Patents by Inventor Kim Do

Kim Do has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Compositions, coatings and films for tri-layer patterning applications and methods of preparation thereof
    Patent number: 8642246
    Abstract: Compositions for use in tri-layer applications are described herein, wherein the composition has a matrix and includes: a formulated polymer comprising at least one type of silicon-based moiety forming the matrix of the polymer, a plurality of vinyl groups coupled to the matrix of the polymer, and a plurality of phenyl groups coupled to the matrix of the polymer, at least one condensation catalyst, and at least one solvent. Tri-layer structures are also contemplated herein that comprise an organic underlayer (first layer), antireflective compositions and/or films contemplated herein (second layer) and a photoresist material (third layer) that are coupled to one another.
    Type: Grant
    Filed: August 14, 2007
    Date of Patent: February 4, 2014
    Assignee: Honeywell International Inc.
    Inventors: Joseph Kennedy, Songyuan Xie, Kim Do, Sudip Mukhopadhyay
  • Coatings and hard mask compositions for integrated circuit applications methods of production and uses thereof
    Patent number: 8101015
    Abstract: A coating material is described herein that includes at least one inorganic compound, and at least one densifying agent, wherein the densifying agent increases the density of the coating material as compared to the density of the at least one inorganic compound. A method of producing a coating material is described herein that includes: providing at least one inorganic compound, providing at least one densifying agent, combining the at least one inorganic compound with the at least one densifying agent to form the coating material, wherein the densifying agent increases the density of the coating material as compared to the density of the at least one inorganic compound.
    Type: Grant
    Filed: October 5, 2004
    Date of Patent: January 24, 2012
    Assignee: Honeywell International Inc.
    Inventors: Joseph Kennedy, Wei T. Huang, Kim Do, Jason Stuck, Bo Li
  • Compositions, coatings and films for tri-layer patterning applications and methods of preparation thereof
    Publication number: 20080206690
    Abstract: Compositions for use in tri-layer applications are described herein, wherein the composition has a matrix and includes: a formulated polymer comprising at least one type of silicon-based moiety forming the matrix of the polymer, a plurality of vinyl groups coupled to the matrix of the polymer, and a plurality of phenyl groups coupled to the matrix of the polymer, at least one condensation catalyst, and at least one solvent. Tri-layer structures are also contemplated herein that comprise an organic underlayer (first layer), antireflective compositions and/or films contemplated herein (second layer) and a photoresist material (third layer) that are coupled to one another.
    Type: Application
    Filed: August 14, 2007
    Publication date: August 28, 2008
    Inventors: Joseph Kennedy, Songyuan Xie, Kim Do, Sudip Mukhopadhyay
  • Coatings and hard mask compositions for integrated circuit applications methods of production and uses thereof
    Publication number: 20070022909
    Abstract: A coating material is described herein that includes at least one inorganic compound, and at least one densifying agent, wherein the densifying agent increases the density of the coating material as compared to the density of the at least one inorganic compound. A method of producing a coating material is described herein that includes: providing at least one inorganic compound, providing at least one densifying agent, combining the at least one inorganic compound with the at least one densifying agent to form the coating material, wherein the densifying agent increases the density of the coating material as compared to the density of the at least one inorganic compound.
    Type: Application
    Filed: October 5, 2004
    Publication date: February 1, 2007
    Inventors: Joseph Kennedy, Wei Huang, Kim Do, Jason Stuck, Bo Li