Abstract: Disclosed herein is a polyimide film that is obtained by imidizing a polyamic acid solution containing two or more dianhydride components selected from the group consisting of 3,3?,4,4?-benzophenonetetracarboxylic dianhydride (BTDA), 3,3?,4,4?-biphenyltetracarboxylic dianhydride (BPDA), and pyromellitic dianhydride (PMDA), and a diamine component including m-tolidine and p-phenylenediamine (PPD) and has a glass transition temperature (Tg) of 320° C. or higher, a moisture absorption rate of 0.4% or less, and a dielectric dissipation factor (Df) of 0.004 or less.

Abstract: The present disclosure provides a multilayer polyimide film in which the core layer is made of a non-thermoplastic polyimide resin comprising one or more imidization catalysts and one or more dehydrating agents, and the skin layer laminated on one or both surfaces of the core layer contains one or more imidization catalysts, but does not contain a dehydrating agent, and a method for manufacturing the same.

Abstract: The present invention provides: a polyimide composite powder which includes 1-30 wt % of a fluorine-based resin filler, and has excellent low dielectric properties; and a production method using water as a dispersion medium. Also provided are a molded body including the polyimide composite powder, and a method for producing same.

Abstract: Disclosed herein are a highly thick polyimide film that contains a reduced number of bubbles therein and exhibits high elasticity and high heat resistance, and a manufacturing method therefor. The polyimide film is obtained by imidizing a poly(amic acid) solution containing an acid dianhydride component including 3,3?,4,4?-benzophenonetetracarboxylic dianhydride (BTDA), 3,3?,4,4?-biphenyltetracarboxylic dianhydride (BPDA), and pyromellitic dianhydride (PMDA), and a diamine component including 4,4?-oxydianiline (ODA), para-phenylenediamine (p-phenylenediamine, PPD), and 3,5-diaminobenzoic acid (DABA), and contains a phosphorus (P)-based compound.

Abstract: Disclosed herein is a polyimide film that is obtained by imidizing a polyamic acid solution containing two or more dianhydride components selected from the group consisting of 3,3?,4,4?-benzophenonetetracarboxylic dianhydride (BTDA), 3,3?,4,4?-biphenyltetracarboxylic dianhydride (BPDA), and pyromellitic dianhydride (PMDA), and a diamine component including m-tolidine and p-phenylenediamine (PPD) and has a glass transition temperature (Tg) of 320° C. or higher, a moisture absorption rate of 0.4% or less, and a dielectric dissipation factor (Df) of 0.004 or less.

Abstract: Disclosed herein is provided a method for manufacturing a polyimide film, the method comprising the steps of: preparing a polyamic acid solution; preparing a polyamic add composition by adding 2-3 mole equivalents of a dehydrating agent to the polyamic acid solution; and applying the polyamic acid to a support to form a film, followed by thermosetting the film in a heater.

Abstract: The present disclosure provides a multilayer polyimide film in which the core layer is made of a non-thermoplastic polyimide resin comprising one or more imidization catalysts and one or more dehydrating agents, and the skin layer laminated on one or both surfaces of the core layer contains one or more imidization catalysts, but does not contain a dehydrating agent, and a method for manufacturing the same.

Abstract: The present invention relates to an ultra-thin black polyimide film and a method for preparing the same. The ultra-thin black polyimide film according to the present invention has a thickness of 8 ?m or less, and has not only an excellent gloss and a low light transmittance in the range of visible light, but also an excellent dimensional stability so as to be effectively used in products such as slim devices, coverlays, insulating films, or semiconductor devices, which need to have a good mechanical or thermal properties.

Abstract: The present invention relates to an ultra-thin black polyimide film and a method for preparing the same. The ultra-thin black polyimide film according to the present invention has a thickness of 8 ?m or less, and has not only an excellent gloss and a low light transmittance in the range of visible light, but also an excellent dimensional stability so as to be effectively used in products such as slim devices, coverlays, insulating films, or semiconductor devices, which need to have a good mechanical or thermal properties.