Abstract: A substrate processing apparatus includes heat treatment apparatus blocks each comprised of stacked heat treatment apparatuses HP each having temperature adjustment mechanism 70 configured to be able to move a substrate to a heating mechanism and adjust the temperature of the substrate, and includes a cooling liquid supply mechanism 81 that supplies a cooling liquid set for a predetermined temperature to be supplied for each of the heat treatment apparatus blocks HPB, a supply mechanism 99 which branches the cooling liquid supplied from cooling liquid supply mechanism 81 and supplies the cooling liquid to each temperature adjustment mechanism 70 of heating mechanisms in one of the heat treatment apparatus blocks.

Abstract: A utility apparatus supplies a liquid to a substrate processing apparatus having a plurality of blocks of heat treatment apparatus groups. A plurality of supply ports supplies the liquid for each vertical block, horizontal block, or heat treatment apparatus. A plurality of recovery ports collects the liquid supplied to each vertical block, horizontal block, or heat treatment apparatus. Detecting mechanisms are provided respectively in the plurality of recovery ports to detect a temperature of the recovered liquid. A control mechanism controls based on detection information of the detecting mechanisms.

Abstract: A substrate processing apparatus having heat treatment apparatuses for treating a processing target substrate at a predetermined temperature includes: a temperature adjustment mechanism provided in each of the heat treatment apparatuses forming a plurality of heat treatment apparatus blocks for adjusting a temperature of the processing target substrate; a moving mechanism for moving the temperature adjustment mechanism; an exhaust mechanism for exhausting a gas from the heat treatment apparatus; supply ports for supplying a temperature adjustment liquid to temperature adjustment apparatuses; recovery ports for collecting the liquid supplied to the temperature adjustment apparatuses; and a control mechanism for recognizing temperature information of the liquid recovered from recovery ports.

Abstract: A substrate processing apparatus is provided which has a plurality of heat treatment apparatus blocks each comprised of a plurality of stacked heat treatment apparatuses HP each having a temperature adjustment mechanism 70 configured to be able to move a processing target substrate to a heat treatment section and adjust the temperature of the processing target substrate, and includes a cooling liquid supply mechanism 81 that supplies a cooling liquid set for a predetermined temperature to be supplied for each of the heat treatment apparatus blocks HPB, a supply mechanism 99 which branches the cooling liquid supplied from the cooling liquid supply mechanism 81 and supplies the cooling liquid to each temperature adjustment mechanism 70 of a plurality of heat treatment sections HP in one of the heat treatment apparatus blocks, and an exhaust mechanism comprised of at least one exhaust opening, on the side opposite to the temperature adjustment mechanism of the heat treatment section, for forming a flow of a gas

Abstract: A utility apparatus supplies a liquid to a substrate processing apparatus having a plurality of blocks of heat treatment apparatus groups. A plurality of supply ports supplies the liquid for each vertical block, horizontal block, or heat treatment apparatus. A plurality of recovery ports collects the liquid supplied to each vertical block, horizontal block, or heat treatment apparatus. Detecting mechanisms are provided respectively in the plurality of recovery ports to detect a temperature of the recovered liquid. A control mechanism controls based on detection information of the detecting mechanisms.

Abstract: A utility apparatus of a substrate processing apparatus includes an introducing mechanism to introduce a gas to a first space portion inside the utility apparatus, a cooling mechanism that cools the gas introduced to inside the utility apparatus to a predetermined temperature, and a second space portion disposed in a position above the first space portion to introduce the gas from the first space portion via an opening. A heating mechanism is provided in the second space portion to heat the gas introduced to the second space portion to a predetermined temperature. A humidity adjusting mechanism adjusts the humidity of the gas heated by the heating mechanism, and a plurality of supply paths is provided in a position above the second space portion to send the gas collectively to the substrate processing apparatus.