Patents by Inventor Kill Lee

Kill Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Slurry composition for secondary polishing of silicon wafer
    Publication number: 20060242912
    Abstract: Disclosed is a slurry composition for secondary polishing of silicon wafers comprising: 2˜10 weight % of colloidal silica having an average particle size of 30˜80 nm; 0.5˜1.5 % by weight of ammonia; 0.2˜1 weight % of a hydroxyalkycellulose-based polymer for modifying rheology of the composition; 0.03˜0.5 weight % of a polyoxyethylenealkylamine ether-based nonionic surfactant; 0.01˜1 weight % of a quaternary ammonium base and the balance of deionized water.
    Type: Application
    Filed: July 30, 2003
    Publication date: November 2, 2006
    Inventors: Hyun Roh, Tae Park, Kill Lee, In Lee