Patents by Inventor Kikuo Mochizuki
Kikuo Mochizuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250215156Abstract: A UV-curable silicone composition includes: a polyorganosiloxane (A) having at least two alkenyl groups per molecule and having an alkenyl group content of 0.08 mmol/g or more on an average; a polyorganohydrogensiloxane (B) having per molecule at least three hydrogen atoms bonded to silicon atoms; and a platinum catalyst (C) which is capable of being activated by an ultraviolet light. With respect to a cured product that is obtained by irradiating the composition with ultraviolet light having a wavelength of 365 nm for 45 seconds at an illuminance of 100 mW/cm2 with a diameter of 7.0 mm in a yellow room and subsequently storing the resulting composition at 23° C. for 16 hours, the curing diameter at a depth of 1.8 mm is 10.8 mm or more.Type: ApplicationFiled: March 22, 2023Publication date: July 3, 2025Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLCInventors: Koji OKAWA, Kikuo MOCHIZUKI
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Patent number: 12291640Abstract: To provide a polyorganosiloxane composition whose cured product has uniform good flame retardancy and good physical properties with less discoloring, for example, yellowing, and which has excellent temporal stability when stored. A flame-retardant polyorganosiloxane composition contains: (A) straight-chain polyalkylsiloxane having two or more alkenyl groups in one molecule and having a 10,000 to 1,000,000 mPa·s viscosity (25° C.); (B) resinoid polyorganosiloxane containing a Q unit and having 1.5 or more alkenyl groups on average, mass % of the component (B) being 30 to 80 mass % of the total of the components (A), (B); (C) polyorganohydrogensiloxane having three or more Si—H, an amount of the component (C) being such that Si—H/(total of the alkenyl groups in the components (A), (B)) becomes 1.0 to 3.0 moles; and (D) a catalytic amount of a hydrosilylation reaction catalyst, wherein the total content of phosphorus and an alkali metal is 20 mass ppm or less.Type: GrantFiled: December 11, 2020Date of Patent: May 6, 2025Assignee: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLCInventors: Kikuo Mochizuki, Hidefumi Tagai
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Publication number: 20250059370Abstract: A UV-curable silicone composition includes a polyorganosiloxane (A) containing at least two silicon-bonded alkenyl groups in the molecule; a polyorganohydrogensiloxane (B) having a branched or three-dimensional network structure and containing at least three silicon-bonded hydrogen atoms in the molecule; a polyorganohydrogensiloxane (C) having a linear or cyclic structure and containing two silicon-bonded hydrogen atoms in the molecule; and a UV-active addition reaction curing catalyst (D). The component (B) includes a polyorganohydrogensiloxane (E) having a branched or three-dimensional network structure and containing at least one silicon-bonded alkoxy group SiOR0 (R0 is a C1-C5 alkyl group) and at least three silicon-bonded hydrogen atoms in the molecule.Type: ApplicationFiled: December 13, 2022Publication date: February 20, 2025Applicant: MOMENTIVE PERFORMANCE MATERIALS INC.Inventor: Kikuo MOCHIZUKI
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Publication number: 20250051570Abstract: A UV-curable silicone composition includes a polyorganosiloxane (A) containing at least one alkenyl group in the molecule and having an alkenyl group content of 0.3 mmol/g or less on average; a polyorganohydrogensiloxane (B) having at least three silicon-bonded hydrogen atoms in the molecule; and a UV-active platinum catalyst (C).Type: ApplicationFiled: December 13, 2022Publication date: February 13, 2025Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLCInventor: Kikuo MOCHIZUKI
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Patent number: 12163025Abstract: There is provided a polyorganosiloxane composition capable of providing a cured product which has low hardness, high transparency, high tensile strength, and low surface tackiness. A curable polyorganosiloxane composition includes: (A) alkenyl group-containing polyorganosiloxane containing straight-chained polyorganosiloxane composed of (A1) both ends alkenyl group polyorganosiloxane having a predetermined viscosity and (A2) polyorganosiloxane having a predetermined viscosity and having 0.6 or more and less than 2 alkenyl groups on average, and (A3) resinous polyorganosiloxane; (B) polyorganohydrogensiloxane composed of (B1) both ends Si—H-containing straight-chained polyorganosiloxane, and (B2) polyorganosiloxane having 3 or more Si—H; and (C) a hydrosilylation reaction catalyst, in mounts that satisfy predetermined relationships.Type: GrantFiled: May 24, 2021Date of Patent: December 10, 2024Assignee: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLCInventors: Kikuo Mochizuki, Masahiro Fujita
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Patent number: 12065567Abstract: To provide a method of manufacturing a silicone cured product and a silicone cured product which allow generation of a volatile component to be reduced significantly even being exposed to high temperatures of room temperature or more for a long time. A method of manufacturing a silicone cured product includes: curing an additional polyorganosiloxane composition by hydrosilylation reaction under closed atmosphere at a temperature of 40° C. or more and 200° C. or less to obtain a primary cured product; and heating the primary cured product under open atmosphere or reduced pressure at a temperature of 60° C. or more and 160° C. or less, and a silicone cured product in which when heated at 150° C. for 16 hours, a total generation amount of an alcohol having 1 to 3 carbon atoms and an oxide thereof, and an alkyl group-containing silane compound having 1 to 3 carbon atoms is 10 ppm or less.Type: GrantFiled: December 11, 2020Date of Patent: August 20, 2024Assignee: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLCInventor: Kikuo Mochizuki
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Publication number: 20210277241Abstract: There is provided a polyorganosiloxane composition capable of providing a cured product which has low hardness, high transparency, high tensile strength, and low surface tackiness. A curable polyorganosiloxane composition includes: (A) alkenyl group-containing polyorganosiloxane containing straight-chained polyorganosiloxane composed of (A1) both ends alkenyl group polyorganosiloxane having a predetermined viscosity and (A2) polyorganosiloxane having a predetermined viscosity and having 0.6 or more and less than 2 alkenyl groups on average, and (A3) resinous polyorganosiloxane; (B) polyorganohydrogensiloxane composed of (B1) both ends Si—H-containing straight-chained polyorganosiloxane, and (B2) polyorganosiloxane having 3 or more Si—H; and (C) a hydrosilylation reaction catalyst, in mounts that satisfy predetermined relationships.Type: ApplicationFiled: May 24, 2021Publication date: September 9, 2021Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLCInventors: Kikuo MOCHIZUKI, Masahiro FUJITA
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Publication number: 20210102070Abstract: To provide a polyorganosiloxane composition whose cured product has uniform good flame retardancy and good physical properties with less discoloring, for example, yellowing, and which has excellent temporal stability when stored. A flame-retardant polyorganosiloxane composition contains: (A) straight-chain polyalkylsiloxane having two or more alkenyl groups in one molecule and having a 10,000 to 1,000,000 mPa·s viscosity (25° C.); (B) resinoid polyorganosiloxane containing a Q unit and having 1.5 or more alkenyl groups on average, mass % of the component (B) being 30 to 80 mass % of the total of the components (A), (B); (C) polyorganohydrogensiloxane having three or more Si—H, an amount of the component (C) being such that Si—H/(total of the alkenyl groups in the components (A), (B)) becomes 1.0 to 3.0 moles; and (D) a catalytic amount of a hydrosilylation reaction catalyst, wherein the total content of phosphorus and an alkali metal is 20 mass ppm or less.Type: ApplicationFiled: December 11, 2020Publication date: April 8, 2021Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLCInventors: Kikuo MOCHIZUKI, Hidefumi TAGAI
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Publication number: 20210102069Abstract: To provide a polyorganosiloxane composition with good moldability, and a cured product with good mold release property and excellent non-contamination property to the metal mold. A polyorganosiloxane composition for molding includes: (A) a straight-chain polyorganosiloxane having two or more alkenyl groups in one molecule, and having a viscosity (at 25° C.) of 10,000 to 1,000,000 mPa·s; (B) 30 to 80 mass % of a resinoid polyorganosiloxane containing Q units, and having 1.5 or more alkenyl groups on average in one molecule, to a total of the components (A) and (B); (C) a polyorganohydrogensiloxane containing M units and Q units, having a molar ratio of alkoxy groups and Si—H of less than 0.15, and having a mass decrease rate when heated at 150° C. for 30 minutes of 2.0% or less, wherein an amount of the (Si—H/alkenyl groups) is 1.0 to 3.0 mol; and (D) a catalytic amount of a hydrosilylation reaction catalyst.Type: ApplicationFiled: December 11, 2020Publication date: April 8, 2021Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLCInventor: Kikuo MOCHIZUKI
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Publication number: 20210095126Abstract: To provide a method of manufacturing a silicone cured product and a silicone cured product which allow generation of a volatile component to be reduced significantly even being exposed to high temperatures of room temperature or more for a long time. A method of manufacturing a silicone cured product includes: curing an additional polyorganosiloxane composition by hydrosilylation reaction under closed atmosphere at a temperature of 40° C. or more and 200° C. or less to obtain a primary cured product; and heating the primary cured product under open atmosphere or reduced pressure at a temperature of 60° C. or more and 160° C. or less, and a silicone cured product in which when heated at 150° C. for 16 hours, a total generation amount of an alcohol having 1 to 3 carbon atoms and an oxide thereof, and an alkyl group-containing silane compound having 1 to 3 carbon atoms is 10 ppm or less.Type: ApplicationFiled: December 11, 2020Publication date: April 1, 2021Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLCInventor: Kikuo MOCHIZUKI
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Patent number: 10752774Abstract: A polyorganosiloxane composition for molding includes: (A) a straight-chain polyorganosiloxane having two or more alkenyl groups and having a viscosity (25° C.) of 10,000 to 500,000 mPa·s; (B) 30 to 80 mass % of a resinoid polyorganosiloxane including M, D, and Q units, at a molar ratio of a:b:c, on average (0.3?a?0.6, 0?b?0.1, 0.4?c?0.7, and a+b+c=1), and having two or more alkenyl groups; (C) an amount of a polyorganohydrogensiloxane having Si-bonded hydrogen atoms, an average degree of polymerization of 10 or more, a content of the Si-bonded hydrogen atoms of 5.0 mmol/g or more and 11.0 mmol/g or less, and a mass decrease rate up to 140° C. by TGA of 2.0 mass % or less so that an amount of the (Si-bonded hydrogen atoms/alkenyl groups) is 1.0 to 3.0 mol; and (D) a hydrosilylation reaction catalyst. A cured product excellent in mold release property is obtained and contamination of a metal mold is prevented.Type: GrantFiled: June 15, 2017Date of Patent: August 25, 2020Assignee: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLCInventors: Kikuo Mochizuki, Hidefumi Tagai, Masanari Shimakawa, Kazuki Shinbo
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Patent number: 10301473Abstract: This flame-retardant polyorganosiloxane includes (A) a straight-chain polyorganosiloxane having two or more alkenyl groups in one molecule and whose viscosity (25° C.) is 10,000 to 1,000,000 mPa·s; (B) 30 to 80 mass % of a resinoid polyorganosiloxane which includes Q unit and has 1.5 or more alkenyl groups on average, and in which a molar ratio of alkoxy groups to alkyl groups is 0.030 or less; (C) an amount of a polyorganohydrogensiloxane, whose average degree of polymerization is 10 or more, and in which a Si—H content is 5.0 mmol/g or more, in which Si—H/(a total of alkenyl groups) is 1.0 to 3.0 mol; and (D) a hydrosilylation reaction catalyst. A flame-retardant polyorganosiloxane composition capable of reducing an amount of a platinum-based metal compound is provided.Type: GrantFiled: June 15, 2017Date of Patent: May 28, 2019Assignee: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLCInventor: Kikuo Mochizuki
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Publication number: 20170283613Abstract: This flame-retardant polyorganosiloxane includes (A) a straight-chain polyorganosiloxane having two or more alkenyl groups in one molecule and whose viscosity (25° C.) is 10,000 to 1,000,000 mPa·s; (B) 30 to 80 mass % of a resinoid polyorganosiloxane which includes Q unit and has 1.5 or more alkenyl groups on average, and in which a molar ratio of alkoxy groups to alkyl groups is 0.030 or less; (C) an amount of a polyorganohydrogensiloxane, whose average degree of polymerization is 10 or more, and in which a Si—H content is 5.0 mmol/g or more, in which Si—H/(a total of alkenyl groups) is 1.0 to 3.0 mol; and (D) a hydrosilylation reaction catalyst. A flame-retardant polyorganosiloxane composition capable of reducing an amount of a platinum-based metal compound is provided.Type: ApplicationFiled: June 15, 2017Publication date: October 5, 2017Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLCInventor: Kikuo MOCHIZUKI
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Publication number: 20170283614Abstract: A polyorganosiloxane composition for molding includes: (A) a straight-chain polyorganosiloxane having two or more alkenyl groups and having a viscosity (25° C.) of 10,000 to 500,000 mPa·s; (B) 30 to 80 mass % of a resinoid polyorganosiloxane including M, D, and Q units, at a molar ratio of a:b:c, on average (0.3?a?0.6, 0?b?0.1, 0.4?c?0.7, and a+b+c=1), and having two or more alkenyl groups; (C) an amount of a polyorganohydrogensiloxane having Si-bonded hydrogen atoms, an average degree of polymerization of 10 or more, a content of the Si-bonded hydrogen atoms of 5.0 mmol/g or more and 11.0 mmol/g or less, and a mass decrease rate up to 140° C. by TGA of 2.0 mass % or less so that an amount of the (Si-bonded hydrogen atoms/alkenyl groups) is 1.0 to 3.0 mol; and (D) a hydrosilylation reaction catalyst. A cured product excellent in mold release property is obtained and contamination of a metal mold is prevented.Type: ApplicationFiled: June 15, 2017Publication date: October 5, 2017Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLCInventors: Kikuo MOCHIZUKI, Hidefumi TAGAI, Masanari SHIMAKAWA, Kazuki SHINBO
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Patent number: 9564562Abstract: The silicone composition for sealing a semiconductor, comprises: (A) 100 parts of a polyorganosiloxane having one or more alkenyl groups, obtained by reacting (a1) 60 to 99 parts of an organosiloxane containing at least a trifunctional siloxane unit not taking part in a hydrosilylation reaction, with (a2) 40 to 1 parts of an organosiloxane containing a bifunctional siloxane unit having an alkenyl group and/or a monofunctional siloxane unit having an alkenyl group; (B) an amount of a polyorganohydrogensiloxane having two or more hydrogen atoms having a viscosity at 25° C. of 1 to 1000 mPa·s so that an amount of the hydrogen atoms is 0.5 to 3.0 mol per mol of the alkenyl groups; and (C) a platinum-based catalysts, wherein a decrease in storage modulus of a cured product thereof from 25° C. to 50° C. is 40% or more.Type: GrantFiled: June 4, 2015Date of Patent: February 7, 2017Assignee: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLCInventors: Kikuo Mochizuki, Akira Takagi
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Publication number: 20150270460Abstract: The silicone composition for sealing a semiconductor, comprises: (A) 100 parts of a polyorganosiloxane having one or more alkenyl groups, obtained by reacting (a1) 60 to 99 parts of an organosiloxane containing at least a trifunctional siloxane unit not taking part in a hydrosilylation reaction, with (a2) 40 to 1 parts of an organosiloxane containing a bifunctional siloxane unit having an alkenyl group and/or a monofunctional siloxane unit having an alkenyl group; (B) an amount of a polyorganohydrogensiloxane having two or more hydrogen atoms having a viscosity at 25° C. of 1 to 1000 mPa·s so that an amount of the hydrogen atoms is 0.5 to 3.0 mol per mol of the alkenyl groups; and (C) a platinum-based catalysts, wherein a decrease in storage modulus of a cured product thereof from 25° C. to 50° C. is 40% or more.Type: ApplicationFiled: June 4, 2015Publication date: September 24, 2015Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLCInventors: Kikuo MOCHIZUKI, Akira TAKAGI
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Publication number: 20140088232Abstract: The silicone composition for sealing a semiconductor, comprises: (A) 100 parts of a polyorganosiloxane having one or more alkenyl groups, obtained by reacting (a1) 60 to 99 parts of an organosiloxane containing at least a trifunctional siloxane unit not taking part in a hydrosilylation reaction, with (a2) 40 to 1 parts of an organosiloxane containing a bifunctional siloxane unit having an alkenyl group and/or a monofunctional siloxane unit having an alkenyl group; (B) an amount of a polyorganohydrogensiloxane having two or more hydrogen atoms having a viscosity at 25° C. of 1 to 1000 mPa·s so that an amount of the hydrogen atoms is 0.5 to 3.0 mol per mol of the alkenyl groups; and (C) a platinum-based catalyst, wherein a decrease in storage modulus of a cured product thereof from 25° C. to 50° C. is 40% or more.Type: ApplicationFiled: November 27, 2013Publication date: March 27, 2014Applicant: Momentive Performance Materials Japan LLCInventors: Kikuo MOCHIZUKI, Akira Takagi
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Patent number: 8637628Abstract: One embodiment is related to a silicone composition for sealing a light emitting element, the composition comprising: (A) a vinyl group-containing organopolysiloxane having a three-dimensional network structure; (B) an organohydrogenpolysiloxane which has at least two hydrogen atoms, each hydrogen atom being bonded to a silicon atom per molecule; and (C) a hydrosilylation catalyst.Type: GrantFiled: June 5, 2012Date of Patent: January 28, 2014Assignee: Momentive Performance Materials Japan LLCInventors: Kikuo Mochizuki, Nobuo Hirai
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Publication number: 20120306363Abstract: One embodiment is related to a silicone composition for sealing a light emitting element, the composition comprising: (A) a vinyl group-containing organopolysiloxane having a three-dimensional network structure; (B) an organohydrogenpolysiloxane which has at least two hydrogen atoms, each hydrogen atom being bonded to a silicon atom per molecule; and (C) a hydrosilylation catalyst.Type: ApplicationFiled: June 5, 2012Publication date: December 6, 2012Inventors: Kikuo MOCHIZUKI, Nobuo HIRAI
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Patent number: 8293849Abstract: A silicone composition for sealing a light emitting element includes: (A) a vinyl group-containing organopolysiloxane having a three-dimensional network structure represented by an average unit formula: (SiO4/2)a(ViR2SiO1/2)b(R3SiO1/2)c (where Vi represents a vinyl group, R's are identical or different substituted or unsubstituted monovalent hydrocarbon groups other than alkenyl groups, and a, b, and c are positive numbers satisfying that a/(a+b+c) is 0.2 to 0.6 and b/(a+b+c) is 0.001 to 0.2); (B) an organohydrogenpolysiloxane which has at least two hydrogen atoms, each hydrogen atom being bonded to a silicon atom per molecule, the organohydrogenpolysiloxane being contained in such an amount that an amount of a hydrogen atom bonded to a silicon atom is 0.3 to 3.0 mol per 1 mol of a vinyl group bonded to a silicon atom in the component (A); and (C) a hydrosilylation catalyst (catalytic amount), wherein a coefficient of linear expansion of the composition after curing is 10×10?6 to 290×10?6/° C.Type: GrantFiled: July 22, 2005Date of Patent: October 23, 2012Assignee: Momentive Performance Materials Japan LLCInventors: Kikuo Mochizuki, Nobuo Hirai