Patents by Inventor Kim Ki Yong

Kim Ki Yong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7575995
    Abstract: There are provided a method of forming a fine metal pattern and a method of forming a metal line using the same. In the method of forming a fine metal pattern, a substrate is prepared where a first interlayer insulating layer is formed. A via plug is formed on the first interlayer insulating layer. A plurality of sidewall buffer patterns are formed on the first interlayer insulating layer having the via plug, wherein the plurality of the sidewall buffer patterns are spaced apart from each other by a predetermined distance. The sidewall layer is deposited on the first interlayer insulating layer and the sidewall buffer patterns. The sidewall layer is etched such that sidewall patterns remains on sidewalls of the sidewall buffer patterns.
    Type: Grant
    Filed: December 29, 2005
    Date of Patent: August 18, 2009
    Assignee: Dongbu Electronics Co., Ltd.
    Inventor: Kim Ki Yong