Abstract: Techniques for patient medical care are disclosed. These techniques include identifying a plurality of rules relating to a purchase of a medical item. The techniques further include selecting a first rule, of the plurality of rules, to apply to the purchase, including generating a specificity score for each of the plurality of rules, based on setting one or more bit values in each specificity score using matching criteria between the respective rule and the purchase and comparing the specificity scores for the plurality of rules. The techniques further include facilitating supply of the medical item to a patient based on completing the purchase using the selected first rule.

Abstract: A semiconductor integrated circuit and method for compressing test stimuli to one test output signal during a test mode. The test output signal is driven from one input/output node of the semiconductor integrated circuit to a test station through a load board interface. Buffer circuitry on the semiconductor integrated circuit drive a high impedance to the input/output nodes of the integrated circuit during the test mode. The load board interface allows a single test station to receive test output signals from a plurality of semiconductor integrated circuits of the invention during the test mode, thereby allowing one test station to simultaneously test a plurality of circuits.

Abstract: A semiconductor integrated circuit and method for compressing test stimuli to one test output signal during a test mode. The test output signal is driven from one input/output node of the semiconductor integrated circuit to a test station through a load board interface. Buffer circuitry on the semiconductor integrated circuit drive a high impedance to the input/output nodes of the integrated circuit during the test mode. The load board interface allows a single test station to receive test output signals from a plurality of semiconductor integrated circuits of the invention during the test mode, thereby allowing one test station to simultaneously test a plurality of circuits.

Abstract: A semiconductor integrated circuit and method for compressing test stimuli to one test output signal during a test mode. The test output signal is driven from one input/output node of the semiconductor integrated circuit to a test station through a load board interface. Buffer circuitry on the semiconductor integrated circuit drive a high impedance to the input/output nodes of the integrated circuit during the test mode. The load board interface allows a single test station to receive test output signals from a plurality of semiconductor integrated circuits of the invention during the test mode, thereby allowing one test station to simultaneously test a plurality of circuits.

Abstract: An on-chip test circuit in an integrated circuit memory device includes a test mode terminal and a test data storage circuit having an input coupled to a data terminal of the memory device and an output coupled to a memory-cell array in the memory device. The storage circuit further includes terminals adapted to receive respective read test data and write test data signals. The storage circuit stores bits of data applied on the data terminal when the write test data signal is active. The storage circuit provides on its output the bits of stored data when the read test data signal is active. An error detection circuit includes a first input coupled to the memory-cell array and a second input coupled to the output of the storage circuit. The error detection circuit develops an active error signal on an output when the data on its input is unequal. A test control circuit is coupled to the terminals of the test data storage circuit, and to the test mode terminal.

Abstract: A semiconductor integrated circuit and method for compressing test stimuli to one test output signal during a test mode. The test output signal is driven from one input/output node of the semiconductor integrated circuit to a test station through a load board interface. Buffer circuitry on the semiconductor integrated circuit drive a high impedance to the input/output nodes of the integrated circuit during the test mode. The load board interface allows a single test station to receive test output signals from a plurality of semiconductor integrated circuits of the invention during the test mode, thereby allowing one test station to simultaneously test a plurality of circuits.

Abstract: An on-chip test circuit in an integrated circuit memory device includes a test mode terminal and a test data storage circuit having an input coupled to a data terminal of the memory device and an output coupled to a memory-cell array in the memory device. The storage circuit further includes terminals adapted to receive respective read test data and write test data signals. The storage circuit stores bits of data applied on the data terminal when the write test data signal is active. The storage circuit provides on its output the bits of stored data when the read test data signal is active. An error detection circuit includes a first input coupled to the memory-cell array and a second input coupled to the output of the storage circuit. The error detection circuit develops and active error signal on an output when the data on its input is unequal. A test control circuit is coupled to the terminals of the test data storage circuit, and to the test mode terminal.

Abstract: An on-chip test circuit in an integrated circuit memory device includes a test mode terminal and a test data storage circuit having an input coupled to a data terminal of the memory device and an output coupled to a memory-cell array in the memory device. The storage circuit further includes terminals adapted to receive respective read test data and write test data signals. The storage circuit stores bits of data applied on the data terminal when the write test data signal is active. The storage circuit provides on its output the bits of stored data when the read test data signal is active. An error detection circuit includes a first input coupled to the memory-cell array and a second input coupled to the output of the storage circuit. The error detection circuit develops an active error signal on an output when the data on its input is unequal. A test control circuit is coupled to the terminals of the test data storage circuit, and to the test mode terminal.

Abstract: A memory device includes an output data path that transfers data from an I/O circuit coupled to a memory array to an output tri-state buffer. A comparing circuit compares data from the I/O circuit to a desired data pattern. If the data does not match the desired pattern, the comparing circuit outputs an error signal that is input to the output buffer. When the output buffer receives the error signal, the output buffer is disabled and outputs a tri-state condition on a data bus. Since the error signal corresponds to more than one data bit, the tri-state condition of the output buffer is held for more than one tick of the data clock, rather than only a single tick. Consequently, the tri-state condition remains on the bus for sufficiently long that a test system can detect the tri-state condition even at very high clock frequencies.

Abstract: A semiconductor integrated circuit and method for compressing test stimuli to one test output signal during a test mode. The test output signal is driven from one input/output node of the semiconductor integrated circuit to a test station through a load board interface. Buffer circuitry on the semiconductor integrated circuit drive a high impedance to the input/output nodes of the integrated circuit during the test mode. The load board interface allows a single test station to receive test output signals from a plurality of semiconductor integrated circuits of the invention during the test mode, thereby allowing one test station to simultaneously test a plurality of circuits.

Abstract: An antifuse bank includes a bank of self-decoupling anti fuse circuits. The anti fuse circuits are programmed according to a pattern of address bits by blowing antifuses corresponding to bits of the address. The antifuses are blown by applying a high voltage across the antifuse. As each antifuse is blown, its resistance drops and current through the antifuse increases. The self-decoupling circuit detects the increased current flow and, when the anti fuse resistance is sufficiently low, limits current flow through the anti fuse. The antifuse thus does not load the high voltage source as other antifuses are blown.

Abstract: An antifuse bank includes a bank of self-decoupling antifuse circuits. The antifuse circuits are programmed according to a pattern of address bits by blowing antifuses corresponding to bits of the address. The antifuses are blown by applying a high voltage across the antifuse. As each antifuse is blown, its resistance drops and current through the antifuse increases. The self-decoupling circuit detects the increased current flow and, when the antifuse resistance is sufficiently low, limits current flow through the antifuse. The antifuse thus does not load the high voltage source as other antifuses are blown.