Abstract: A backlight unit and an image display module are provided. The backlight unit includes a micro-lens unit, and a light source unit, wherein the direction in which the plurality of lenses are arranged is at an oblique angle relative to the direction in which the plurality of light sources are arranged. Accordingly, uniform brightness is provided to a display apparatus.

Abstract: Provided are a semiconductor package and a method of forming a wire loop of the semiconductor package. The semiconductor package includes: at least one semiconductor chip; a lead frame including a plurality of leads; and a plurality of wire loops, the wire loops connecting an electrode pad of the semiconductor chip to the leads. Wire loops include: a ball connected to the electrode pad; a pressed part formed on an upper surface of the ball by pressing the wire to overlap two parts of the wire; a first wire part extending substantially horizontally from the pressed part and including at least a portion contacting an upper surface of the semiconductor chip; a second wire part extending at a downward incline from the first wire part; and a third wire part extending from the second wire part and including an end connected to one of the leads.