Patents by Inventor Ki Hyeon Kim

Ki Hyeon Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240379465
    Abstract: A method includes: forming a MOSFET layer on a semiconductor wafer substrate, the MOSFET layer including: pixel driver circuits; and a display driver circuit; forming at least one line layer on the MOSFET layer; applying a first supply voltage to a first supply voltage line through a first supply voltage pad; connecting data fan-out lines connected to the pixel driver circuits with a first test line by controlling a test switching circuit in the MOSFET layer; measuring an electrical signal generated from each of the pixel driver circuits through a first test pad connected to the first test line; determining whether each of the pixel driver circuits is defective or not based on the measured electrical signal; and forming a light-emitting element layer including light-emitting elements on the at least one line layer when that the pixel driver circuits are determined to be not defective.
    Type: Application
    Filed: December 7, 2023
    Publication date: November 14, 2024
    Inventors: Deok Jun CHOI, Hyo Jung KIM, KI YONG PARK, Yoo Young PARK, Hye Sun SUNG, Ji Hyeon SON, Seung Bo SHIM, Jeong Yong LEE
  • Patent number: 12127990
    Abstract: A gravity compensator applied to a wearable muscular strength assisting apparatus includes a first link configured to extend parallel to a first body portion of a wearer, a second link configured to extend parallel to a second body portion and which is rotatably coupled to an end of the first link, an elastic body, which is fixed at an end thereof to the first link so as to exert an elastic force, which varies according to a length between the two ends thereof, and a connection unit, which is connected an end thereof to the other end of the elastic body and extends in a longitudinal direction of the first link and which is connected at an end thereof to the second link so as to vary a length of the elastic body by relative rotation between the first link and the second link.
    Type: Grant
    Filed: August 17, 2020
    Date of Patent: October 29, 2024
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Beom Su Kim, Seok Ryung Kwon, Kyu Jung Kim, Hyun Seop Lim, Ki Hyeon Bae
  • Patent number: 12124573
    Abstract: An event processing method performed by a computing device is provided. The method may comprise receiving a plurality of events and generating a first event sequence in which the received events are sequentially arranged, determining first priorities for the events included in the first event sequence, using data output from a previously trained priority decision model, verifying the first priorities by comparing the first priorities with second priorities for the events included in the first event sequence, determining a feedback score for the first priorities based on results of the verification; and reinforcing the training of the priority decision model using the feedback score.
    Type: Grant
    Filed: January 24, 2024
    Date of Patent: October 22, 2024
    Assignee: KOREA INTERNET & SECURITY AGENCY
    Inventors: Joon Hyung Lim, Tae Eun Kim, Ki Jong Son, Sae Woom Lee, Seul Ki Choi, Tae Hyeon Kim
  • Patent number: 12107899
    Abstract: The method for automatically generating a playbook performed by a computing apparatus according to the present disclosure comprises periodically collecting asset information and CTI (Cyber Threat Intelligence) information of a target network, extracting TTP (Tactics, Techniques, Procedure) information using the collected asset information and the collected CTI information, retrieving a data source of the extracted TTP information, generating a temporary playbook including a data component matching a detection method of the extracted TTP information among a plurality of data components of the retrieved data source, verifying validity of the temporary playbook based on data component order information of the temporary playbook and determining whether rearrangement of data components included in the temporary playbook is needed, and rearranging data components included in the temporary playbook, and storing it as a final playbook.
    Type: Grant
    Filed: January 23, 2024
    Date of Patent: October 1, 2024
    Assignee: KOREA INTERNET & SECURITY AGENCY
    Inventors: Joon Hyung Lim, Tae Eun Kim, Ki Jong Son, Sae Woom Lee, Seul Ki Choi, Tae Hyeon Kim
  • Publication number: 20240315909
    Abstract: An upper arm module of a wearable muscular strength assisting apparatus is provided. The upper arm module includes a base part configured to be connected to a wearer's body, and an upper arm part having a first end thereof coupled to the base part to be rotatable about a fixed point. The upper arm part is coupled to the wearer's upper arm to apply a torque thereto. The upper arm module further includes an elastic body having a first end thereof fixedly coupled to the upper arm part and generating an elastic force by deformation. In particular, the upper arm module also includes a first link having a first end thereof rotatably coupled to the base part at a point of application, and a second link rotatably coupled to the second end of the first link at a first point.
    Type: Application
    Filed: June 7, 2024
    Publication date: September 26, 2024
    Inventors: Ki Hyeon Bae, Hyun Seop Lim, Beom Su Kim, Ju Young Yoon, Kyu Jung Kim, Dong Jin Hyun
  • Publication number: 20240313328
    Abstract: The disclosed technology relates to a battery pack. In an example, the battery pack includes: a pair of base plates, a center frame between the pair of base plates and connected to each of the base plates at both sides in a longitudinal direction, a pair of side frames each connected to an outer side surface of each of the base plates in the longitudinal direction, and a plurality of battery modules on the pair of base plates in a pack space between the center frame and the side frame, wherein each of the plurality of battery modules includes a pair of module frames and accommodates a plurality of battery cells, and wherein the plurality of battery modules are accommodated in the pack space such that the module frames are disposed in a direction crossing the center frame and the side frame.
    Type: Application
    Filed: May 15, 2023
    Publication date: September 19, 2024
    Inventors: Ju Hwan SHIN, Byung Do JANG, Ki Young KIM, Hyoung Suk LEE, Chang Hyeon YANG
  • Patent number: 12091635
    Abstract: Disclosed is a surfactant composition in which at least one of surface tension and interfacial tension is superior, the composition including a fluorinated surfactant and a phospholipid-based surfactant, and optionally further including a sulfosuccinate-based surfactant.
    Type: Grant
    Filed: December 2, 2021
    Date of Patent: September 17, 2024
    Assignee: AK ChemTech CO., LTD.
    Inventors: Hyun Chul Kang, Won Jun Jeong, Bu Hyeon Kim, Hyun Pil Yu, Ki Ho Park, Won Gook Shin, Byung Jo Kim
  • Publication number: 20230344025
    Abstract: Provided is a battery module assembly in which unit modules are stacked. Each of the unit modules includes: a plurality of battery cells; and a plurality of cartridge assemblies for respectively fixing the plurality of battery cells. The battery module assembly includes: a sensing assembly mounted to upper ends of the plurality of cartridge assemblies and assembled thereto; a front cover for covering front surfaces of the cartridge assemblies; and a connector coupled and fixed to the front cover. The connector includes: a connector body; and a first protrusion region that protrudes from the connector body. An upper sensing assembly connection hole is formed in an upper region of each of the cartridge assemblies.
    Type: Application
    Filed: September 9, 2022
    Publication date: October 26, 2023
    Applicant: HYUNDAI MOBIS Co., Ltd.
    Inventors: Geum Hyeon LEE, Ki Hyeon KIM
  • Publication number: 20230261329
    Abstract: Disclosed is a battery module including a battery assembly, in which multiple batteries are stacked, and a bus bar housing assembly that surrounds an upper side of the battery assembly. The bus bar housing assembly may include a temperature sensing part including a temperature sensor that has a first fixing hole and measures temperature, and a voltage sensing part including a pressure sensor that has a second fixing hole and measures pressure. The battery module also included a bus bar coupled to the temperature sensing part and the voltage sensing part, and a bus bar housing, coupled to the bus bar, surrounding an upper surface of the battery assembly, and extending downwards from opposite ends in leftward and rightward directions to surround a side surface of the battery assembly.
    Type: Application
    Filed: December 22, 2022
    Publication date: August 17, 2023
    Applicant: HYUNDAI MOBIS CO., LTD.
    Inventors: Yun Su PARK, Ki Hyeon KIM
  • Patent number: 11637338
    Abstract: A battery module assembly with a plurality of unit modules stacked therein is provided. Each of the plurality of unit modules includes a cartridge including a cooling plate having a plate shape and two pouch type battery cells mounted on each of both side surfaces of the cooling plate with the cartridge therebetween. A partition having a tetragonal frame shape and including an internal empty space is disposed between adjacent unit modules among the plurality of unit modules.
    Type: Grant
    Filed: August 20, 2020
    Date of Patent: April 25, 2023
    Assignee: HYUNDAI MOBIS CO., LTD.
    Inventor: Ki Hyeon Kim
  • Publication number: 20230055817
    Abstract: A lower case of a battery module and a method for manufacturing the lower case that can reduce costs by manufacturing a cooling block using a press method, and can further strengthen safety problem due to a leakage of cooling water. There is provided a lower case of a battery module including a lower case in which a battery is mounted, a lower panel assembled to the lower case, a cooling block attached to the lower panel and configured to form a cooling passage between the lower panel and the cooling block, and nipples mounted in the lower case to introduce and withdraw cooling water into and from the cooling passage, and a manufacturing method thereof.
    Type: Application
    Filed: August 19, 2022
    Publication date: February 23, 2023
    Applicant: HYUNDAI MOBIS Co., Ltd.
    Inventor: Ki Hyeon KIM
  • Publication number: 20210057692
    Abstract: A battery module assembly with a plurality of unit modules stacked therein is provided. Each of the plurality of unit modules includes a cartridge including a cooling pin having a plate shape and two pouch type battery cells mounted on each of both side surfaces of the cooling pin with the cartridge therebetween. A partition having a tetragonal frame shape and including an internal empty space is disposed between adjacent unit modules among the plurality of unit modules.
    Type: Application
    Filed: August 20, 2020
    Publication date: February 25, 2021
    Applicant: HYUNDAI MOBIS Co., Ltd.
    Inventor: Ki Hyeon KIM
  • Patent number: 9929475
    Abstract: Provided is a wideband electromagnetic wave (EMW) absorber including a magnetic composite having a structure in which magnetic particles are dispersed in a polymer resin, and a plurality of conductive lines arranged in the magnetic composite, and a method of manufacturing the same. The wideband EMW absorber can be used for a device configured to emit EMWs and effectively absorb wideband EMWs.
    Type: Grant
    Filed: May 9, 2011
    Date of Patent: March 27, 2018
    Assignee: KOREA INSTITUTE OF MACHINERY & MATERIALS
    Inventors: Sang-Kwan Lee, Sang-Bok Lee, Ki Hyeon Kim, Yong-Ho Choa, Sung-Tag Oh
  • Patent number: 9562299
    Abstract: An electroplating solution includes an aqueous electrolyte solution including water soluble copper salts, sulfide ions and chloride ions, an accelerator including an organic material having sulfur (S), the accelerator accelerating copper (Cu) reduction, a suppressor including a polyether compound, the suppressor selectively suppressing the copper reduction, and a leveler including a water soluble polymer having nitrogen that is dissolved into positive ions in the aqueous electrolyte solution.
    Type: Grant
    Filed: January 15, 2014
    Date of Patent: February 7, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Myung-Beom Park, Yun-Deok Kang, Ki-Hyeon Kim, Youn-Joung Cho, Jung-Sik Choi
  • Patent number: 8795505
    Abstract: A copper electroplating method including dipping a substrate in a copper electroplating solution, the substrate including a seed layer; and forming a copper electroplating layer on the seed layer, wherein the copper electroplating solution includes water, a copper supply source, an electrolytic material, and a first additive, the first additive includes a compound represented by Formula 1, below:
    Type: Grant
    Filed: November 7, 2011
    Date of Patent: August 5, 2014
    Assignees: Samsung Electronics Co., Ltd., Adeka Corporation
    Inventors: Myung-Beom Park, Jung-Sik Choi, Ki-Hyeon Kim, Yuji Morishima, Shin-ichi Tanaka, Takashi Yamada, Takehiro Zushi
  • Publication number: 20140197038
    Abstract: An electroplating solution includes an aqueous electrolyte solution including water soluble copper salts, sulfide ions and chloride ions, an accelerator including an organic material having sulfur (S), the accelerator accelerating copper (Cu) reduction, a suppressor including a polyether compound, the suppressor selectively suppressing the copper reduction, and a leveler including a water soluble polymer having nitrogen that is dissolved into positive ions in the aqueous electrolyte solution.
    Type: Application
    Filed: January 15, 2014
    Publication date: July 17, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Myung-Beom PARK, Yun-Deok KANG, Ki-Hyeon KIM, Youn-Joung CHO, Jung-Sik CHOI
  • Publication number: 20130140076
    Abstract: Provided is a wideband electromagnetic wave (EMW) absorber including a magnetic composite having a structure in which magnetic particles are dispersed in a polymer resin, and a plurality of conductive lines arranged in the magnetic composite, and a method of manufacturing the same. The wideband EMW absorber can be used for a device configured to emit EMWs and effectively absorb wideband EMWs.
    Type: Application
    Filed: May 9, 2011
    Publication date: June 6, 2013
    Applicant: KOREA INSTITUTE OF MACHINERY & MATERIALS
    Inventors: Sang-Kwan Lee, Sang-Bok Lee, Ki Hyeon Kim, Yong-Ho Choa, Sung-Tag Oh
  • Publication number: 20120211369
    Abstract: A copper electroplating method including dipping a substrate in a copper electroplating solution, the substrate including a seed layer; and forming a copper electroplating layer on the seed layer, wherein the copper electroplating solution includes water, a copper supply source, an electrolytic material, and a first additive, the first additive includes a compound represented by Formula 1, below:
    Type: Application
    Filed: November 7, 2011
    Publication date: August 23, 2012
    Inventors: Myung-Beom Park, Jung-Sik Choi, Ki-Hyeon Kim, Yuji Morishima, Shin-ichi Tanaka, Takashi Yamada, Takehiro Zushi
  • Publication number: 20120193238
    Abstract: A composition for plating copper includes an electrolyte solution, an accelerator, a suppressor and a leveler. The electrolyte solution includes a soluble copper salt, sulfuric acid and hydrochloric acid. The accelerator includes about 20 to about 60 ppm of a disulfide compound. The suppressor includes about 40 to about 100 ppm of a polyethyleneoxide (PEO)-polypropyleneoxide (PPO)-polyethyleneoxide (PEO) triblock copolymer. The PEO-PPO-PEO triblock copolymer has a weight average molecular weight of about 300 to about 10,000. The leveler includes about 0.01 to about 100 ppm of arylated polyethyleneimine.
    Type: Application
    Filed: November 2, 2011
    Publication date: August 2, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Myung-Beom Park, Ki-Hyeon Kim, Jung-Sik Choi, Jung-Ho Lee
  • Publication number: 20070287280
    Abstract: A composition for removing a photoresist and a method of forming a bump electrode using the composition are provided. The composition includes an amine compound having a hydroxyl group, a polar organic solvent having a heteroatom, an alkylammonium hydroxide and water. The method of forming the bump electrode includes forming a conductive pattern on a substrate, forming a passivation layer on the substrate, the passivation layer having a first opening that partially exposes the conductive pattern, forming a photoresist pattern on the passivation layer, the photoresist pattern having a second opening that exposes the first opening forming a bump electrode that fills the first opening and the second opening, and removing the photoresist pattern from the substrate using a composition including an amine compound having a hydroxyl group, a polar organic solvent having a heteroatom, an alkylammonium hydroxide and water.
    Type: Application
    Filed: June 12, 2007
    Publication date: December 13, 2007
    Inventors: Dong-Min Kang, Young-Sam Lim, Gi-Jung Kim, Young-Nam Kim, Yun-Deok Kang, Ji-Sung Lee, Ki-Hyeon Kim, Kyoung-Jin Choi