Patents by Inventor Ki Hyeon Kim
Ki Hyeon Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12270591Abstract: A refrigerator is configured to supply cool air to a refrigerating compartment, a freezing compartment, and an ice-making compartment by a single evaporator. A cool air passage for the ice-making compartment for supplying cool air to the ice-making compartment is configured to supply the cool air to an upper space in a cool air passage for the freezing compartment, which supplies cool air to the refrigerating compartment and the freezing compartment, through an upper supply passage. Accordingly, since additional cool air is supplied to the cool air passage for the freezing compartment by using the upper supply passage, sufficient cool air is supplied to the refrigerating compartment and the freezing compartment by the single evaporator.Type: GrantFiled: September 25, 2020Date of Patent: April 8, 2025Assignee: LG Electronics Inc.Inventors: Ki Hwang Kim, Sung Hee Kang, Dong Hwi Kim, Yong Hyeon Cho, Jong Pil Kim
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Publication number: 20250093768Abstract: A substrate processing apparatus is provided and includes: a support unit including a spin chuck and a centering jig that is on the spin chuck, the spin chuck configured to support and rotate a substrate; a spraying unit configured to spray processing liquid onto the substrate; a swing arm including a correction unit that includes a sensor and an emitter, the swing arm configured to move such that the correction unit moves to a target point on the substrate, and the emitter configured to irradiate a beam towards the substrate; and a controller configured to: control the spin chuck and the swing arm; and determine whether a movement trajectory of the swing arm is aligned with a rotation center of the spin chuck based on information acquired by the sensor about the centering jig.Type: ApplicationFiled: July 11, 2024Publication date: March 20, 2025Applicants: SEMES CO., LTD., SAMSUNG ELECTRONICS CO. LTD.Inventors: Jin Yeong SUNG, Ki Hoon CHOI, Seung Un OH, Young Ho PARK, Sang Hyeon RYU, Jang Jin LEE, Hyun YOON, Sang Gun LEE, Yu Jin CHO, Ho Jong HWANG, Jong Ju PARK, Jong Keun OH, Yong Woo KIM
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Publication number: 20250073742Abstract: Provided is a control device and a substrate processing apparatus including the same. The substrate processing apparatus includes a support unit configured to support and rotate a first substrate, the support unit including a spin chuck, a spray unit configured to spray a processing fluid on the first substrate, a correction unit on a swing arm and configured to irradiate a beam onto the first substrate when the processing fluid is provided on the first substrate, wherein the swing arm is adjacent to the spin chuck and is configured to move the correction unit to a target point on the first substrate, and a controller configured to control the spin chuck and the swing arm, and correct a position error of the swing arm using a second substrate, wherein a plurality of anchor patterns are on the second substrate.Type: ApplicationFiled: July 10, 2024Publication date: March 6, 2025Inventors: Jin Yeong Sung, Ki Hoon Choi, Seung Un Oh, Young Ho Park, Sang Hyeon Ryu, Jang Jin Lee, Hyun Yoon, Sang Gun Lee, Yu Jin Cho, Ho Jong Hwang, Jong Ju Park, Jong Keun Oh, Yong Woo Kim
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Publication number: 20250081815Abstract: The present disclosure relates to a display device including a cover window; a display module disposed under the cover window and including a display area, a non-display area and a bending area between the display area and the non-display area, the non-display area being bended toward an opposite direction to the cover window; a first cover layer corresponding to the bending area and disposed on the display module; and a second cover layer covering a side of the display module and the first cover layer and connecting the first cover layer and the cover window.Type: ApplicationFiled: May 29, 2024Publication date: March 6, 2025Inventors: Ki-Won KIM, Ho-Hyeon KIM
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Publication number: 20250076088Abstract: A wireless sensor device is disclosed. The wireless sensor device according to an aspect of the present disclosure may comprise: a sensor module which is placed adjacent to a part of an external member and is configured to sense information on a state of the member; a power module which is placed adjacent to another part of the external member to be physically spaced apart from the sensor module, and is configured to be electrically connected to the sensor module to transfer power to the sensor module; and a conducting wire member which is electrically connected to each of the sensor module and the power module to conduct the power.Type: ApplicationFiled: January 2, 2023Publication date: March 6, 2025Inventors: Ki Hyeon KIM, Hyun Wook LEE, Min Kyu SEO, Woo Young CHOI
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Publication number: 20250065360Abstract: A control device and a substrate processing apparatus including the same are provided. The substrate processing apparatus includes: a support unit including a spin head and configured to support and to rotate a substrate; a spraying unit configured to spray processing liquid onto the substrate; a correction unit in a swing arm, the correction unit configured to move to a target point on the substrate and to irradiate a beam when the processing liquid is sprayed onto the substrate; and a control unit configured to calculate the target point, wherein the control unit is configured to convert image coordinates associated with a first coordinate system and then to calculate the target point by converting the image coordinates associated with the first coordinate system into image coordinates associated with a second coordinate system, and the second coordinate system is based on rotation angles of the spin head and the swing arm.Type: ApplicationFiled: July 10, 2024Publication date: February 27, 2025Inventors: Jin Yeong Sung, Ki Hoon Choi, Seung Un Oh, Young Ho Park, Sang Hyeon Ryu, Jang Jin Lee, Hyun Yoon, Sang Gun Lee, Yu Jin Cho, Ho Jong Hwang, Jong Ju Park, Jong Keun Oh, Yong Woo Kim
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Publication number: 20250069207Abstract: There are provided a method and a system for CCTV radial distortion estimation with low-complexity. An image distortion estimation method according to an embodiment includes: adding a certain distortion to an inputted image; detecting outlines from the image to which the distortion is added; detecting straight lines from the detected outlines; calculating a sum of the detected straight lines; performing the above operations N times, and determining parameters of an objective function by fitting an ‘objective function resulting from modeling of a sum of detected straight lines caused by an added distortion’ to the N distortions and the N sums; and estimating a distortion on the image by using the objective function the parameters of which are determined.Type: ApplicationFiled: July 23, 2024Publication date: February 27, 2025Applicant: Korea Electronics Technology InstituteInventors: Ki Woong KWON, Seung Hyeon PARK, Sang Hun KIM
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Publication number: 20250042944Abstract: The present invention relates to squid-derived peptides and uses thereof and, more specifically, to uses of squid-derived peptides squidtocin and pro-sepiatocin for prevention or treatment of V1B receptor-related diseases. It has been confirmed that the squidtocin and pro-sepiatocin according to the present invention have an effect of inducing activation of a V1B receptor which is a type of vasopressin receptor. The V1B receptor which is a type of vasopressin receptor is present in the anterior pituitary and in the hippocampal CA2 region, and it is known that the V1B receptor increases intracellular calcium concentration and is involved in response to stress and sociality. Accordingly, the squidtocin and the pro-sepiatocin according to the present invention can be used in various ways in the field of prevention, amelioration, or treatment of V1B receptor-related diseases.Type: ApplicationFiled: December 5, 2022Publication date: February 6, 2025Inventors: Seon Mi Jo, Seung Hyun Jung, Jei Ha Lee, Hea Bin Kim, Jeong Hyeon Choi, Kyung Hwa Baek, Ha Yeun Song, Tae Young Choi, Ki Hyun Kim
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Publication number: 20230344025Abstract: Provided is a battery module assembly in which unit modules are stacked. Each of the unit modules includes: a plurality of battery cells; and a plurality of cartridge assemblies for respectively fixing the plurality of battery cells. The battery module assembly includes: a sensing assembly mounted to upper ends of the plurality of cartridge assemblies and assembled thereto; a front cover for covering front surfaces of the cartridge assemblies; and a connector coupled and fixed to the front cover. The connector includes: a connector body; and a first protrusion region that protrudes from the connector body. An upper sensing assembly connection hole is formed in an upper region of each of the cartridge assemblies.Type: ApplicationFiled: September 9, 2022Publication date: October 26, 2023Applicant: HYUNDAI MOBIS Co., Ltd.Inventors: Geum Hyeon LEE, Ki Hyeon KIM
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Publication number: 20230261329Abstract: Disclosed is a battery module including a battery assembly, in which multiple batteries are stacked, and a bus bar housing assembly that surrounds an upper side of the battery assembly. The bus bar housing assembly may include a temperature sensing part including a temperature sensor that has a first fixing hole and measures temperature, and a voltage sensing part including a pressure sensor that has a second fixing hole and measures pressure. The battery module also included a bus bar coupled to the temperature sensing part and the voltage sensing part, and a bus bar housing, coupled to the bus bar, surrounding an upper surface of the battery assembly, and extending downwards from opposite ends in leftward and rightward directions to surround a side surface of the battery assembly.Type: ApplicationFiled: December 22, 2022Publication date: August 17, 2023Applicant: HYUNDAI MOBIS CO., LTD.Inventors: Yun Su PARK, Ki Hyeon KIM
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Patent number: 11637338Abstract: A battery module assembly with a plurality of unit modules stacked therein is provided. Each of the plurality of unit modules includes a cartridge including a cooling plate having a plate shape and two pouch type battery cells mounted on each of both side surfaces of the cooling plate with the cartridge therebetween. A partition having a tetragonal frame shape and including an internal empty space is disposed between adjacent unit modules among the plurality of unit modules.Type: GrantFiled: August 20, 2020Date of Patent: April 25, 2023Assignee: HYUNDAI MOBIS CO., LTD.Inventor: Ki Hyeon Kim
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Publication number: 20230055817Abstract: A lower case of a battery module and a method for manufacturing the lower case that can reduce costs by manufacturing a cooling block using a press method, and can further strengthen safety problem due to a leakage of cooling water. There is provided a lower case of a battery module including a lower case in which a battery is mounted, a lower panel assembled to the lower case, a cooling block attached to the lower panel and configured to form a cooling passage between the lower panel and the cooling block, and nipples mounted in the lower case to introduce and withdraw cooling water into and from the cooling passage, and a manufacturing method thereof.Type: ApplicationFiled: August 19, 2022Publication date: February 23, 2023Applicant: HYUNDAI MOBIS Co., Ltd.Inventor: Ki Hyeon KIM
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Publication number: 20210057692Abstract: A battery module assembly with a plurality of unit modules stacked therein is provided. Each of the plurality of unit modules includes a cartridge including a cooling pin having a plate shape and two pouch type battery cells mounted on each of both side surfaces of the cooling pin with the cartridge therebetween. A partition having a tetragonal frame shape and including an internal empty space is disposed between adjacent unit modules among the plurality of unit modules.Type: ApplicationFiled: August 20, 2020Publication date: February 25, 2021Applicant: HYUNDAI MOBIS Co., Ltd.Inventor: Ki Hyeon KIM
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Patent number: 9929475Abstract: Provided is a wideband electromagnetic wave (EMW) absorber including a magnetic composite having a structure in which magnetic particles are dispersed in a polymer resin, and a plurality of conductive lines arranged in the magnetic composite, and a method of manufacturing the same. The wideband EMW absorber can be used for a device configured to emit EMWs and effectively absorb wideband EMWs.Type: GrantFiled: May 9, 2011Date of Patent: March 27, 2018Assignee: KOREA INSTITUTE OF MACHINERY & MATERIALSInventors: Sang-Kwan Lee, Sang-Bok Lee, Ki Hyeon Kim, Yong-Ho Choa, Sung-Tag Oh
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Patent number: 9562299Abstract: An electroplating solution includes an aqueous electrolyte solution including water soluble copper salts, sulfide ions and chloride ions, an accelerator including an organic material having sulfur (S), the accelerator accelerating copper (Cu) reduction, a suppressor including a polyether compound, the suppressor selectively suppressing the copper reduction, and a leveler including a water soluble polymer having nitrogen that is dissolved into positive ions in the aqueous electrolyte solution.Type: GrantFiled: January 15, 2014Date of Patent: February 7, 2017Assignee: Samsung Electronics Co., Ltd.Inventors: Myung-Beom Park, Yun-Deok Kang, Ki-Hyeon Kim, Youn-Joung Cho, Jung-Sik Choi
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Patent number: 8795505Abstract: A copper electroplating method including dipping a substrate in a copper electroplating solution, the substrate including a seed layer; and forming a copper electroplating layer on the seed layer, wherein the copper electroplating solution includes water, a copper supply source, an electrolytic material, and a first additive, the first additive includes a compound represented by Formula 1, below:Type: GrantFiled: November 7, 2011Date of Patent: August 5, 2014Assignees: Samsung Electronics Co., Ltd., Adeka CorporationInventors: Myung-Beom Park, Jung-Sik Choi, Ki-Hyeon Kim, Yuji Morishima, Shin-ichi Tanaka, Takashi Yamada, Takehiro Zushi
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Publication number: 20140197038Abstract: An electroplating solution includes an aqueous electrolyte solution including water soluble copper salts, sulfide ions and chloride ions, an accelerator including an organic material having sulfur (S), the accelerator accelerating copper (Cu) reduction, a suppressor including a polyether compound, the suppressor selectively suppressing the copper reduction, and a leveler including a water soluble polymer having nitrogen that is dissolved into positive ions in the aqueous electrolyte solution.Type: ApplicationFiled: January 15, 2014Publication date: July 17, 2014Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Myung-Beom PARK, Yun-Deok KANG, Ki-Hyeon KIM, Youn-Joung CHO, Jung-Sik CHOI
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Publication number: 20130140076Abstract: Provided is a wideband electromagnetic wave (EMW) absorber including a magnetic composite having a structure in which magnetic particles are dispersed in a polymer resin, and a plurality of conductive lines arranged in the magnetic composite, and a method of manufacturing the same. The wideband EMW absorber can be used for a device configured to emit EMWs and effectively absorb wideband EMWs.Type: ApplicationFiled: May 9, 2011Publication date: June 6, 2013Applicant: KOREA INSTITUTE OF MACHINERY & MATERIALSInventors: Sang-Kwan Lee, Sang-Bok Lee, Ki Hyeon Kim, Yong-Ho Choa, Sung-Tag Oh
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Publication number: 20120211369Abstract: A copper electroplating method including dipping a substrate in a copper electroplating solution, the substrate including a seed layer; and forming a copper electroplating layer on the seed layer, wherein the copper electroplating solution includes water, a copper supply source, an electrolytic material, and a first additive, the first additive includes a compound represented by Formula 1, below:Type: ApplicationFiled: November 7, 2011Publication date: August 23, 2012Inventors: Myung-Beom Park, Jung-Sik Choi, Ki-Hyeon Kim, Yuji Morishima, Shin-ichi Tanaka, Takashi Yamada, Takehiro Zushi
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Publication number: 20120193238Abstract: A composition for plating copper includes an electrolyte solution, an accelerator, a suppressor and a leveler. The electrolyte solution includes a soluble copper salt, sulfuric acid and hydrochloric acid. The accelerator includes about 20 to about 60 ppm of a disulfide compound. The suppressor includes about 40 to about 100 ppm of a polyethyleneoxide (PEO)-polypropyleneoxide (PPO)-polyethyleneoxide (PEO) triblock copolymer. The PEO-PPO-PEO triblock copolymer has a weight average molecular weight of about 300 to about 10,000. The leveler includes about 0.01 to about 100 ppm of arylated polyethyleneimine.Type: ApplicationFiled: November 2, 2011Publication date: August 2, 2012Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Myung-Beom Park, Ki-Hyeon Kim, Jung-Sik Choi, Jung-Ho Lee