Patents by Inventor Ki Hyeon Kim

Ki Hyeon Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250130114
    Abstract: A sensor device is disclosed. The sensor device according to an aspect of the present disclosure may comprise: a housing within which a space is formed; a sensor module which is movably coupled to the housing and is exposed at one end thereof to the outside and configured to sense information on the state of an external member; and an electrically conducting part which is accommodated in the space of the housing and is in electrical communication with the sensor module to receive the detected information transferred from the sensor module and supply power to the sensor module therethrough, wherein the sensor module includes: a body part which is exposed to the outside; and an elastic member which is coupled to the body part and presses the body part toward the external member.
    Type: Application
    Filed: September 28, 2022
    Publication date: April 24, 2025
    Inventors: Hyun Wook LEE, Min Kyu SEO, Ki Hyeon KIM
  • Publication number: 20250076088
    Abstract: A wireless sensor device is disclosed. The wireless sensor device according to an aspect of the present disclosure may comprise: a sensor module which is placed adjacent to a part of an external member and is configured to sense information on a state of the member; a power module which is placed adjacent to another part of the external member to be physically spaced apart from the sensor module, and is configured to be electrically connected to the sensor module to transfer power to the sensor module; and a conducting wire member which is electrically connected to each of the sensor module and the power module to conduct the power.
    Type: Application
    Filed: January 2, 2023
    Publication date: March 6, 2025
    Inventors: Ki Hyeon KIM, Hyun Wook LEE, Min Kyu SEO, Woo Young CHOI
  • Publication number: 20230344025
    Abstract: Provided is a battery module assembly in which unit modules are stacked. Each of the unit modules includes: a plurality of battery cells; and a plurality of cartridge assemblies for respectively fixing the plurality of battery cells. The battery module assembly includes: a sensing assembly mounted to upper ends of the plurality of cartridge assemblies and assembled thereto; a front cover for covering front surfaces of the cartridge assemblies; and a connector coupled and fixed to the front cover. The connector includes: a connector body; and a first protrusion region that protrudes from the connector body. An upper sensing assembly connection hole is formed in an upper region of each of the cartridge assemblies.
    Type: Application
    Filed: September 9, 2022
    Publication date: October 26, 2023
    Applicant: HYUNDAI MOBIS Co., Ltd.
    Inventors: Geum Hyeon LEE, Ki Hyeon KIM
  • Publication number: 20230261329
    Abstract: Disclosed is a battery module including a battery assembly, in which multiple batteries are stacked, and a bus bar housing assembly that surrounds an upper side of the battery assembly. The bus bar housing assembly may include a temperature sensing part including a temperature sensor that has a first fixing hole and measures temperature, and a voltage sensing part including a pressure sensor that has a second fixing hole and measures pressure. The battery module also included a bus bar coupled to the temperature sensing part and the voltage sensing part, and a bus bar housing, coupled to the bus bar, surrounding an upper surface of the battery assembly, and extending downwards from opposite ends in leftward and rightward directions to surround a side surface of the battery assembly.
    Type: Application
    Filed: December 22, 2022
    Publication date: August 17, 2023
    Applicant: HYUNDAI MOBIS CO., LTD.
    Inventors: Yun Su PARK, Ki Hyeon KIM
  • Patent number: 11637338
    Abstract: A battery module assembly with a plurality of unit modules stacked therein is provided. Each of the plurality of unit modules includes a cartridge including a cooling plate having a plate shape and two pouch type battery cells mounted on each of both side surfaces of the cooling plate with the cartridge therebetween. A partition having a tetragonal frame shape and including an internal empty space is disposed between adjacent unit modules among the plurality of unit modules.
    Type: Grant
    Filed: August 20, 2020
    Date of Patent: April 25, 2023
    Assignee: HYUNDAI MOBIS CO., LTD.
    Inventor: Ki Hyeon Kim
  • Publication number: 20230055817
    Abstract: A lower case of a battery module and a method for manufacturing the lower case that can reduce costs by manufacturing a cooling block using a press method, and can further strengthen safety problem due to a leakage of cooling water. There is provided a lower case of a battery module including a lower case in which a battery is mounted, a lower panel assembled to the lower case, a cooling block attached to the lower panel and configured to form a cooling passage between the lower panel and the cooling block, and nipples mounted in the lower case to introduce and withdraw cooling water into and from the cooling passage, and a manufacturing method thereof.
    Type: Application
    Filed: August 19, 2022
    Publication date: February 23, 2023
    Applicant: HYUNDAI MOBIS Co., Ltd.
    Inventor: Ki Hyeon KIM
  • Publication number: 20210057692
    Abstract: A battery module assembly with a plurality of unit modules stacked therein is provided. Each of the plurality of unit modules includes a cartridge including a cooling pin having a plate shape and two pouch type battery cells mounted on each of both side surfaces of the cooling pin with the cartridge therebetween. A partition having a tetragonal frame shape and including an internal empty space is disposed between adjacent unit modules among the plurality of unit modules.
    Type: Application
    Filed: August 20, 2020
    Publication date: February 25, 2021
    Applicant: HYUNDAI MOBIS Co., Ltd.
    Inventor: Ki Hyeon KIM
  • Patent number: 9929475
    Abstract: Provided is a wideband electromagnetic wave (EMW) absorber including a magnetic composite having a structure in which magnetic particles are dispersed in a polymer resin, and a plurality of conductive lines arranged in the magnetic composite, and a method of manufacturing the same. The wideband EMW absorber can be used for a device configured to emit EMWs and effectively absorb wideband EMWs.
    Type: Grant
    Filed: May 9, 2011
    Date of Patent: March 27, 2018
    Assignee: KOREA INSTITUTE OF MACHINERY & MATERIALS
    Inventors: Sang-Kwan Lee, Sang-Bok Lee, Ki Hyeon Kim, Yong-Ho Choa, Sung-Tag Oh
  • Patent number: 9562299
    Abstract: An electroplating solution includes an aqueous electrolyte solution including water soluble copper salts, sulfide ions and chloride ions, an accelerator including an organic material having sulfur (S), the accelerator accelerating copper (Cu) reduction, a suppressor including a polyether compound, the suppressor selectively suppressing the copper reduction, and a leveler including a water soluble polymer having nitrogen that is dissolved into positive ions in the aqueous electrolyte solution.
    Type: Grant
    Filed: January 15, 2014
    Date of Patent: February 7, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Myung-Beom Park, Yun-Deok Kang, Ki-Hyeon Kim, Youn-Joung Cho, Jung-Sik Choi
  • Patent number: 8795505
    Abstract: A copper electroplating method including dipping a substrate in a copper electroplating solution, the substrate including a seed layer; and forming a copper electroplating layer on the seed layer, wherein the copper electroplating solution includes water, a copper supply source, an electrolytic material, and a first additive, the first additive includes a compound represented by Formula 1, below:
    Type: Grant
    Filed: November 7, 2011
    Date of Patent: August 5, 2014
    Assignees: Samsung Electronics Co., Ltd., Adeka Corporation
    Inventors: Myung-Beom Park, Jung-Sik Choi, Ki-Hyeon Kim, Yuji Morishima, Shin-ichi Tanaka, Takashi Yamada, Takehiro Zushi
  • Publication number: 20140197038
    Abstract: An electroplating solution includes an aqueous electrolyte solution including water soluble copper salts, sulfide ions and chloride ions, an accelerator including an organic material having sulfur (S), the accelerator accelerating copper (Cu) reduction, a suppressor including a polyether compound, the suppressor selectively suppressing the copper reduction, and a leveler including a water soluble polymer having nitrogen that is dissolved into positive ions in the aqueous electrolyte solution.
    Type: Application
    Filed: January 15, 2014
    Publication date: July 17, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Myung-Beom PARK, Yun-Deok KANG, Ki-Hyeon KIM, Youn-Joung CHO, Jung-Sik CHOI
  • Publication number: 20130140076
    Abstract: Provided is a wideband electromagnetic wave (EMW) absorber including a magnetic composite having a structure in which magnetic particles are dispersed in a polymer resin, and a plurality of conductive lines arranged in the magnetic composite, and a method of manufacturing the same. The wideband EMW absorber can be used for a device configured to emit EMWs and effectively absorb wideband EMWs.
    Type: Application
    Filed: May 9, 2011
    Publication date: June 6, 2013
    Applicant: KOREA INSTITUTE OF MACHINERY & MATERIALS
    Inventors: Sang-Kwan Lee, Sang-Bok Lee, Ki Hyeon Kim, Yong-Ho Choa, Sung-Tag Oh
  • Publication number: 20120211369
    Abstract: A copper electroplating method including dipping a substrate in a copper electroplating solution, the substrate including a seed layer; and forming a copper electroplating layer on the seed layer, wherein the copper electroplating solution includes water, a copper supply source, an electrolytic material, and a first additive, the first additive includes a compound represented by Formula 1, below:
    Type: Application
    Filed: November 7, 2011
    Publication date: August 23, 2012
    Inventors: Myung-Beom Park, Jung-Sik Choi, Ki-Hyeon Kim, Yuji Morishima, Shin-ichi Tanaka, Takashi Yamada, Takehiro Zushi
  • Publication number: 20120193238
    Abstract: A composition for plating copper includes an electrolyte solution, an accelerator, a suppressor and a leveler. The electrolyte solution includes a soluble copper salt, sulfuric acid and hydrochloric acid. The accelerator includes about 20 to about 60 ppm of a disulfide compound. The suppressor includes about 40 to about 100 ppm of a polyethyleneoxide (PEO)-polypropyleneoxide (PPO)-polyethyleneoxide (PEO) triblock copolymer. The PEO-PPO-PEO triblock copolymer has a weight average molecular weight of about 300 to about 10,000. The leveler includes about 0.01 to about 100 ppm of arylated polyethyleneimine.
    Type: Application
    Filed: November 2, 2011
    Publication date: August 2, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Myung-Beom Park, Ki-Hyeon Kim, Jung-Sik Choi, Jung-Ho Lee
  • Publication number: 20070287280
    Abstract: A composition for removing a photoresist and a method of forming a bump electrode using the composition are provided. The composition includes an amine compound having a hydroxyl group, a polar organic solvent having a heteroatom, an alkylammonium hydroxide and water. The method of forming the bump electrode includes forming a conductive pattern on a substrate, forming a passivation layer on the substrate, the passivation layer having a first opening that partially exposes the conductive pattern, forming a photoresist pattern on the passivation layer, the photoresist pattern having a second opening that exposes the first opening forming a bump electrode that fills the first opening and the second opening, and removing the photoresist pattern from the substrate using a composition including an amine compound having a hydroxyl group, a polar organic solvent having a heteroatom, an alkylammonium hydroxide and water.
    Type: Application
    Filed: June 12, 2007
    Publication date: December 13, 2007
    Inventors: Dong-Min Kang, Young-Sam Lim, Gi-Jung Kim, Young-Nam Kim, Yun-Deok Kang, Ji-Sung Lee, Ki-Hyeon Kim, Kyoung-Jin Choi
  • Patent number: 6649286
    Abstract: Disclosed is a FeCoNiN-based soft magnetic thin film composition having the formula FexCoyNizNv, wherein x, y, z and v are expressed in at % and satisfy 41≦x≦55, 18≦y≦27, 19≦z≦32, 0<v≦5, and x+y+z+v=100. The Fe-based ultrafine crystalline soft magnetic thin film composition is prepared by the more simplified method and much more excellent soft magnetic properties in the high-frequency than the conventional soft magnetic thin film compositions.
    Type: Grant
    Filed: April 20, 2001
    Date of Patent: November 18, 2003
    Assignee: Korea Institute of Science and Technology
    Inventors: Hi Jung Kim, Suk Hee Han, Ki Hyeon Kim, Yun Myung Kim
  • Publication number: 20020160229
    Abstract: Disclosed is a FeCoNiN-based soft magnetic thin film composition having the formula FexCoyNizNv, wherein x, y, z and v are expressed in at % and satisfy 41≦x≦55, 18≦y≦27, 19≦z≦32, 0<v≦5, and x+y+z+v=100. The Fe-based ultrafine crystalline soft magnetic thin film composition is prepared by the more simplified method and much more excellent soft magnetic properties in the high-frequency than the conventional soft magnetic thin film compositions.
    Type: Application
    Filed: April 20, 2001
    Publication date: October 31, 2002
    Inventors: Hi Jung Kim, Suk Hee Han, Ki Hyeon Kim, Yun Myung Kim