Abstract: An interconnecting apparatus (10) is disclosed for use in testing electronic devices. The apparatus (10) includes a housing portion (12, 14) provided with a plurality of apertures extending between oppositely facing first and second surfaces of the housing portion (12, 14) and a plurality of contact elements (16), each contact element (16) being disposed in an aperture. Each contact element (16) is a helical spring formed of electrically conductive material, a first end portion of each spring being located adjacent the first surface of the housing portion (12, 14) and a second opposite end portion of each spring being located adjacent the second surface of the housing portion (12, 14). Each spring is configured so that the diameter of the spring decreases in a direction away from the first end portion.