Abstract: A cluster tool may be operated on the basis of an enhanced sequencing regime in which the supply of substrates is controlled such that a planned time of maintenance is reached for two or more process chambers simultaneously. Consequently, the occurrence of non-correlated sequential down times of various process chambers may be significantly reduced, thereby enhancing throughput and availability of complex cluster tools.

Abstract: The throughput of complex cluster tools of a semiconductor manufacturing environment may be determined for a desired manufacturing scenario on the basis of automatically generated throughput models. The throughput models may be established on the basis of rule messages with high statistical relevance.

Abstract: The throughput of complex cluster tools of a semiconductor manufacturing environment may be determined for a desired manufacturing scenario on the basis of automatically generated throughput models. The throughput models may be established on the basis of rule messages with high statistical relevance.

Abstract: By providing a look-ahead functionality for a tool internal substrate handling system of process tools on the basis of a process history, the tool internal substrate sequencing may be significantly enhanced. The look-ahead functionality enables a prediction of process time of substrates currently being processed in a respective process module, thereby enabling the initiation of transport activity for substrate load operations in order to significantly reduce the overall idle time of process modules occurring during substrate exchange.

Abstract: A cluster tool may be operated on the basis of an enhanced sequencing regime in which the supply of substrates is controlled such that a planned time of maintenance is reached for two or more process chambers simultaneously. Consequently, the occurrence of non-correlated sequential down times of various process chambers may be significantly reduced, thereby enhancing throughput and availability of complex cluster tools.

Abstract: The throughput of complex cluster tools of a semiconductor manufacturing environment may be determined for a desired manufacturing scenario on the basis of automatically generated throughput models. The throughput models may be established on the basis of rule messages with high statistical relevance.

Abstract: By enabling an interleaved mode when supplying substrates from a plurality of load ports to a respective process module, a reduction of non-productive time of the process tool and/or a reduction of cycle time may be achieved compared to a conventional sequential processing of carriers. Upon arrival at a load port of the process tool, an appropriate priority may be assigned to the carrier, wherein a higher priority may enable the interruption of the processing of a lower-ranked substrate carrier.

Abstract: By dynamically adapting the transport sequencing rules of a cluster tool, the overall performance of the tool may be increased. In some illustrative embodiments, the transport sequencing rule for a robot handler may be dynamically changed when a lot of small size is present in one of the load ports in order to increase the window of opportunity for carrier exchange of a standard lot size currently processed. Consequently, by reducing the overall process time for the currently processed lot while delaying the completion of the small lot, the currently processed carrier may be exchanged earlier, thereby reducing the overall cycle time of the currently processed lot and/or providing a next lot earlier to the tool.

Abstract: By providing a look-ahead functionality for a tool internal substrate handling system of process tools on the basis of a process history, the tool internal substrate sequencing may be significantly enhanced. The look-ahead functionality enables a prediction of process time of substrates currently being processed in a respective process module, thereby enabling the initiation of transport activity for substrate load operations in order to significantly reduce the overall idle time of process modules occurring during substrate exchange.

Abstract: By determining a metric for tool utilization in a manufacturing environment on the basis of tool-specific characteristics and a probability distribution for the transport capability of an automated material handling system, the influence of the transport system on the tool performance may be effectively determined. For this purpose, an average delay caused by the automated material handling system may be iteratively calculated on the basis of a respective required carrier exchange time, which depends on tool- and process-specific characteristics. From the corresponding average delay, an appropriate metric, such as a utilization loss factor, may be determined.

Abstract: By enabling an interleaved mode when supplying substrates from a system-internal buffer area to a respective process area, a reduction of non-productive time of the process tool and/or a reduction of cycle time may be achieved compared to a conventional sequential processing of carriers. Upon arrival at a substrate buffer area of the process tool, an appropriate priority may be assigned to the substrates, wherein a higher priority may enable the interruption of the processing of a lower-ranked substrate group.

Abstract: By dynamically adapting the transport sequencing rules of a cluster tool, the overall performance of the tool may be increased. In some illustrative embodiments, the transport sequencing rule for a robot handler may be dynamically changed when a lot of small size is present in one of the load ports in order to increase the window of opportunity for carrier exchange of a standard lot size currently processed. Consequently, by reducing the overall process time for the currently processed lot while delaying the completion of the small lot, the currently processed carrier may be exchanged earlier, thereby reducing the overall cycle time of the currently processed lot and/or providing a next lot earlier to the tool.

Abstract: By enabling an interleaved mode when supplying substrates from a plurality of load ports to a respective process module, a reduction of non-productive time of the process tool and/or a reduction of cycle time may be achieved compared to a conventional sequential processing of carriers. Upon arrival at a load port of the process tool, an appropriate priority may be assigned to the carrier, wherein a higher priority may enable the interruption of the processing of a lower-ranked substrate carrier.

Abstract: By determining a metric for tool utilization in a manufacturing environment on the basis of tool-specific characteristics and a probability distribution for the transport capability of an automated material handling system, the influence of the transport system on the tool performance may be effectively determined. For this purpose, an average delay caused by the automated material handling system may be iteratively calculated on the basis of a respective required carrier exchange time, which depends on tool- and process-specific characteristics. From the corresponding average delay, an appropriate metric, such as a utilization loss factor, may be determined.