Abstract: The systems and methods described herein relate to a bi-directional data path (DQ) symbol map generated based on error correction operations. A device may include sub-wordline drivers and bi-directional data paths (DQs) that couple between the sub-wordline drivers and input/output (I/O) interface circuitry based on assignments indicated by the DQ symbol map. The assignments may be generated based on error correction operations performed on data of the memory bank. In particular, the DQ symbol map may be generated to avoid some conditions that, if occurring, may render one or more data errors uncorrectable. These systems and methods may reduce a likelihood of a data error associated with a DQ being uncorrectable.

Abstract: The systems and methods described herein relate to a bi-directional data path (DQ) symbol map generated based on error correction operations. A device may include sub-wordline drivers and bi-directional data paths (DQs) that couple between the sub-wordline drivers and input/output (I/O) interface circuitry based on assignments indicated by the DQ symbol map. The assignments may be generated based on error correction operations performed on data of the memory bank. In particular, the DQ symbol map may be generated to avoid some conditions that, if occurring, may render one or more data errors uncorrectable. These systems and methods may reduce a likelihood of a data error associated with a DQ being uncorrectable.

Abstract: A ceramic green wavelength conversion element (120) is coated with a red wavelength conversion material (330) and placed above a blue light emitting element (110) such that the ceramic element (120) is attached to the light emitting element (110), thereby providing an efficient thermal coupling from the red and green converters (330, 120) to the light emitting element (110) and its associated heat sink. To protect the red converter coating (330) from the effects of subsequent processes, a sacrificial clear coating (340) is created above the red converter element (330). This clear coating (340) may be provided as a discrete layer of clear material, or it may be produced by allowing the red converters to settle to the bottom of its suspension material, thereby forming a converter-free upper layer that can be subjected to the subsequent fabrication processes.

Abstract: A semiconductor memory emphasizing manipulated clocking and buffering to increase operating speeds.