Patents by Inventor Kieran Patrick Harney

Kieran Patrick Harney has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6825744
    Abstract: A microstructure package and a method of assembling such a package are described. A package base provides an outer body of the package and has an internal cavity. A device die is located within the cavity, and a flexible die paddle connects the base and the die. The paddle is immovably fixed to hold the die in a highly precise position relative to the base.
    Type: Grant
    Filed: April 29, 2002
    Date of Patent: November 30, 2004
    Assignee: Analog Devices, Inc.
    Inventor: Kieran Patrick Harney
  • Publication number: 20030201856
    Abstract: A microstructure package and a method of assembling such a package are described. A package base provides an outer body of the package and has an internal cavity. A device die is located within the cavity, and a flexible die paddle connects the base and the die. The paddle is immovably fixed to hold the die in a highly precise position relative to the base.
    Type: Application
    Filed: April 29, 2002
    Publication date: October 30, 2003
    Inventor: Kieran Patrick Harney