Abstract: Various embodiments may relate to an optoelectronic component. The optoelectronic component may include a planar optically active structure and an electric circuit structure. The planar optically active structure is designed to receive and/or provide electromagnetic radiation. The electric circuit structure is designed such that it provides an output value. The output value is dependent on at least one operational parameter of the optically active structure.

Abstract: An organic light-emitting diode includes a substrate with a top; an organic layer on the top that generates radiation; first and second electrical contact area at or on the top that electrically contacts the diode; a holding device by which the diode is mechanically supported and electrically contacted; and a cover sheet on a side of the organic layer remote from the substrate that protects the organic layer, wherein at least one opening is in the cover sheet and the opening, in plan view, is surrounded by the cover sheet and the organic layer; the areas are located at an edge of the opening and freely accessible; the device engages through the opening; the first area has a different average distance from the opening than the second area; and the electrical areas are each arranged concentrically around the opening and partially or completely surround the opening in plan view.

Abstract: A method can be used for operating an organic light-emitting component. The organic light-emitting component has a first electrode and a second electrode, between which an organic functional layer stack with at least one organic light-emitting layer is arranged. The first and second electrodes and the organic functional layer stack have a large area. Electrical contact is made with the first electrode via at least two electrical connection elements in the peripheral regions, in which different electric voltages are applied to the at least two electrical connection elements and the different electric voltages vary over time. A lighting device for implementing the method is also specified.

Abstract: Various embodiments may relate to an optoelectronic component, including an optically active region formed for taking up and/or for providing electromagnetic radiation, at least one first contact structure, wherein the optically active region is electrically conductively coupled to the first contact structure, and an encapsulation structure with a second contact structure, wherein the encapsulation structure is formed on or above the optically active region and the first contact structure, and an electrically conductive structure formed for electrically conductively connecting the first contact structure to the second contact structure, wherein the encapsulation structure is at least partly formed by an electrically insulating molding compound, wherein the electrically insulating molding compound at least partly surrounds the electrically conductive structure.

Abstract: An illuminant may include at least one light-emitting element unit, which has a carrier, at least one light-emitting element arranged on the carrier and is surrounded by an encapsulating material, at least one contact area formed on the carrier, and at least one contact element arranged on the contact area, wherein the light-emitting element surrounded by the encapsulating material is electrically connected to the contact element via the contact area, and at least one mating contact element, wherein electrical contact can be made between the mating contact element and the contact element via a plug-type connection, wherein the contact element is a female connector element, and the mating contact element is a male connector element and having a plurality of pin contact elements, or the contact element is a male connector element and having a plurality of pin contact elements, and the mating contact element is a female connector element.

Abstract: In at least one embodiment, a light panel system includes a system carrier with a carrier front face. Multiple organic light emitting diodes are arranged in a uniform grid on the carrier front face. An electronics driver is fitted to or in the system carrier. The light panel system can be handled and mounted as a single unit.

Abstract: Various embodiments may relate to an optoelectronic component apparatus, including a carrier, an optoelectronic component and a thermoelectric component on or above the carrier. The optoelectronic component has a planar, optically active region. The thermoelectric component has at least one thermoelectrically sensitive section, wherein the thermoelectrically sensitive section has a first electrical conductivity at a first temperature and a second electrical conductivity at a second temperature, and wherein the thermoelectrically sensitive section is thermally connected to the optoelectronic component in a planar fashion. The thermoelectric component is formed as a temperature sensor and/or thermogenerator.