Patents by Inventor Kikuo Takenouchi

Kikuo Takenouchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin encapsulated semiconductor device
    Patent number: 5289039
    Abstract: A resin encapsulated pin grid array includes an IC chip mounted on a resin substrate having a plurality of contact pins on its lower surface and resin-encapsulated by injection molding. A metal heat radiating member is integrally formed on the upper surface of the encapsulating resin when the encapsulating resin is injection-molded.
    Type: Grant
    Filed: July 7, 1992
    Date of Patent: February 22, 1994
    Assignee: Citizen Watch Co., Ltd.
    Inventors: Yoshihiro Ishida, Katsuji Komatsu, Seiichi Mimura, Kikuo Takenouchi, Isao Yabe, Shingo Ichikawa, Yoshihiro Shimada
  • Resin encapsulated pin grid array and method of manufacturing the same
    Patent number: 5233225
    Abstract: A resin encapsulated pin grid array includes an IC chip mounted on a resin substrate having a plurality of contact pins on its lower surface and resin-encapsulated by injection molding. A metal heat radiating member is integrally formed on the upper surface of the encapsulating resin when the encapsulating resin is injection-molded.
    Type: Grant
    Filed: August 23, 1991
    Date of Patent: August 3, 1993
    Assignee: Citizen Watch Co., Ltd.
    Inventors: Yoshihiro Ishida, Katsuji Komatsu, Seiichi Mimura, Kikuo Takenouchi, Isao Yabe, Shingo Ichikawa, Yoshihiro Shimada
  • Method of making a resin encapsulated pin grid array with integral heatsink
    Patent number: 5179039
    Abstract: A method of making a resin encapsulated pin grid array includes an IC chip mounted on a resin substrate having a plurality of contact pins on its lower surface and resin-encapsulated by injection molding. A metal heat radiating member is integrally formed on the upper surface of the encapsulating resin when the encapsulating resin is injection-molded.
    Type: Grant
    Filed: May 15, 1991
    Date of Patent: January 12, 1993
    Assignee: Citizen Watch Co., Ltd.
    Inventors: Yoshihiro Ishida, Katsuji Komatsu, Seiichi Mimura, Kikuo Takenouchi, Isao Yabe, Shingo Ichikawa, Yoshihiro Shimada
  • Method of making a resin encapsulated pin grid array with integral heatsink
    Patent number: 5108955
    Abstract: A method of making a resin encapsulated pin grid array which includes an IC chip mounted on a resin substrate having a plurality of contact pins on its lower surface and resin-encapsulated by injection molding. A metal heat radiating member is integrally formed on the upper surface of the encapsulating resin when the encapsulating resin is injection-molded.
    Type: Grant
    Filed: February 6, 1991
    Date of Patent: April 28, 1992
    Assignee: Citizen Watch Co., Ltd.
    Inventors: Yoshihiro Ishida, Katsuji Komatsu, Seiichi Mimura, Kikuo Takenouchi, Isao Yabe, Shingo Ichikawa, Yoshihiro Shimada