Abstract: A heat sink arrangement for modular electronic and/or opto-electronic equipment is provided. The equipment module is inserted into an interface and a heat sink is pivotably arranged so as to be brought into contact with the inserted module. The equipment module may have an angled, or partially angled, so as to assist in bringing the module in contact with the heat sink.

Abstract: A fibre optic transceiver in which the optical components, interface, management functionality and management interface are all integrated on a single module, capable of being plugged into and removed from the telecommunication's parent system includes a housing having disposed therein a transmitter and a receiver. The housing further includes a pair of rails disposed on opposite sides of the housing to enable the module to be plugged into a suitably configured board. The module is designed primarily for use in 10Gbit serial optical systems, but is equally applicable for use in WDM applications, as well as at other speeds and wavelength.

Abstract: An electronic module (200) having a configuration (212) for promoting efficient heat dissipation and a circuit board assembly (202, 205, 206) are provided such that when said electronic module (200) is inserted within said circuit board assembly (202, 205, 206) a portion of said electronic module (200) overlaps an EMI shield (205), with said portion of said electronic module (200) having a configuration (212) for promoting efficient heat dissipation and being external of said EMI shield (205).

Abstract: The present invention concerns a fibre optic transceiver in which the optical components, interface, management functionality and management interface are all integrated on a single module capable of being plugged into and removed from the telecommunication's parent system. The optical transceiver module comprises a housing having disposed therein a transmitter and a receiver. The housing further comprises a pair of rails disposed on opposite sides of the housing to enable the module to be plugged into a suitably configured board. The module is designed primarily for use in 10Gbit serial optical systems, but is equally applicable for use in WDM applications, as well as at other speeds and wavelength.