Abstract: A condensation-curable resin composition which contains: (A) an organosilicon compound containing a structural unit (i) represented by the following formula (i) and a structural unit (ii) represented by the following formula (ii), having a SiOH group at both ends of the molecular chain, and having a weight average molecular weight of 10,000 or more and 10,000,000 or less; and (B) an organometallic compound having three or more condensation-reactive groups. In formula (i), each R1 is independently a hydrocarbon group having 1 to 8 carbon atoms. In formula (ii), each R2 is independently a hydrocarbon group having 1 to 8 carbon atoms.

Abstract: The disclosure relates to the thermosetting resin composition containing (A) to (D): (A) a thermosetting resin containing an SiH group and an alkenyl group, being a reaction product between silsesquioxane having an SiH group and an organopolysiloxane having two alkenyl groups; (B) a thermosetting resin having an SiH group as obtained by allowing reaction among silsesquioxane having an SiH group, organopolysiloxane having two alkenyl groups, an epoxy compound having an alkenyl group and a silyl compound having an alkenyl group; (C) a linear organopolysiloxane compound having an SiH group only at one terminal; and (D) a Pt catalyst.

Abstract: The invention relates to a thermosetting resin composition containing (A) to (D) below. (A) A thermosetting resin containing an SiH group and an alkenyl group, wherein the thermosetting resin is a reaction product between silsesquioxane having the SiH group and organopolysiloxane having two alkenyl groups; (B) a linear organopolysiloxane compound having an SiH group only at one terminal; (C) a silane coupling agent having an epoxy group; and (D) a Pt catalyst.

Abstract: The disclosure relates to the thermosetting resin composition containing (A) to (D): (A) a thermosetting resin containing an SiH group and an alkenyl group, being a reaction product between silsesquioxane having an SiH group and an organopolysiloxane having two alkenyl groups; (B) a thermosetting resin having an SiH group as obtained by allowing reaction among silsesquioxane having an SiH group, organopolysiloxane having two alkenyl groups, an epoxy compound having an alkenyl group and a silyl compound having an alkenyl group; (C) a linear organopolysiloxane compound having an SiH group only at one terminal; and (D) a Pt catalyst.

Abstract: The invention relates to a thermosetting resin composition containing (A) to (D) below. (A) A thermosetting resin containing an SiH group and an alkenyl group, wherein the thermosetting resin is a reaction product between silsesquioxane having the SiH group and organopolysiloxane having two alkenyl groups; (B) a linear organopolysiloxane compound having an SiH group only at one terminal; (C) a silane coupling agent having an epoxy group; and (D) a Pt catalyst.

Abstract: A solution is a liquid organosilicon compound represented by general formula (1) as described below: wherein, X is each independently a group represented by formula (I), formula (II) or formula (III) as described below, and when the number of the group represented by formula (I) per one molecule of the liquid organosilicon compound represented by general formula (1) is defined as a, the number of the group represented by formula (II) per one molecule thereof is defined as b, and the number of the group represented by formula (III) per one molecule thereof is defined as c, 0?a?3.5, 0?b?3.

Abstract: The invention provides an adhesion-imparting agent having heat-resistant transparency and a high refractive index best suited for an addition hardening type composition including a reaction product of silsesquioxane and organopolysiloxane. The invention relates to a compound obtained by allowing a hydrosilylation addition reaction of (A), (B), and when necessary, (C) as described below, and a compound including an organopolysiloxane or silsesquioxane skeleton including as an essential component an isocyanuric ring skeleton and an epoxy group, and having an SiH group residue: (A) a compound including an organopolysiloxane or silsesquioxane skeleton and having three or more SiH groups in one molecule; (B) an epoxy derivative having one aliphatic unsaturated group in one molecule; and (C) organopolysiloxane having two alkenyl groups in one molecule, and having a number average molecular weight of 100 to 500,000, or an isocyanurate compound having two alkenyl groups in one molecule.

Abstract: A solution is a liquid organosilicon compound represented by general formula (1) as described below: wherein, X is each independently a group represented by formula (I), formula (II) or formula (III) as described below, and when the number of the group represented by formula (I) per one molecule of the liquid organosilicon compound represented by general formula (1) is defined as a, the number of the group represented by formula (II) per one molecule thereof is defined as b, and the number of the group represented by formula (III) per one molecule thereof is defined as c, 0?a?3.5, 0?b?3.

Abstract: A liquid organosilicon compound comprising a structural unit represented by the following formula (1-a) and a structural unit represented by the following formula (1-b): In the above formula (1-a), R1 each independently is a group selected from an alkyl having 1 to 4 carbon atoms, cyclopentyl and cyclohexyl and in the above formula (1-b), R2 and R3 each independently are a group selected from an alkyl having 1 to 4 carbon atoms, cyclopentyl and cyclohexyl, and n is an integer of 2 to 50. When a mole fraction of the structural unit represented by the formula (1-a) in the liquid organosilicon compound is ? and a mole fraction of the structural unit represented by the formula (1-b) in the liquid organosilicon compound is ?, the ratio of ? and n×? (?:n×?) meets 1:3 to 1:100.

Abstract: A solution is a liquid organosilicon compound represented by general formula (1) as described below: wherein, X is each independently a group represented by formula (I), formula (II) or formula (III) as described below, and when the number of the group represented by formula (I) per one molecule of the liquid organosilicon compound represented by general formula (1) is defined as a, the number of the group represented by formula (II) per one molecule thereof is defined as b, and the number of the group represented by formula (III) per one molecule thereof is defined as c, 0?a?3.5, 0?b?3.

Abstract: The invention provides an adhesion-imparting agent having heat-resistant transparency and a high refractive index best suited for an addition hardening type composition including a reaction product of silsesquioxane and organopolysiloxane. The invention relates to a compound obtained by allowing a hydrosilylation addition reaction of (A), (B), and when necessary, (C) as described below, and a compound including an organopolysiloxane or silsesquioxane skeleton including as an essential component an isocyanuric ring skeleton and an epoxy group, and having an SiH group residue: (A) a compound including an organopolysiloxane or silsesquioxane skeleton and having three or more SiH groups in one molecule; (B) an epoxy derivative having one aliphatic unsaturated group in one molecule; and (C) organopolysiloxane having two alkenyl groups in one molecule, and having a number average molecular weight of 100 to 500,000, or an isocyanurate compound having two alkenyl groups in one molecule.

Abstract: A solution is a liquid organosilicon compound represented by general formula (1) as described below: wherein, X is each independently a group represented by formula (I), formula (II) or formula (III) as described below, and when the number of the group represented by formula (I) per one molecule of the liquid organosilicon compound represented by general formula (1) is defined as a, the number of the group represented by formula (II) per one molecule thereof is defined as b, and the number of the group represented by formula (III) per one molecule thereof is defined as c, 0?a?3.5, 0?b?3.

Abstract: A liquid organosilicon compound comprising a structural unit represented by the following formula (1-a) and a structural unit represented by the following formula (1-b): In the above formula (1-a), R1 each independently is a group selected from an alkyl having 1 to 4 carbon atoms, cyclopentyl and cyclohexyl and in the above formula (1-b), R2 and R3 each independently are a group selected from an alkyl having 1 to 4 carbon atoms, cyclopentyl and cyclohexyl, and n is an integer of 2 to 50. When a mole fraction of the structural unit represented by the formula (1-a) in the liquid organosilicon compound is ? and a mole fraction of the structural unit represented by the formula (1-b) in the liquid organosilicon compound is ?, the ratio of ? and n×? (?:n×?) meets 1:3 to 1:100.

Abstract: The present invention relates to polymerizable terminal group-containing polyorganosiloxane having a number average molecular weight of 500 to 100000 represented by the following Formula (1): wherein R1, R2, R3, R4 and R5 each represent a linear or branched alkyl group having 1 to 20 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms or an aryl-containing group having 6 to 10 carbon atoms; R6 represents a hydrogen atom, a linear or branched alkyl group having 1 to 5 carbon atoms or an aryl-containing group having 6 to 10 carbon atoms; n represents 1 or more and m represents 0 or more, in which n+m represents an average polymerization degree and is 4 to 1100; X represents an alkylene group having 2 to 20 carbon atoms; Y represents —OCH2CH2—, —OCH(CH3)CH2— or —OCH2CH(CH3)—; p represents 3 or more; and Z represents an alkylene group having 1 to 20 carbon atoms.