Abstract: A method for forming a low parasitic capacitance contact to a source-drain structure of a fin field effect transistor device. In some embodiments the method includes etching a long trench down to the source-drain structure, the trench being sufficiently long to extend across all the of source-drain regions of the device. A conductive layer is formed on the source-drain structure, and the trench is filled with a first fill material. A second, narrower trench is opened along a portion of the length of the first trench, and filled with a second fill material. The first fill material may be conductive, and may form the contact. If the first fill material is not conductive, a third trench may be opened, in the portion of the first trench not filled with the second fill material, and filled with a conductive material, to form the contact.