Abstract: An actuator for optical image stabilization, includes a fixed frame having an internal space; a moving frame, accommodated in the internal space, configured to linearly and rotatably move on a plane perpendicular to an optical axis; a first ball member disposed between the fixed frame and the moving frame; a first driver, disposed on the moving frame and the fixed frame, configured to provide a driving force to the moving frame; a plurality of magnetic bodies disposed on the fixed frame to generate attractive force with respect to the first driver disposed on the moving frame; a sensor substrate having a portion coupled to the moving frame to be movable, together with the moving frame, and another portion coupled to the fixed frame; and an image sensor disposed on the portion of the sensor substrate.

Abstract: A cathode for a lithium secondary battery includes a cathode current collector, and a cathode active material layer formed on the cathode current collector. The cathode active material layer includes cathode active material particles. The cathode active material particles include a lithium metal oxide particle containing nickel and having a mole fraction of cobalt of 0.02 or less among all elements except lithium and oxygen.

Abstract: An actuator for optical image stabilization, includes a fixed frame having an internal space; a moving frame, accommodated in the internal space, configured to linearly and rotatably move on a plane perpendicular to an optical axis; a first ball member disposed between the fixed frame and the moving frame; a first driver, disposed on the moving frame and the fixed frame, configured to provide a driving force to the moving frame; a plurality of magnetic bodies disposed on the fixed frame to generate attractive force with respect to the first driver disposed on the moving frame; a sensor substrate having a portion coupled to the moving frame to be movable, together with the moving frame, and another portion coupled to the fixed frame; and an image sensor disposed on the portion of the sensor substrate.

Abstract: A method for fabricating a semiconductor device includes providing a polishing pad which includes a first region and a second region separated from each other by a fence, loading a wafer onto the first region, providing a slurry solution onto the first region, providing an ultrapure water onto the second region, turning the polishing pad to polish a surface of the wafer, and unloading the wafer from the polishing pad after polishing on the surface of the wafer is completed, wherein the fence includes a first fence extending from a center of the polishing pad toward an edge of the polishing pad in a first horizontal direction, and a second fence extending from the center of the polishing pad toward the edge of the polishing pad in a second horizontal direction different from the first horizontal direction.

Abstract: An actuator for optical image stabilization, includes a fixed frame having an internal space; a moving frame, accommodated in the internal space, configured to linearly and rotatably move on a plane perpendicular to an optical axis; a first ball member disposed between the fixed frame and the moving frame; a first driver, disposed on the moving frame and the fixed frame, configured to provide a driving force to the moving frame; a plurality of magnetic bodies disposed on the fixed frame to generate attractive force with respect to the first driver disposed on the moving frame; a sensor substrate having a portion coupled to the moving frame to be movable, together with the moving frame, and another portion coupled to the fixed frame; and an image sensor disposed on the portion of the sensor substrate.

Abstract: A camera module includes: a housing; an optical assembly configured to tilt with respect to the housing, and including a lens system and a sensor substrate having an image sensor; a main substrate disposed in the housing and spaced apart from the sensor substrate; and a first flexible substrate and a second flexible substrate configured to connect the sensor substrate to the main substrate. The first flexible substrate and the second flexible substrate are disposed to at least partially overlap each other.

Abstract: A camera module is provided. The camera module includes a lens module; a carrier coupled to the lens module, and configured to rotate using an optical axis as a rotation axis; a housing configured to accommodate and support the carrier; and a guide unit disposed between the carrier and the housing, wherein the guide unit includes a ball member that is configured to perform a rolling movement between the carrier and the housing, and a first substrate connected to the lens module, wherein at least a portion of the first substrate is configured to bend as the carrier is rotated.

Abstract: A method of manufacturing a semiconductor device includes preparing an object layer on a substrate; polishing the object layer with a first slurry including a first abrasive having a zeta potential of a first polarity; rinsing a surface of the object layer, using a rinsing solution including a chemical of a second polarity, opposite to the first polarity; and polishing the object layer with a second slurry including a second abrasive having a zeta potential of a second polarity, opposite to the first polarity.

Abstract: A semiconductor device includes a substrate, a peripheral structure, a lower insulating layer, and a stack. The substrate includes a peripheral circuit region and a cell array region. The peripheral structure is on the peripheral circuit region. The lower insulating layer covers the peripheral circuit region and the cell array region and has a protruding portion protruding from a flat portion. The stack is on the lower insulating layer and the cell array region, and includes upper conductive patterns and insulating patterns which are alternately and repeatedly stacked.

Abstract: A semiconductor device includes a substrate, a peripheral structure, a lower insulating layer, and a stack. The substrate includes a peripheral circuit region and a cell array region. The peripheral structure is on the peripheral circuit region. The lower insulating layer covers the peripheral circuit region and the cell array region and has a protruding portion protruding from a flat portion. The stack is on the lower insulating layer and the cell array region, and includes upper conductive patterns and insulating patterns which are alternately and repeatedly stacked.

Abstract: A semiconductor device includes a substrate, a peripheral structure, a lower insulating layer, and a stack. The substrate includes a peripheral circuit region and a cell array region. The peripheral structure is on the peripheral circuit region. The lower insulating layer covers the peripheral circuit region and the cell array region and has a protruding portion protruding from a flat portion. The stack is on the lower insulating layer and the cell array region, and includes upper conductive patterns and insulating patterns which are alternately and repeatedly stacked.

Abstract: A method of fabricating a three-dimensional semiconductor device is provided. The method includes providing a substrate with a peripheral circuit region and a cell array region; forming a peripheral structure on the peripheral circuit region, and forming an electrode structure on the cell array region. The electrode structure includes a lower electrode, a lower insulating planarized layer on the lower electrode, and upper electrodes and upper insulating layers vertically and alternatingly stacked on the lower insulating planarized layer, and the lower insulating planarized layer may be extended to cover the peripheral structure on the peripheral circuit region. An upper insulating planarized layer is formed to cover the electrode structure and the lower insulating planarized layer on the peripheral circuit region.

Abstract: A semiconductor device includes a substrate, a peripheral structure, a lower insulating layer, and a stack. The substrate includes a peripheral circuit region and a cell array region. The peripheral structure is on the peripheral circuit region. The lower insulating layer covers the peripheral circuit region and the cell array region and has a protruding portion protruding from a flat portion. The stack is on the lower insulating layer and the cell array region, and includes upper conductive patterns and insulating patterns which are alternately and repeatedly stacked.

Abstract: A method of manufacturing a semiconductor device includes preparing an object layer on a substrate; polishing the object layer with a first slurry including a first abrasive having a zeta potential of a first polarity; rinsing a surface of the object layer, using a rinsing solution including a chemical of a second polarity, opposite to the first polarity; and polishing the object layer with a second slurry including a second abrasive having a zeta potential of a second polarity, opposite to the first polarity.

Abstract: A method of fabricating a three-dimensional semiconductor device is provided. The method includes providing a substrate with a peripheral circuit region and a cell array region; forming a peripheral structure on the peripheral circuit region, and forming an electrode structure on the cell array region. The electrode structure includes a lower electrode, a lower insulating planarized layer on the lower electrode, and upper electrodes and upper insulating layers vertically and alternatingly stacked on the lower insulating planarized layer, and the lower insulating planarized layer may be extended to cover the peripheral structure on the peripheral circuit region. An upper insulating planarized layer is formed to cover the electrode structure and the lower insulating planarized layer on the peripheral circuit region.

Abstract: Disclosed herein is a laser navigation module, including: a light source radiating a laser beam; a housing provided with a window transmitting and reflecting the laser beam radiated from the light source and shielding the introduction of visible rays and provided with a transparent part or a translucent part to radiate light radiated from the inside thereof to the outside; a lighting device mounted in the housing; and a light diffusing member transferring the light radiated from the lighting device and having a groove part formed at an edge of an opposite side of the lighting device.

Abstract: Disclosed herein is a laser navigation module. A light source emits a laser beam. A housing includes an IR window and a transparent or semitransparent part. The IR window transmits or reflects the laser beam emitted from the light source, and also interrupts transmission of external visible rays. The transparent or semitransparent part allows light emitted in the housing to be transmitted out of the housing. An illuminator is installed in the housing. A light diffusion unit transmits the light emitted from the illuminator to the housing. The light diffusion unit has a re-reflective layer on a portion thereof facing the illuminator.

Abstract: Disclosed herein is a laser navigation module. A light source emits a laser beam. A housing includes an IR window and a transparent or semitransparent part. The IR window transmits or reflects the laser beam emitted from the light source, and also interrupts transmission of external visible rays. The transparent or semitransparent part allows light emitted in the housing to be transmitted out of the housing. An illuminator is installed in the housing. A light diffusion unit transmits the light emitted from the illuminator to the housing. A re-reflective layer is formed on the upper surface of the light diffusion unit.

Abstract: Disclosed herein is a laser navigation module. The laser navigation module includes a light source emitting laser light. An IR window allows the laser light emitted by the light source to pass therethrough and be reflected thereon, and prevents the entry of visible light. A housing is equipped with the IR window and includes a transparent or semi-transparent part. An illuminator is provided in the housing to emit light to the outside of the housing. The laser navigation module further includes an opaque part or a blocking layer for selective blocking, thus enabling light to be emitted to a desired area of the housing, therefore making it convenient to use even in a dark place.

Abstract: Disclosed herein is a laser navigation module. The laser navigation system includes a light source, one or more illumination devices, and a re-reflecting layer. The light source emits laser light. The housing is configured such that a window for allowing the laser light emitted by the light source to pass therethrough, reflecting the laser light, and blocking entry of visible light is mounted and such that a transparent or translucent portion for diffusing internally diffused light to an outside is formed. The illumination devices are mounted inside the housing. The light diffusion member transfers light emitted by the illumination devices to the housing, and includes a re-reflecting layer partially formed on the side of the light diffusion member opposite the illumination devices.