Patents by Inventor Kim Dong Hyun

Kim Dong Hyun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pretreatment solution for providing catalyst for electroless plating, pretreatment method using the solution, and electroless plated film and/or plated object produced by use of the method
    Patent number: 7166152
    Abstract: A pretreatment solution for providing a catalyst for electroless plating and a pretreatment method using the solution are provided. The pretreatment solution comprises a silver colloidal solution containing, as essential components, at least the following components (I), (II) and (III): (I) silver colloidal particles, (II) one or more ions selected from an ion of a metal having an electric potential which can reduce a silver ion to metal silver in the solution and an ion oxidized at the time of reduction of the silver ion, and (III) one or more ions selected from a hydroxycarboxylate ion, a condensed phosphate ion and an amine carboxylate ion, the silver colloidal particles (I) being produced by the ion of the metal (II) having an electric potential which can reduce a silver ion to metal silver. When an object to be plated is pretreated by use of the pretreatment solution, provision of an effective catalyst for electroless plating is achieved.
    Type: Grant
    Filed: August 7, 2003
    Date of Patent: January 23, 2007
    Assignee: Daiwa Fine Chemicals Co., Ltd.
    Inventors: Yoshiaki Okuhama, Keigo Obata, Masakazu Yoshimoto, Kim Dong Hyun, Shingo Kitamura, Seiichiro Nakao, Hidenori Tsuji, Hidemi Nawafune
  • Pretreatment solution for providing catalyst for electroless plating, pretreatment method using the solution, and electroless plated film and/or plated object produced by use of the method
    Publication number: 20040043153
    Abstract: A pretreatment solution for providing a catalyst for electroless plating and a pretreatment method using the solution are provided.
    Type: Application
    Filed: August 7, 2003
    Publication date: March 4, 2004
    Applicant: Daiwa Fine Chemicals Co., Ltd.
    Inventors: Yoshiaki Okuhama, Keigo Obata, Masakazu Yoshimoto, Kim Dong Hyun, Shingo Kitamura, Seiichiro Nakao, Hidenori Tsuji, Hidemi Nawafune