substrate inside the first cavity and over the hole. A port can be formed in the first lid or the second lid.Type: GrantFiled: August 8, 2017Date of Patent: September 3, 2019Assignee: INVENSENSE, INC.Inventors: David Bolognia, Kieran P. Harney
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Patent number: 10257610Abstract: A microphone module has a substrate with an aperture to allow sound waves to pass through the substrate, a lid mounted to the substrate to define a first interior volume, a microphone mounted to the substrate within the first interior volume, and a housing coupled to the substrate and covering the aperture. The housing forms a second interior volume and includes an acoustic port configured to allow sound to enter the second interior volume. The module further includes a pipe extending from the acoustic port in the housing, and at least one exterior interface pad outside of the second interior volume. The pipe has an open end to receive sound waves and direct them toward the acoustic port in the housing. Moreover, the at least one exterior interface pad electrically couples to the microphone.Type: GrantFiled: April 7, 2017Date of Patent: April 9, 2019Assignee: INVENSENSE, INC.Inventors: Kieran P. Harney, Dipak Sengupta, Brian Moss, Alain V. Guery
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Patent number: 10031877Abstract: Including control data in a serial audio stream is presented herein. A device can include a clock component that is configured to send, via a clock pin of the device, a bit clock signal directed to a slave device. A frame component can send, via a frame pin of the device, a frame clock signal directed to the slave device. A control component can receive, via a data pin of the device during a first portion of a phase of a period of the frame clock signal, slave data from the slave device on a bit-by-bit basis based on the bit clock signal according to an integrated interchip sound (I2S) based protocol; and send, via the data pin during a second portion of the phase after the first portion, a set of control bits directed to the slave device on the bit-by-bit basis based on the bit clock signal.Type: GrantFiled: February 13, 2015Date of Patent: July 24, 2018Assignee: INVENSENSE, INC.Inventors: Jerad M. Lewis, Kieran P. Harney, Aleksey S. Khenkin
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Publication number: 20170334715Abstract: A packaged integrated device includes a package substrate having a first surface and a second surface opposite the first surface, and the package substrate has a hole therethrough. The integrated device package also includes a first lid mounted on the first surface of the package substrate to define a first cavity, and a second lid mounted on the second surface of the package substrate to define a second cavity. A microelectromechanical systems (MEMS) die can be mounted on the first surface of the package substrate inside the first cavity and over the hole. A port can be formed in the first lid or the second lid.Type: ApplicationFiled: August 8, 2017Publication date: November 23, 2017Inventors: David Bolognia, Kieran P. Harney
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Patent number: 9738515Abstract: A packaged integrated device includes a package substrate having a first surface and a second surface opposite the first surface, and the package substrate has a hole therethrough. The integrated device package also includes a first lid mounted on the first surface of the package substrate to define a first cavity, and a second lid mounted on the second surface of the package substrate to define a second cavity. A microelectromechanical systems (MEMS) die can be mounted on the first surface of the package substrate inside the first cavity and over the hole. A port can be formed in the first lid or the second lid.Type: GrantFiled: June 24, 2013Date of Patent: August 22, 2017Assignee: INVENSENSE, INC.Inventors: David Bolognia, Kieran P. Harney
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Publication number: 20170215001Abstract: A microphone module has a substrate with an aperture to allow sound waves to pass through the substrate, a lid mounted to the substrate to define a first interior volume, a microphone mounted to the substrate within the first interior volume, and a housing coupled to the substrate and covering the aperture. The housing forms a second interior volume and includes an acoustic port configured to allow sound to enter the second interior volume. The module further includes a pipe extending from the acoustic port in the housing, and at least one exterior interface pad outside of the second interior volume. The pipe has an open end to receive sound waves and direct them toward the acoustic port in the housing. Moreover, the at least one exterior interface pad electrically couples to the microphone.Type: ApplicationFiled: April 7, 2017Publication date: July 27, 2017Inventors: Kieran P. Harney, Dipak Sengupta, Brian Moss, Alain V. Guery
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Patent number: 9681242Abstract: A MEMS microphone system suited for harsh environments. The system uses an integrated circuit package. A first, solid metal lid covers one face of a ceramic package base that includes a cavity, forming an acoustic chamber. The base includes an aperture through the opposing face of the base for receiving audio signals into the chamber. A MEMS microphone is attached within the chamber about the aperture. A filter covers the aperture opening in the opposing face of the base to prevent contaminants from entering the acoustic chamber. A second metal lid encloses the opposing face of the base and may attach the filter to this face of the base. The lids are electrically connected with vias forming a radio frequency interference shield. The ceramic base material is thermally matched to the silicon microphone material to allow operation over an extended temperature range.Type: GrantFiled: August 21, 2014Date of Patent: June 13, 2017Assignee: INVENSENSE, INC.Inventors: Kieran P. Harney, Jia Gao, Aleksey Khenkin
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Patent number: 9544673Abstract: A microphone package is integrated with a built-in speaker driver. A microphone application-specific integrated circuit (ASIC) and the speaker driver can be directly coupled to an external application processor, eliminating a need for a codec and thus, reducing the size, cost, and/or complexity of a device. In one aspect, the speaker driver and the microphone ASIC are implemented as separate dice mounted on the package substrate. In another aspect, the speaker driver and the microphone ASIC are implemented as stacked die on the package substrate. In yet another aspect, the speaker driver and the microphone ASIC are implemented as a single die on the package substrate.Type: GrantFiled: December 22, 2014Date of Patent: January 10, 2017Assignee: INVENSENSE, INC.Inventors: Jerad M. Lewis, Paul M. Schreier, Kieran P. Harney, Joshua C. LeMaire, Aleksey S. Khenkin
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Publication number: 20160239451Abstract: Including control data in a serial audio stream is presented herein. A device can include a clock component that is configured to send, via a clock pin of the device, a bit clock signal directed to a slave device. A frame component can send, via a frame pin of the device, a frame clock signal directed to the slave device. A control component can receive, via a data pin of the device during a first portion of a phase of a period of the frame clock signal, slave data from the slave device on a bit-by-bit basis based on the bit clock signal according to an integrated interchip sound (I2S) based protocol; and send, via the data pin during a second portion of the phase after the first portion, a set of control bits directed to the slave device on the bit-by-bit basis based on the bit clock signal.Type: ApplicationFiled: February 13, 2015Publication date: August 18, 2016Inventors: Jerad M. Lewis, Kieran P. Harney, Aleksey S. Khenkin
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Publication number: 20160182987Abstract: A microphone package is integrated with a built-in speaker driver. A microphone application-specific integrated circuit (ASIC) and the speaker driver can be directly coupled to an external application processor, eliminating a need for a codec and thus, reducing the size, cost, and/or complexity of a device. In one aspect, the speaker driver and the microphone ASIC are implemented as separate dice mounted on the package substrate. In another aspect, the speaker driver and the microphone ASIC are implemented as stacked die on the package substrate. In yet another aspect, the speaker driver and the microphone ASIC are implemented as a single die on the package substrate.Type: ApplicationFiled: December 22, 2014Publication date: June 23, 2016Inventors: Jerad M. Lewis, Paul M. Schreier, Kieran P. Harney, Joshua C. LeMaire, Aleksey S. Khenkin
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Patent number: 9338538Abstract: A microphone system implements multiple microphones on a single base. To that end, the microphone system has a base, and a plurality of substantially independently movable diaphragms secured to the base. Each of the plurality of diaphragms forms a variable capacitance with the base and thus, each diaphragm effectively forms a generally independent, separate microphone with the base.Type: GrantFiled: April 26, 2013Date of Patent: May 10, 2016Assignee: INVENSENSE, INC.Inventors: Jason W. Weigold, Kieran P. Harney
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Patent number: 9282389Abstract: A microelectromechanical systems (MEMS) device optimized for flip-chip assembly and method of attaching the same are presented herein. A device can include a substrate, an acoustic seal, and a MEMS device mechanically attached to the substrate utilizing bond pad(s) that electrically couple the MEMS device to the substrate and/or an application-specific integrated circuit (ASIC). A portion of the MEMS device includes an acoustic area, an acoustic seal area that surrounds the acoustic area and includes the acoustic seal, and electrical interconnect area(s) that are located outside of the acoustic seal area and include the bond pad(s). The acoustic seal can be compressed between the acoustic seal area and the substrate and/or the ASIC, and include a thixotropic adhesive material. Mechanical support(s) that define a gap between the MEMS device and the substrate and/or the ASIC can be attached to the acoustic seal area and/or the substrate.Type: GrantFiled: August 18, 2014Date of Patent: March 8, 2016Assignee: INVENSENSE, INC.Inventors: Aleksey S. Khenkin, Anthony D. Minervini, Kieran P. Harney
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Publication number: 20160050475Abstract: A microelectromechanical systems (MEMS) device optimized for flip-chip assembly and method of attaching the same are presented herein. A device can include a substrate, an acoustic seal, and a MEMS device mechanically attached to the substrate utilizing bond pad(s) that electrically couple the MEMS device to the substrate and/or an application-specific integrated circuit (ASIC). A portion of the MEMS device includes an acoustic area, an acoustic seal area that surrounds the acoustic area and includes the acoustic seal, and electrical interconnect area(s) that are located outside of the acoustic seal area and include the bond pad(s). The acoustic seal can be compressed between the acoustic seal area and the substrate and/or the ASIC, and include a thixotropic adhesive material. Mechanical support(s) that define a gap between the MEMS device and the substrate and/or the ASIC can be attached to the acoustic seal area and/or the substrate.Type: ApplicationFiled: August 18, 2014Publication date: February 18, 2016Inventors: Aleksey S. Khenkin, Anthony D. Minervini, Kieran P. Harney
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Publication number: 20160044409Abstract: A microphone module has a substrate with an aperture to allow sound waves to pass through the substrate, a lid mounted to the substrate to define a first interior volume, a microphone mounted to the substrate within the first interior volume, and a housing coupled to the substrate and covering the aperture. The housing forms a second interior volume and includes an acoustic port configured to allow sound to enter the second interior volume. The module further includes a pipe extending from the acoustic port in the housing, and at least one exterior interface pad outside of the second interior volume. The pipe has an open end to receive sound waves and direct them toward the acoustic port in the housing. Moreover, the at least one exterior interface pad electrically couples to the microphone.Type: ApplicationFiled: October 22, 2015Publication date: February 11, 2016Inventors: Kieran P. Harney, Dipak Sengupta, Brian Moss, Alain V. Guery
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Patent number: 9173015Abstract: A microphone module has a substrate with an aperture to allow sound waves to pass through the substrate, a lid mounted to the substrate to define a first interior volume, a microphone mounted to the substrate within the first interior volume, and a housing coupled to the substrate and covering the aperture. The housing forms a second interior volume and includes an acoustic port configured to allow sound to enter the second interior volume. The module further includes a pipe extending from the acoustic port in the housing, and at least one exterior interface pad outside of the second interior volume. The pipe has an open end to receive sound waves and direct them toward the acoustic port in the housing. Moreover, the at least one exterior interface pad electrically couples to the microphone.Type: GrantFiled: March 24, 2014Date of Patent: October 27, 2015Assignee: INVENSENSE, INC.Inventors: Kieran P. Harney, Dipak Sengupta, Brian Moss, Alain V. Guery
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Publication number: 20150304787Abstract: A MEMS microphone system suited for harsh environments. The system uses an integrated circuit package. A first, solid metal lid covers one face of a ceramic package base that includes a cavity, forming an acoustic chamber. The base includes an aperture through the opposing face of the base for receiving audio signals into the chamber. A MEMS microphone is attached within the chamber about the aperture. A filter covers the aperture opening in the opposing face of the base to prevent contaminants from entering the acoustic chamber. A second metal lid encloses the opposing face of the base and may attach the filter to this face of the base. The lids are electrically connected with vias forming a radio frequency interference shield. The ceramic base material is thermally matched to the silicon microphone material to allow operation over an extended temperature range.Type: ApplicationFiled: August 21, 2014Publication date: October 22, 2015Inventors: Kieran P. Harney, Jia Gao, Aleksey Khenkin
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Publication number: 20150271617Abstract: A MEMS microphone has a backplate with a given backplate aperture, and a diaphragm having a diaphragm aperture. The given backplate aperture is substantially aligned with the diaphragm aperture.Type: ApplicationFiled: June 5, 2015Publication date: September 24, 2015Inventors: Eric Langlois, Thomas Chen, Xin Zhang, Kieran P. Harney
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Patent number: 9078068Abstract: A MEMS microphone has a backplate with a given backplate aperture, and a diaphragm having a diaphragm aperture. The given backplate aperture is substantially aligned with the diaphragm aperture.Type: GrantFiled: June 5, 2008Date of Patent: July 7, 2015Assignee: INVENSENSE, INC.Inventors: Eric Langlois, Thomas Chen, Xin Zhang, Kieran P. Harney
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Patent number: 9002036Abstract: A microphone system has a primary microphone for producing a primary signal, a secondary microphone for producing a secondary signal, and a selector operatively coupled with both the primary microphone and the secondary microphone. The system also has an output for delivering an output audible signal principally produced by one of the to microphones. The selector selectively permits either 1) at least a portion of the primary signal and/or 2) at least a portion of the secondary signal to be forwarded to the output as a function of the noise in the primary signal.Type: GrantFiled: April 24, 2012Date of Patent: April 7, 2015Assignee: Invensense, Inc.Inventors: Kieran P. Harney, Jason Weigold, Gary Elko
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Patent number: 8995693Abstract: A microphone system has a base coupled with first and second microphone apparatuses. The first microphone apparatus is capable of producing a first output signal having a noise component, while the second microphone apparatus is capable of producing a second output signal. The first microphone apparatus may have a first back-side cavity and the second microphone may have a second back-side cavity. The first and second back-side cavities may be fluidly unconnected. The system also has combining logic operatively coupled with the first microphone apparatus and the second microphone apparatus. The combining logic uses the second output signal to remove at least a portion of the noise component from the first output signal.Type: GrantFiled: December 12, 2012Date of Patent: March 31, 2015Assignee: Invensense, Inc.Inventors: Kieran P. Harney, Jason W. Weigold, Gary W. Elko