Patents by Inventor Kikuo Wada

Kikuo Wada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8120921
    Abstract: A device having electronic components mounted therein has a first electronic component having an external terminal on a first surface and a heat spreader on a second surface, at least one second electronic component that is placed in the direction of a second surface of the first electronic component, a flexible circuit board that is electrically connected to the first electronic component and at least one second electronic component, and at least the part to which at least one second electronic component is connected is located on the second surface side of the first electronic component, and a spacer that is located between at least part of the flexible circuit board and the second surface of the first electronic component. The spacer can prevent heat from the first electronic component from being directly transferred to the second electronic component.
    Type: Grant
    Filed: July 18, 2008
    Date of Patent: February 21, 2012
    Assignees: NEC Corporation, NEC Access Technica, Ltd.
    Inventors: Takao Yamazaki, Shinji Watanabe, Tomoo Murakami, Yuuki Fujimura, Ryoji Osu, Katsuhiko Suzuki, Shizuaki Masuda, Nobuyuki Sato, Kikuo Wada
  • Publication number: 20100188821
    Abstract: A device having electronic components mounted therein has a first electronic component having an external terminal on a first surface and a heat spreader on a second surface, at least one second electronic component that is placed in the direction of a second surface of the first electronic component, a flexible circuit board that is electrically connected to the first electronic component and at least one second electronic component, and at least the part to which at least one second electronic component is connected is located on the second surface side of the first electronic component, and a spacer that is located between at least part of the flexible circuit board and the second surface of the first electronic component. The spacer can prevent heat from the first electronic component from being directly transferred to the second electronic component.
    Type: Application
    Filed: July 18, 2008
    Publication date: July 29, 2010
    Applicants: NEC CORPORATION, NEC ACCESSTECHNICA, LTD.
    Inventors: Takao Yamazaki, Shinji Watanabe, Tomoo Murakami, Yuuki Fujimura, Ryoji Osu, Katsuhiko Suzuki, Shizuaki Masuda, Nobuyuki Sato, Kikuo Wada
  • Patent number: 4848591
    Abstract: When a commodity package fed out from a commodity column accommodating a plurality of commodity packages has been accommodated in a package holder of a transporter, the transporter is moved along a guide to transport the commodity package to a position above a heater and is allowed to fall into a receptacle of the heater by the operation of a dropping mechanism. When the commodity in the package has been heated by the heater, the commodity package in the receptacle is fed out up to an opening of the discharging chute and allowed to fall.
    Type: Grant
    Filed: October 14, 1987
    Date of Patent: July 18, 1989
    Assignee: Daito Manufacturing Co., Ltd.
    Inventor: Kikuo Wada
  • Patent number: 4783582
    Abstract: A heating apparatus for use in an automatic vending machine includes a heating room having an upper opening, a magnetron disposed within the heating room for generating high-frequency waves, a support shaft penetrating the bottom wall of the heating room, a receptacle connected to the upper end of the support shaft for receiving a commodity package, and a raising/lowering mechanism connected to the lower end of the support shaft for rotating and vertically moving the support shaft. The support shaft is raised by the raising/lowering and rotating mechanism to project the receptacle out of the heating room from the upper opening. Upon receipt of a commodity package, the receptacle is lowered into the heating room, and then the package is irradiated with high-frequency waves to cook the commodity therein. Upon completion of the cooking, the receptacle is again raised, and the commodity package is discharged out of the heater apparatus.
    Type: Grant
    Filed: October 14, 1987
    Date of Patent: November 8, 1988
    Assignees: Daito Manufacturing Co., Ltd., Matsushita Electric Industrial Co., Ltd.
    Inventors: Kikuo Wada, Toyosi Maeda