Patents by Inventor Kikuo Mochizuki

Kikuo Mochizuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250215156
    Abstract: A UV-curable silicone composition includes: a polyorganosiloxane (A) having at least two alkenyl groups per molecule and having an alkenyl group content of 0.08 mmol/g or more on an average; a polyorganohydrogensiloxane (B) having per molecule at least three hydrogen atoms bonded to silicon atoms; and a platinum catalyst (C) which is capable of being activated by an ultraviolet light. With respect to a cured product that is obtained by irradiating the composition with ultraviolet light having a wavelength of 365 nm for 45 seconds at an illuminance of 100 mW/cm2 with a diameter of 7.0 mm in a yellow room and subsequently storing the resulting composition at 23° C. for 16 hours, the curing diameter at a depth of 1.8 mm is 10.8 mm or more.
    Type: Application
    Filed: March 22, 2023
    Publication date: July 3, 2025
    Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventors: Koji OKAWA, Kikuo MOCHIZUKI
  • Patent number: 12291640
    Abstract: To provide a polyorganosiloxane composition whose cured product has uniform good flame retardancy and good physical properties with less discoloring, for example, yellowing, and which has excellent temporal stability when stored. A flame-retardant polyorganosiloxane composition contains: (A) straight-chain polyalkylsiloxane having two or more alkenyl groups in one molecule and having a 10,000 to 1,000,000 mPa·s viscosity (25° C.); (B) resinoid polyorganosiloxane containing a Q unit and having 1.5 or more alkenyl groups on average, mass % of the component (B) being 30 to 80 mass % of the total of the components (A), (B); (C) polyorganohydrogensiloxane having three or more Si—H, an amount of the component (C) being such that Si—H/(total of the alkenyl groups in the components (A), (B)) becomes 1.0 to 3.0 moles; and (D) a catalytic amount of a hydrosilylation reaction catalyst, wherein the total content of phosphorus and an alkali metal is 20 mass ppm or less.
    Type: Grant
    Filed: December 11, 2020
    Date of Patent: May 6, 2025
    Assignee: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventors: Kikuo Mochizuki, Hidefumi Tagai
  • Publication number: 20250059370
    Abstract: A UV-curable silicone composition includes a polyorganosiloxane (A) containing at least two silicon-bonded alkenyl groups in the molecule; a polyorganohydrogensiloxane (B) having a branched or three-dimensional network structure and containing at least three silicon-bonded hydrogen atoms in the molecule; a polyorganohydrogensiloxane (C) having a linear or cyclic structure and containing two silicon-bonded hydrogen atoms in the molecule; and a UV-active addition reaction curing catalyst (D). The component (B) includes a polyorganohydrogensiloxane (E) having a branched or three-dimensional network structure and containing at least one silicon-bonded alkoxy group SiOR0 (R0 is a C1-C5 alkyl group) and at least three silicon-bonded hydrogen atoms in the molecule.
    Type: Application
    Filed: December 13, 2022
    Publication date: February 20, 2025
    Applicant: MOMENTIVE PERFORMANCE MATERIALS INC.
    Inventor: Kikuo MOCHIZUKI
  • Publication number: 20250051570
    Abstract: A UV-curable silicone composition includes a polyorganosiloxane (A) containing at least one alkenyl group in the molecule and having an alkenyl group content of 0.3 mmol/g or less on average; a polyorganohydrogensiloxane (B) having at least three silicon-bonded hydrogen atoms in the molecule; and a UV-active platinum catalyst (C).
    Type: Application
    Filed: December 13, 2022
    Publication date: February 13, 2025
    Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventor: Kikuo MOCHIZUKI
  • Patent number: 12163025
    Abstract: There is provided a polyorganosiloxane composition capable of providing a cured product which has low hardness, high transparency, high tensile strength, and low surface tackiness. A curable polyorganosiloxane composition includes: (A) alkenyl group-containing polyorganosiloxane containing straight-chained polyorganosiloxane composed of (A1) both ends alkenyl group polyorganosiloxane having a predetermined viscosity and (A2) polyorganosiloxane having a predetermined viscosity and having 0.6 or more and less than 2 alkenyl groups on average, and (A3) resinous polyorganosiloxane; (B) polyorganohydrogensiloxane composed of (B1) both ends Si—H-containing straight-chained polyorganosiloxane, and (B2) polyorganosiloxane having 3 or more Si—H; and (C) a hydrosilylation reaction catalyst, in mounts that satisfy predetermined relationships.
    Type: Grant
    Filed: May 24, 2021
    Date of Patent: December 10, 2024
    Assignee: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventors: Kikuo Mochizuki, Masahiro Fujita
  • Patent number: 12065567
    Abstract: To provide a method of manufacturing a silicone cured product and a silicone cured product which allow generation of a volatile component to be reduced significantly even being exposed to high temperatures of room temperature or more for a long time. A method of manufacturing a silicone cured product includes: curing an additional polyorganosiloxane composition by hydrosilylation reaction under closed atmosphere at a temperature of 40° C. or more and 200° C. or less to obtain a primary cured product; and heating the primary cured product under open atmosphere or reduced pressure at a temperature of 60° C. or more and 160° C. or less, and a silicone cured product in which when heated at 150° C. for 16 hours, a total generation amount of an alcohol having 1 to 3 carbon atoms and an oxide thereof, and an alkyl group-containing silane compound having 1 to 3 carbon atoms is 10 ppm or less.
    Type: Grant
    Filed: December 11, 2020
    Date of Patent: August 20, 2024
    Assignee: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventor: Kikuo Mochizuki
  • Publication number: 20210277241
    Abstract: There is provided a polyorganosiloxane composition capable of providing a cured product which has low hardness, high transparency, high tensile strength, and low surface tackiness. A curable polyorganosiloxane composition includes: (A) alkenyl group-containing polyorganosiloxane containing straight-chained polyorganosiloxane composed of (A1) both ends alkenyl group polyorganosiloxane having a predetermined viscosity and (A2) polyorganosiloxane having a predetermined viscosity and having 0.6 or more and less than 2 alkenyl groups on average, and (A3) resinous polyorganosiloxane; (B) polyorganohydrogensiloxane composed of (B1) both ends Si—H-containing straight-chained polyorganosiloxane, and (B2) polyorganosiloxane having 3 or more Si—H; and (C) a hydrosilylation reaction catalyst, in mounts that satisfy predetermined relationships.
    Type: Application
    Filed: May 24, 2021
    Publication date: September 9, 2021
    Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventors: Kikuo MOCHIZUKI, Masahiro FUJITA
  • Publication number: 20210102070
    Abstract: To provide a polyorganosiloxane composition whose cured product has uniform good flame retardancy and good physical properties with less discoloring, for example, yellowing, and which has excellent temporal stability when stored. A flame-retardant polyorganosiloxane composition contains: (A) straight-chain polyalkylsiloxane having two or more alkenyl groups in one molecule and having a 10,000 to 1,000,000 mPa·s viscosity (25° C.); (B) resinoid polyorganosiloxane containing a Q unit and having 1.5 or more alkenyl groups on average, mass % of the component (B) being 30 to 80 mass % of the total of the components (A), (B); (C) polyorganohydrogensiloxane having three or more Si—H, an amount of the component (C) being such that Si—H/(total of the alkenyl groups in the components (A), (B)) becomes 1.0 to 3.0 moles; and (D) a catalytic amount of a hydrosilylation reaction catalyst, wherein the total content of phosphorus and an alkali metal is 20 mass ppm or less.
    Type: Application
    Filed: December 11, 2020
    Publication date: April 8, 2021
    Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventors: Kikuo MOCHIZUKI, Hidefumi TAGAI
  • Publication number: 20210102069
    Abstract: To provide a polyorganosiloxane composition with good moldability, and a cured product with good mold release property and excellent non-contamination property to the metal mold. A polyorganosiloxane composition for molding includes: (A) a straight-chain polyorganosiloxane having two or more alkenyl groups in one molecule, and having a viscosity (at 25° C.) of 10,000 to 1,000,000 mPa·s; (B) 30 to 80 mass % of a resinoid polyorganosiloxane containing Q units, and having 1.5 or more alkenyl groups on average in one molecule, to a total of the components (A) and (B); (C) a polyorganohydrogensiloxane containing M units and Q units, having a molar ratio of alkoxy groups and Si—H of less than 0.15, and having a mass decrease rate when heated at 150° C. for 30 minutes of 2.0% or less, wherein an amount of the (Si—H/alkenyl groups) is 1.0 to 3.0 mol; and (D) a catalytic amount of a hydrosilylation reaction catalyst.
    Type: Application
    Filed: December 11, 2020
    Publication date: April 8, 2021
    Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventor: Kikuo MOCHIZUKI
  • Publication number: 20210095126
    Abstract: To provide a method of manufacturing a silicone cured product and a silicone cured product which allow generation of a volatile component to be reduced significantly even being exposed to high temperatures of room temperature or more for a long time. A method of manufacturing a silicone cured product includes: curing an additional polyorganosiloxane composition by hydrosilylation reaction under closed atmosphere at a temperature of 40° C. or more and 200° C. or less to obtain a primary cured product; and heating the primary cured product under open atmosphere or reduced pressure at a temperature of 60° C. or more and 160° C. or less, and a silicone cured product in which when heated at 150° C. for 16 hours, a total generation amount of an alcohol having 1 to 3 carbon atoms and an oxide thereof, and an alkyl group-containing silane compound having 1 to 3 carbon atoms is 10 ppm or less.
    Type: Application
    Filed: December 11, 2020
    Publication date: April 1, 2021
    Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventor: Kikuo MOCHIZUKI
  • Patent number: 10752774
    Abstract: A polyorganosiloxane composition for molding includes: (A) a straight-chain polyorganosiloxane having two or more alkenyl groups and having a viscosity (25° C.) of 10,000 to 500,000 mPa·s; (B) 30 to 80 mass % of a resinoid polyorganosiloxane including M, D, and Q units, at a molar ratio of a:b:c, on average (0.3?a?0.6, 0?b?0.1, 0.4?c?0.7, and a+b+c=1), and having two or more alkenyl groups; (C) an amount of a polyorganohydrogensiloxane having Si-bonded hydrogen atoms, an average degree of polymerization of 10 or more, a content of the Si-bonded hydrogen atoms of 5.0 mmol/g or more and 11.0 mmol/g or less, and a mass decrease rate up to 140° C. by TGA of 2.0 mass % or less so that an amount of the (Si-bonded hydrogen atoms/alkenyl groups) is 1.0 to 3.0 mol; and (D) a hydrosilylation reaction catalyst. A cured product excellent in mold release property is obtained and contamination of a metal mold is prevented.
    Type: Grant
    Filed: June 15, 2017
    Date of Patent: August 25, 2020
    Assignee: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventors: Kikuo Mochizuki, Hidefumi Tagai, Masanari Shimakawa, Kazuki Shinbo
  • Patent number: 10301473
    Abstract: This flame-retardant polyorganosiloxane includes (A) a straight-chain polyorganosiloxane having two or more alkenyl groups in one molecule and whose viscosity (25° C.) is 10,000 to 1,000,000 mPa·s; (B) 30 to 80 mass % of a resinoid polyorganosiloxane which includes Q unit and has 1.5 or more alkenyl groups on average, and in which a molar ratio of alkoxy groups to alkyl groups is 0.030 or less; (C) an amount of a polyorganohydrogensiloxane, whose average degree of polymerization is 10 or more, and in which a Si—H content is 5.0 mmol/g or more, in which Si—H/(a total of alkenyl groups) is 1.0 to 3.0 mol; and (D) a hydrosilylation reaction catalyst. A flame-retardant polyorganosiloxane composition capable of reducing an amount of a platinum-based metal compound is provided.
    Type: Grant
    Filed: June 15, 2017
    Date of Patent: May 28, 2019
    Assignee: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventor: Kikuo Mochizuki
  • Publication number: 20170283613
    Abstract: This flame-retardant polyorganosiloxane includes (A) a straight-chain polyorganosiloxane having two or more alkenyl groups in one molecule and whose viscosity (25° C.) is 10,000 to 1,000,000 mPa·s; (B) 30 to 80 mass % of a resinoid polyorganosiloxane which includes Q unit and has 1.5 or more alkenyl groups on average, and in which a molar ratio of alkoxy groups to alkyl groups is 0.030 or less; (C) an amount of a polyorganohydrogensiloxane, whose average degree of polymerization is 10 or more, and in which a Si—H content is 5.0 mmol/g or more, in which Si—H/(a total of alkenyl groups) is 1.0 to 3.0 mol; and (D) a hydrosilylation reaction catalyst. A flame-retardant polyorganosiloxane composition capable of reducing an amount of a platinum-based metal compound is provided.
    Type: Application
    Filed: June 15, 2017
    Publication date: October 5, 2017
    Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventor: Kikuo MOCHIZUKI
  • Publication number: 20170283614
    Abstract: A polyorganosiloxane composition for molding includes: (A) a straight-chain polyorganosiloxane having two or more alkenyl groups and having a viscosity (25° C.) of 10,000 to 500,000 mPa·s; (B) 30 to 80 mass % of a resinoid polyorganosiloxane including M, D, and Q units, at a molar ratio of a:b:c, on average (0.3?a?0.6, 0?b?0.1, 0.4?c?0.7, and a+b+c=1), and having two or more alkenyl groups; (C) an amount of a polyorganohydrogensiloxane having Si-bonded hydrogen atoms, an average degree of polymerization of 10 or more, a content of the Si-bonded hydrogen atoms of 5.0 mmol/g or more and 11.0 mmol/g or less, and a mass decrease rate up to 140° C. by TGA of 2.0 mass % or less so that an amount of the (Si-bonded hydrogen atoms/alkenyl groups) is 1.0 to 3.0 mol; and (D) a hydrosilylation reaction catalyst. A cured product excellent in mold release property is obtained and contamination of a metal mold is prevented.
    Type: Application
    Filed: June 15, 2017
    Publication date: October 5, 2017
    Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventors: Kikuo MOCHIZUKI, Hidefumi TAGAI, Masanari SHIMAKAWA, Kazuki SHINBO
  • Patent number: 9564562
    Abstract: The silicone composition for sealing a semiconductor, comprises: (A) 100 parts of a polyorganosiloxane having one or more alkenyl groups, obtained by reacting (a1) 60 to 99 parts of an organosiloxane containing at least a trifunctional siloxane unit not taking part in a hydrosilylation reaction, with (a2) 40 to 1 parts of an organosiloxane containing a bifunctional siloxane unit having an alkenyl group and/or a monofunctional siloxane unit having an alkenyl group; (B) an amount of a polyorganohydrogensiloxane having two or more hydrogen atoms having a viscosity at 25° C. of 1 to 1000 mPa·s so that an amount of the hydrogen atoms is 0.5 to 3.0 mol per mol of the alkenyl groups; and (C) a platinum-based catalysts, wherein a decrease in storage modulus of a cured product thereof from 25° C. to 50° C. is 40% or more.
    Type: Grant
    Filed: June 4, 2015
    Date of Patent: February 7, 2017
    Assignee: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventors: Kikuo Mochizuki, Akira Takagi
  • Publication number: 20150270460
    Abstract: The silicone composition for sealing a semiconductor, comprises: (A) 100 parts of a polyorganosiloxane having one or more alkenyl groups, obtained by reacting (a1) 60 to 99 parts of an organosiloxane containing at least a trifunctional siloxane unit not taking part in a hydrosilylation reaction, with (a2) 40 to 1 parts of an organosiloxane containing a bifunctional siloxane unit having an alkenyl group and/or a monofunctional siloxane unit having an alkenyl group; (B) an amount of a polyorganohydrogensiloxane having two or more hydrogen atoms having a viscosity at 25° C. of 1 to 1000 mPa·s so that an amount of the hydrogen atoms is 0.5 to 3.0 mol per mol of the alkenyl groups; and (C) a platinum-based catalysts, wherein a decrease in storage modulus of a cured product thereof from 25° C. to 50° C. is 40% or more.
    Type: Application
    Filed: June 4, 2015
    Publication date: September 24, 2015
    Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventors: Kikuo MOCHIZUKI, Akira TAKAGI
  • Publication number: 20140088232
    Abstract: The silicone composition for sealing a semiconductor, comprises: (A) 100 parts of a polyorganosiloxane having one or more alkenyl groups, obtained by reacting (a1) 60 to 99 parts of an organosiloxane containing at least a trifunctional siloxane unit not taking part in a hydrosilylation reaction, with (a2) 40 to 1 parts of an organosiloxane containing a bifunctional siloxane unit having an alkenyl group and/or a monofunctional siloxane unit having an alkenyl group; (B) an amount of a polyorganohydrogensiloxane having two or more hydrogen atoms having a viscosity at 25° C. of 1 to 1000 mPa·s so that an amount of the hydrogen atoms is 0.5 to 3.0 mol per mol of the alkenyl groups; and (C) a platinum-based catalyst, wherein a decrease in storage modulus of a cured product thereof from 25° C. to 50° C. is 40% or more.
    Type: Application
    Filed: November 27, 2013
    Publication date: March 27, 2014
    Applicant: Momentive Performance Materials Japan LLC
    Inventors: Kikuo MOCHIZUKI, Akira Takagi
  • Patent number: 8637628
    Abstract: One embodiment is related to a silicone composition for sealing a light emitting element, the composition comprising: (A) a vinyl group-containing organopolysiloxane having a three-dimensional network structure; (B) an organohydrogenpolysiloxane which has at least two hydrogen atoms, each hydrogen atom being bonded to a silicon atom per molecule; and (C) a hydrosilylation catalyst.
    Type: Grant
    Filed: June 5, 2012
    Date of Patent: January 28, 2014
    Assignee: Momentive Performance Materials Japan LLC
    Inventors: Kikuo Mochizuki, Nobuo Hirai
  • Publication number: 20120306363
    Abstract: One embodiment is related to a silicone composition for sealing a light emitting element, the composition comprising: (A) a vinyl group-containing organopolysiloxane having a three-dimensional network structure; (B) an organohydrogenpolysiloxane which has at least two hydrogen atoms, each hydrogen atom being bonded to a silicon atom per molecule; and (C) a hydrosilylation catalyst.
    Type: Application
    Filed: June 5, 2012
    Publication date: December 6, 2012
    Inventors: Kikuo MOCHIZUKI, Nobuo HIRAI
  • Patent number: 8293849
    Abstract: A silicone composition for sealing a light emitting element includes: (A) a vinyl group-containing organopolysiloxane having a three-dimensional network structure represented by an average unit formula: (SiO4/2)a(ViR2SiO1/2)b(R3SiO1/2)c (where Vi represents a vinyl group, R's are identical or different substituted or unsubstituted monovalent hydrocarbon groups other than alkenyl groups, and a, b, and c are positive numbers satisfying that a/(a+b+c) is 0.2 to 0.6 and b/(a+b+c) is 0.001 to 0.2); (B) an organohydrogenpolysiloxane which has at least two hydrogen atoms, each hydrogen atom being bonded to a silicon atom per molecule, the organohydrogenpolysiloxane being contained in such an amount that an amount of a hydrogen atom bonded to a silicon atom is 0.3 to 3.0 mol per 1 mol of a vinyl group bonded to a silicon atom in the component (A); and (C) a hydrosilylation catalyst (catalytic amount), wherein a coefficient of linear expansion of the composition after curing is 10×10?6 to 290×10?6/° C.
    Type: Grant
    Filed: July 22, 2005
    Date of Patent: October 23, 2012
    Assignee: Momentive Performance Materials Japan LLC
    Inventors: Kikuo Mochizuki, Nobuo Hirai