Patents by Inventor Kiici Mori

Kiici Mori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for preparing printed-circuit board
    Patent number: 5294519
    Abstract: A process for preparing a printed circuit board. The process involves successive steps of coating a photosensitive electrodeposition coating composition onto a printed-circuit copper-clad, laminated base plate to form a photosensitive resist film, applying a pattern mask onto the photosensitive resist film, exposing to an active light, developing and etching. Also the printed-circuit copper-clad, laminated base plate is subjected to a corrosion preventing treatment after cladding or laminating and prior to the step of coating the electrodeposition coating composition thereonto with a nitrogen-containing heterocyclic compound as a corrosion inhibitor.
    Type: Grant
    Filed: February 19, 1993
    Date of Patent: March 15, 1994
    Assignee: Kansai Paint Co., Ltd.
    Inventors: Kiici Mori, Kiyotake Fukawa, Tsutomu Maruyama