Abstract: A thermal solution for an electronic device, which is positioned between a heat source and an external surface of the electronic device and/or another component of the electronic device, where the thermal solution facilitates heat dissipation from the heat source while shielding the external surface and/or second component from the heat generated by the heat source.

Abstract: A heat-radiating structure is equipped with a heat-radiating sheet, a case and exothermic bodies. Heat-radiating sheet is equipped with a graphite sheet, and an electrically insulating elastic layer provided on surface thereof. The average thickness of graphite sheet is 300 ?m or less. Elastic layer is formed from an elastic composition containing a particulate heat-conducting filler. The average thickness of elastic layer is 10 to 280 ?m. The average particle diameter of the heat-conducting filler is 50% or less of the average thickness of elastic layer. In the elastic composition, the content of the heat-conducting filler is 30% by volume or more, and the content of heat-conducting filler in which the average particle diameter is 95% or more of the average thickness of elastic layer is less than 15% by volume. The free space within case is less than 20% of the volume of case.

Abstract: A thermally conductive member including a thermal diffusion sheet having at least one opening with an inner periphery; and a thermally conductive elastomer piece passing through the opening of the sheet is provided. The thermally conductive elastomer piece includes at least one base portion fitting with the inner periphery of the opening of the thermal diffusion sheet and at least one projecting portion connected to the base portion and projecting out from the surface of the thermal diffusion sheet.

Abstract: A heat-radiating structure is equipped with a heat-radiating sheet, a case and exothermic bodies. Heat-radiating sheet is equipped with a graphite sheet, and an electrically insulating elastic layer provided on surface thereof. The average thickness of graphite sheet is 300 ?m or less. Elastic layer is formed from an elastic composition containing a particulate heat-conducting filler. The average thickness of elastic layer is 10 to 280 ?m. The average particle diameter of the heat-conducting filler is 50% or less of the average thickness of elastic layer. In the elastic composition, the content of the heat-conducting filler is 30% by volume or more, and the content of heat-conducting filler in which the average particle diameter is 95% or more of the average thickness of elastic layer is less than 15% by volume. The free space within case is less than 20% of the volume of case.

Abstract: A thermal solution for an electronic device, which is positioned between a heat source and an external surface of the electronic device and/or another component of the electronic device, where the thermal solution facilitates heat dissipation from the heat source while shielding the external surface and/or second component from the heat generated by the heat source.

Abstract: An agent for treating metal ions in an aqueous solution, which comprises an anthrahydroquinone compound and a metal supported on a carbonaceous carrier.