Patents by Inventor Kiet M. Van

Kiet M. Van has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Reflow furnace for an electronic assembly
    Patent number: 6129256
    Abstract: The invention provides a reflow furnace for an electronic assembly. The electronic assembly comprises a printed circuit board and a device on the printed circuit board. The printed circuit board has solder at a first area near the device and a metallic surface at second area distant from the device. The furnace comprises a frame, a support, a heater, and a shield. The support is secured to the frame and is capable of holding the printed circuit board. The heater is secured to the frame and is capable of heating the printed circuit board while being held by the support. The shield is secured to the frame and is positioned to prevent solder from migrating from the first area to the metallic surface at the second area while the printed circuit board is being heated.
    Type: Grant
    Filed: September 21, 1999
    Date of Patent: October 10, 2000
    Assignee: Intel Corporation
    Inventors: Jeffrey R. Watson, Kiet M. Van, Steven B. Roach