Patents by Inventor Kihak NAM

Kihak NAM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer inspection device and method of manufacturing semiconductor device by using the wafer inspection device
    Patent number: 11428645
    Abstract: According to embodiments, a wafer inspection device is provided. The wafer inspection device includes a porous chuck including a plurality of pores formed all over the porous chuck to allow pressure for fixing a wafer to be applied thereto, a chuck driving device, a back side inspection optical system configured to inspect a portion of a back surface of the wafer, and a position identification optical system, wherein the porous chuck includes a plurality of holes uniformly formed all over the porous chuck to partially expose the back surface of the wafer and a slit exposing the back surface of the wafer and extending in one direction parallel to a top surface of the porous chuck.
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: August 30, 2022
    Assignees: Samsung Electronics Co., Ltd., Advanced Technology Inc.
    Inventors: Kihak Nam, Sungyoon Ryu, Kwangeun Kim, Hwiwoo Park, Dayoung Yoon, Myoungkyu Choi
  • WAFER INSPECTION DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY USING THE WAFER INSPECTION DEVICE
    Publication number: 20210247328
    Abstract: According to embodiments, a wafer inspection device is provided. The wafer inspection device includes a porous chuck including a plurality of pores formed all over the porous chuck to allow pressure for fixing a wafer to be applied thereto, a chuck driving device, a back side inspection optical system configured to inspect a portion of a back surface of the wafer, and a position identification optical system, wherein the porous chuck includes a plurality of holes uniformly formed all over the porous chuck to partially expose the back surface of the wafer and a slit exposing the back surface of the wafer and extending in one direction parallel to a top surface of the porous chuck.
    Type: Application
    Filed: September 21, 2020
    Publication date: August 12, 2021
    Applicants: Samsung Electronics Co., Ltd., ADVANCED TECHNOLOGY INC.
    Inventors: Kihak NAM, Sungyoon RYU, Kwangeun KIM, Hwiwoo PARK, Dayoung YOON, Myoungkyu CHOI